Atomica launches MEMS Optical Control Platform to enable the next generation of optical and sensing systems. Atomica Corp. Sep 22, 2026, 10:00 ET Atomica's new MEMS Optical Control Platform combines established microfabrication modules with custom design flexibility to help customers bring optical and sensing products to market. It addresses a shared need for precise control of light across AI infrastructure, optical communications, LiDAR, medical imaging, sensing, AR/VR, robotics, and defense. SANTA BARBARA, Calif., Sept. 22, 2026 /PRNewswire-PRWeb/ - Atomica, a U.S.-based microfabrication foundry, today announced the launch of its MEMS Optical Control Platform, giving customers a configurable foundation for developing and manufacturing integrated optical devices. A new optical device often requires two development efforts: designing the product and establishing how to manufacture it. Atomica reduces the second burden through reusable process modules, allowing customers to concentrate on the geometry, optical features, and materials that determine their device's performance. "Our customers are developing products with very different requirements," said Eldon Klaassen, CEO of Atomica. "They need the freedom to pursue those designs without taking on every fabrication challenge as a new engineering problem." The demands vary by product. An optical switch in AI infrastructure may need to redirect light between data paths, while a LiDAR device scans a scene and an imaging system adjusts focus. What these designs share is a dependence on controlled physical motion or alignment. The platform supports that common need without forcing different products into the same device design. Customers can draw from six module families: micromirrors, comb-drive actuation, diaphragms and tunable membranes, microlenses, silicon optical benches, and wafer-level packaging. These can be used individually or combined, with custom features added where the application requires them. Integration is central to the platform. A mirror's coating can affect its shape, and its package can affect alignment. Atomica evaluates these interactions alongside process compatibility and test requirements, helping resolve issues early and reduce the risk of costly redesigns later. "Many companies can demonstrate optical innovation in the lab. The harder question is whether those systems can be aligned, packaged, tested, cooled, and manufactured repeatably," Klaassen said. "That is the gap Atomica is built to help close." Atomica supports projects from concept and feasibility through engineering samples, qualification, and production. The platform also complements its AI Optical Connectivity, AI Optical Source, AI Photonic Integration, AI Thermal Microstructures, and Physical AI Sensor platforms, allowing customers to draw on capabilities across these offerings. Atomica's MEMS Optical Control Platform positions the company as a microfabrication partner for customers building the optical and sensing components of the future: systems that direct light, move data, perceive the environment, and enable intelligent machines to interact with the world. About Atomica Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica delivers rapid prototyping and scalable production to customers developing AI optical connectivity, AI optical source integration, AI photonic integration, AI thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices. Atomica operates a 30,000-square-foot Class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. Capabilities include photolithography, deposition, dry etch, wet etch, bonding, plating, metrology, testing, dicing, and planarization. Atomica leverages engineering collaboration, process standardization, modeling and simulation, AI-assisted optimization, and proprietary fab technology to achieve customer objectives. Media Contact Stephen Bohn, Atomica Corp., 1 805-696-6181, [email protected], atomica.com SOURCE Atomica Corp.

Atomica launches Physical AI Sensor Platform to meet a new wave of sensor demand. Atomica Corp. Sep 08, 2026, 10:00 ET As AI moves into robotics, autonomous systems, industrial equipment, medical devices, defense applications, and edge systems, demand is expanding for the sensors that connect digital intelligence to the physical world. Atomica's new Physical AI Sensor Platform brings together MEMS, microfluidic, optical, packaging, interconnect, and functional-layer capabilities to help customers turn new sensor concepts into manufacturable devices. SANTA BARBARA, Calif., Sept. 8, 2026 /PRNewswire-PRWeb/ - Atomica, a U.S.-based microfabrication foundry, today announced the launch of its Physical AI Sensor Platform for customers developing sensors for robotics, autonomy, industrial automation, medical systems, defense applications, smart infrastructure, and edge intelligence. Artificial intelligence is moving beyond software and centralized compute into robots, drones, vehicles, industrial equipment, medical devices, and other intelligent systems. These systems increasingly depend on accurate information about motion, force, pressure, vibration, gases, magnetic fields, light, depth, flow, and surrounding conditions, creating demand for more sensing capability across a wider range of products and environments. "AI models may provide the reasoning layer, but sensors provide the real-world data layer," said Eldon Klaassen, CEO of Atomica. "As AI becomes embedded in more physical systems, the need for compact, reliable, integrated sensors will grow with it. The opportunity is not just to invent new sensing technologies, but to make them manufacturable at the scale these markets will require." The challenge becomes harder as products move beyond laboratory demonstrations. Sensors must be fabricated repeatably, integrated, qualified, and produced cost-effectively. Atomica's platform is designed to address those requirements earlier in development. The platform spans five major sensor families: motion and inertial; pressure, force and acoustic; environmental and chemical; magnetic and position; and optical and spectral sensing. Devices can include accelerometers, gyroscopes, pressure and flow sensors, microphones, gas and chemical sensors, magnetic and position sensors, microlenses, micromirrors, spectral sensors, and LiDAR-related structures. What connects these devices is not a single process flow, but recurring microfabrication needs. Pressure sensors, microphones, flow sensors, and microfluidic valves may rely on diaphragm structures. Accelerometers, gyroscopes, resonators, and optical scanners may use released MEMS structures and controlled mechanical motion. Gas sensors, biosensors, and environmental sensors may require membranes, heaters, electrodes, and functional materials. Optical devices may incorporate microlenses, micromirrors, optical benches, and wafer-level packaging, while compact sensor modules may also require TSVs, TGVs, interposers, and other package structures. A platform approach allows these elements to be reused, modified, and combined where appropriate. This reduces reinvention while preserving room for customer-specific innovation in sensing materials, device geometry, functional layers, optical features, electronics interfaces, and packaging. "Physical AI will not be built around one sensor," Klaassen said. "Different applications will need different combinations of motion, pressure, chemical, magnetic, optical, and other sensing functions. Atomica's role is to provide the microfabrication foundation that allows customers to turn those ideas into manufacturable devices." The platform draws on Atomica's capabilities including deep silicon etching, thin-film deposition, membrane and cavity formation, wafer bonding, metallization, optical coatings, microfluidics, through-wafer interconnects, interposers, and wafer-level packaging. Different devices use different combinations of these capabilities, allowing customers to build on established process knowledge rather than starting from zero. This becomes increasingly important as products combine multiple forms of sensing. A robot may use inertial, force, position, and optical inputs. A drone may combine motion, pressure, magnetic, optical, and environmental sensing. Industrial systems may monitor vibration, gas, flow, pressure, and optical signals, while medical devices may integrate pressure sensing, microfluidics, sampling, and optical detection. Integration into the larger product is also critical. Sensors may require vias, redistribution layers, optical windows, fluidic ports, cavities, seals, interposers, and wafer-level packaging to connect the sensing element with readout electronics, local processing, and system control. These interfaces can determine whether a device that works in the lab can perform reliably in a commercial product. Customers can begin with a sensing concept, material, device architecture, or proof of principle and progress through feasibility structures, engineering samples, prototype hardware, qualification, pilot production, and scalable manufacturing. By reusing established process knowledge where appropriate, Atomica can help customers focus more of their development effort on what differentiates their product. The Physical AI Sensor Platform extends Atomica's broader AI strategy. Existing platforms address optical connectivity, optical sources, photonic integration, and thermal management. The sensor platform adds the devices that allow systems operating in the physical world to collect information from their surroundings. A new eBook describing the Physical AI Sensor Platform is available at https://atomica.com/physical-ai-sensor-platform/. About Atomica Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica delivers rapid prototyping and scalable production to customers developing AI optical connectivity, AI optical source integration, AI photonic integration, AI thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices. Atomica operates a 30,000-square-foot Class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. Capabilities include photolithography, deposition, dry etch, wet etch, bonding, plating, metrology, testing, dicing, and planarization. Atomica leverages engineering collaboration, process standardization, modeling and simulation, AI-assisted optimization, and proprietary fab technology to achieve customer objectives. Media Contact Stephen Bohn, Atomica Corp., 1 805-696-6181, [email protected], atomica.com SOURCE Atomica Corp.

Atomica launches AI Thermal Microstructures Platform to address the heat bottleneck in AI infrastructure. Atomica Corp. Aug 25, 2026, 10:00 ET Heat has become the physical limit AI hardware keeps running into, as conventional cooling struggles to keep pace with heat concentrated in denser and more complex packages. Atomica's new AI Thermal Microstructures Platform addresses that challenge as the fourth part of a broader AI infrastructure strategy focused on moving data, delivering optical power, integrating complex systems, and managing heat closer to where it is generated. SANTA BARBARA, Calif., Aug. 25, 2026 /PRNewswire-PRWeb/ - Atomica, a U.S.-based microfabrication foundry, today announced the launch of its AI Thermal Microstructures Platform for customers developing thermal-management structures for high-density AI compute, advanced packaging, photonic systems, and other next-generation hardware. The platform follows Atomica's AI Optical Connectivity, AI Optical Source, and AI Photonic Integration Platforms. Every generation of AI compute produces more heat in less space, intensifying thermal challenges inside dense packages. Traditional air cooling, heat sinks, cold plates, and data-center cooling remain essential, but localized heat and thermal gradients increasingly require solutions at the package level. "That changes how thermal management has to be designed," said Eldon Klaassen, CEO of Atomica. "The industry has traditionally attacked the problem from the outside with heat sinks, cold plates, and airflow. As packages become denser, more of the thermal solution has to be built into the package itself." Atomica's AI Thermal Microstructures Platform combines microfluidic cooling, thermal pathways, interposers, sensing structures, bonding, and wafer-level packaging. These building blocks can route coolant near hotspots, spread heat, monitor pressure and flow, isolate temperature-sensitive components, and support integrated thermal control within advanced packages. The platform supports applications including liquid-cooled AI accelerator modules, GPU and chiplet packages, high-bandwidth memory integration, photonic interposers, optical engines, co-packaged and near-packaged optics, external laser source systems, rugged edge-AI systems, industrial electronics, defense systems, and high-reliability sensor modules. "The value is not in any one channel, via, interposer, or package feature," Klaassen said. "The harder challenge is combining those structures into a single architecture that can survive testing, qualification, and volume production. That is the integration and manufacturing challenge Atomica is built to solve." Thermal management is also increasingly important in optical integration. As lasers and optical engines move closer to processors and switches, temperature gradients and thermal drift can affect performance and stability. Microfabricated thermal structures can help manage those effects within compact optical systems. Customers can begin with feasibility structures or thermal test vehicles and progress through engineering samples, functional prototypes, qualification lots, and scalable production. A new eBook describing the AI Thermal Microstructures Platform is available at atomica.com/ai-thermal-microstructures-platform/. About Atomica Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica delivers rapid prototyping and scalable production to customers developing AI optical connectivity, AI optical source integration, AI photonic integration, AI thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices. Atomica operates a 30,000-square-foot Class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. Capabilities include photolithography, deposition, dry etch, wet etch, bonding, plating, metrology, testing, dicing, and planarization. Atomica leverages engineering collaboration, process standardization, modeling and simulation, artificial intelligence optimization, and proprietary fab technology to achieve customer objectives. Media Contact SOURCE Atomica Corp.