Atomica launches AI Photonic Integration Platform to address the integration bottleneck in AI infrastructure. Atomica Corp. Aug 11, 2026, 10:00 ET Atomica's AI Photonic Integration Platform addresses a critical bottleneck in AI hardware: integrating optics, electronics, memory, thermal management, and packaging into one manufacturable system. The platform gives customers a configurable microfabrication pathway spanning interposers and vias, bonding, optical alignment, and wafer-level packaging. SANTA BARBARA, Calif., Aug. 11, 2026 /PRNewswire-PRWeb/ - Atomica, a U.S.-based microfabrication foundry, today announced the launch of its AI Photonic Integration Platform, a new microfabrication platform for customers developing photonic and heterogeneous AI hardware that integrates optics, electronics, memory, thermal structures, and package-level interfaces into compact, manufacturable systems. The launch is the third in Atomica's series of AI infrastructure platforms, following its AI Optical Connectivity Platform and AI Optical Source Platform. The three platforms address complementary parts of the AI optical hardware stack: moving and aligning light, generating and managing optical power, and integrating those optical functions with electronics, memory, routing, thermal management, and packaging. AI hardware is increasingly constrained not only by processor performance, but by how effectively different devices can be connected and packaged together. As AI systems scale, bandwidth, interconnect density, signal integrity, thermal management, optical alignment, and package-level integration are becoming critical system challenges. "The next leaps in AI hardware will not come from any single chip," said Eldon Klaassen, CEO of Atomica. "They will come from integration - bringing logic, memory, optics, and thermal management together into a manufacturable system. That is where Atomica is focused." Atomica's AI Photonic Integration Platform brings together microfabrication technologies for silicon and glass interposers, through-silicon and through-glass vias, redistribution layers, wafer-level packaging, bonding, cavities, optical alignment structures, and customer-specific process layers. The platform is designed to support applications including AI accelerators, high-bandwidth memory integration, chiplet packages, data-center switches, optical I/O modules, co-packaged and near-packaged optics, photonic integrated circuit packaging, optical engines, external laser-source packages, advanced sensors, and physical-AI hardware. At the center of the platform is heterogeneous integration. Photonic, electronic, memory, and thermal components may be fabricated on different substrates, use different materials, and have different alignment, stress, thermal, and reliability requirements. The challenge is bringing those elements together without compromising electrical performance, optical performance, or manufacturability. "The challenge is no longer simply whether individual devices perform," Klaassen said. "The challenge is whether optics, electronics, memory, and thermal structures can be integrated with the precision and repeatability required for scalable manufacturing." Rather than offering isolated process capabilities, Atomica's platform provides a configurable development and manufacturing pathway. Customers can combine proven process modules with custom layers to support specific architectures and move from feasibility through prototype, manufacturing readiness, and scalable production. The AI Photonic Integration Platform interfaces naturally with Atomica's AI Optical Connectivity and AI Optical Source Platforms. Those platforms help generate, couple, align, and route light; the AI Photonic Integration Platform provides the substrate and package structures that integrate those optical functions with the rest of the system. A new eBook describing the AI Photonic Integration Platform is available at atomica.com/ai-photonic-integration-platform/. About Atomica Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica delivers rapid prototyping and scalable production to customers developing AI optical connectivity, AI optical source integration, AI photonic integration, AI thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices. Atomica operates a 30,000-square-foot Class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. Capabilities include photolithography, deposition, dry etch, wet etch, bonding, plating, metrology, testing, dicing, and planarization. Atomica leverages engineering collaboration, process standardization, modeling and simulation, AI-assisted optimization, and proprietary fab technology to achieve customer objectives. Media Contact Stephen Bohn, Atomica Corp., 1 805-696-6181, [email protected], atomica.com SOURCE Atomica Corp.

Atomica launches AI Optical Connectivity Platform to address the physical bottleneck in AI infrastructure. Atomica Corp. Jun 30, 2026, 10:00 ET Atomica's AI Optical Connectivity Platform addresses a growing physical bottleneck in AI infrastructure: the need to move more data with greater bandwidth, lower latency, and lower power. The platform helps customers build the microfabricated alignment, packaging, and integration structures required for optical connectivity in next-generation AI systems. SANTA BARBARA, Calif., June 30, 2026 /PRNewswire-PRWeb/ - Atomica, a U.S.-based microfabrication foundry, today announced the launch of its AI Optical Connectivity Platform, a new microfabrication platform for companies building the optical, mechanical, thermal, and packaging structures required to scale next-generation AI infrastructure. The next era of AI will not be unlocked by processors alone. As AI clusters grow larger, denser, and more power-hungry, the industry is running into a physical reality: moving data is becoming as critical as processing data. Electrical interconnect will remain essential, but it is no longer enough on its own. The growth of AI requires higher bandwidth, lower power, shorter electrical paths, tighter integration, better thermal control, and more scalable packaging. That shift is pushing optical connectivity closer to GPUs, accelerators, switches, memory systems, and compute packages. "AI is forcing the hardware industry to rethink the physical layer," said Eldon Klaassen, CEO of Atomica. "The challenge is no longer just processor speed. It is moving data efficiently across thousands of processors without wasting power, space, or thermal budget. Optical connectivity is becoming one of the most important answers, and Atomica is focused on making these systems manufacturable." Atomica's AI Optical Connectivity Platform is designed for this transition. The platform supports precision fiber alignment, silicon optical benches, V-grooves, microlenses, micromirrors, waveguide structures, optical alignment features, wafer-level packaging elements, interposers, TSV and TGV integration structures, optical engine packaging components, and thermal management microstructures. As optics move closer to compute, the challenge becomes more than optical performance alone. Photonic chips, lasers, fiber arrays, and optical engines all depend on a precision integration layer that can align, route, package, protect, cool, and connect optical components inside real hardware. Small variations in placement, thermal drift, package stress, or coupling efficiency can become major system-level constraints when multiplied across thousands of optical channels. Atomica's platform brings together established process capabilities, design modules, materials knowledge, and integration methods that can be adapted to customer-specific optical connectivity architectures. This platform-based approach makes custom microfabrication more repeatable, modular, and scalable, while helping customers reduce process risk, shorten development cycles, and create a clearer path from engineering samples to pilot production and scalable manufacturing. The platform is designed for companies developing optical transceivers, silicon photonics packages, fiber array units, optical engines, external laser source modules, near-packaged optics, co-packaged optics, TFLN-based optical systems, optical MEMS devices, LiDAR systems, photonic sensors, and compact optical systems that require precise alignment and integration. "Many companies can demonstrate optical innovation in the lab," Klaassen added. "The harder question is whether those systems can be aligned, packaged, tested, cooled, and manufactured repeatably. That is the gap Atomica is built to help close." The launch is part of Atomica's broader platform strategy across AI hardware, photonics, sensors, MEMS, and biotechnology microdevices. Atomica's view is that the future of AI hardware will depend not only on faster chips, but on the physical technologies that connect, cool, sense, package, and integrate advanced systems. About Atomica Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica supports customers developing AI optical connectivity, AI optical source integration, AI photonic packaging, AI thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices with rapid prototyping and scalable production. Atomica operates a 30,000-square-foot Class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. Capabilities include photolithography, deposition, dry etch, wet etch, bonding, plating, metrology, testing, dicing, and planarization. Atomica leverages engineering collaboration, process standardization, modeling and simulation, artificial intelligence optimization, and proprietary fab technology to achieve customer objectives. Media Contact SOURCE Atomica Corp.