AvicenaTech Corp., the leader in microLED-based chip-to-chip interconnects, today announced that the company has secured $25M in Series A funding from Samsun...

Avicena ships world's first 1Tbps evaluation kits, extending its leadership in microLED optical interconnects. * 2 hrs ago Avicena, the pioneer in microLED-based optical interconnects, today announced that it has begun shipping 1 Tbps LightBundle(TM) evaluation kits (eKits) to customers and partners developing next-generation AI infrastructure. The shipment milestone follows the introduction and demonstration of the LightBundle eKit in March 2026 at the Optical Fiber Conference (OFC26) and advances the platform from initial evaluation availability to terabit-class operation in customer laboratories. The latest LightBundle eKit incorporates a 335-channel microLED array, with each microLED data channel operating up to 3 Gbps, coupled with an Avicena multicore fiber bundle to a 335-element integrated photodiode array. Together, the channels provide up to 1Tbps of aggregate raw throughput displaying the core advantages of Avicena's laser-free optical architecture: low power, high bandwidth density, robust operation at elevated temperatures, and flexible reach beyond the practical limits of copper interconnects. Anne Hathaway hints at 'story breakthrough' for The Princess Diaries 3 The platform enables hyperscalers, AI accelerator and memory developers, networking companies, and system architects to evaluate terabit-class microLED optical connectivity for both AI scale-in and scale-up applications. Target use cases include die-to-die and die-to-memory links, XPU-to-XPU connectivity, and XPU-to-switch interconnects. A Terabit-Class Platform for AI Connectivity AI systems are driving rapid increases in the bandwidth required between accelerators, memory, and switch fabrics. As link rates rise, copper interconnects face increasing challenges in reach, routing density, and energy efficiency. Conventional optical solutions based on lasers and silicon photonics can extend reach, but have power, bandwidth density, cost, and reliability challenges. Avicena's LightBundle technology replaces lasers with dense microLED transmitter arrays coupled through a multi-core fiber bundle to integrated photodetector arrays. This architecture is designed to deliver high bandwidth density and energy-efficient optical connectivity while operating reliably across demanding system temperatures. The 1 Tbps eKit gives engineering teams a complete platform for evaluating link behavior in their own laboratories. Host interface boards, integrated diagnostics, and a graphical user interface support a set of features, including characterization of optical signal integrity, link budgets, eye quality, crosstalk, power efficiency, and bit error rate performance. "Shipping our 1 Tbps LightBundle(TM) eKits extends Avicena's microLED-based optical interconnect leadership and represents a significant milestone in delivering the terabit-class connectivity required to scale next-generation AI infrastructure," said Marco Chisari, CEO of Avicena. "LightBundle addresses the bandwidth density, power, reliability, reach and cost requirements that are critical for scale-in and scale-up links, such as XPU-to-XPU, XPU-to-memory, XPU-to-CPU and XPU-to-switch connectivity." "Avicena shipments of a 1 Tbps LightBundle(TM) evaluation platform is a meaningful milestone for the optical-interconnect industry and reinforces the company's pioneering leadership in microLED-based connectivity," said Bob Wheeler, Analyst at Large at LightCounting. "Providing AI infrastructure developers with a practical terabit-class platform enables them to evaluate microLED technology for demanding XPU-to-XPU, XPU-to-memory, and XPU-to-switch links. This advances microLED interconnects towards production for next-generation AI scale-in and scale-up architectures." Availability Avicena is now shipping 1 Tbps LightBundle eKits. Organizations interested in evaluating the platform or discussing LightBundle integration may contact Avicena at [email protected]. Recorded Video Demonstration of LightBundle(TM) eKit Achieving 1 Tbps Throughput The following link (https://youtu.be/EwJNvIM3Dbs) provides a recorded video of a live demonstration showcasing LightBundle(TM) eKit achieving 1 Tbps throughput. The demonstration offers a firsthand view of the platform's high-performance capabilities and operation. Contacting Avicena team For questions regarding LightBundle(TM) eKit or other business inquiries, please contact: [email protected]. About Avicena Avicena Tech Corp. is a privately held company headquartered in Sunnyvale, California, pioneering microLED-based optical interconnects for AI infrastructure. Avicena's LightBundle(TM) technology enables low-power optical connectivity with high reliability, scalability, and bandwidth density, helping semiconductor and datacenter innovators build the next generation of AI systems.

[Insight] OFC 2026 - connecting the world. The Optical Fiber Communication Conference and Exposition (OFC) was hosted at the Los Angeles Convention Center from March 17-19, 2026. As the world's largest annual event in optical communications, the OFC not only celebrated its 50th anniversary in 2025 but also attracted interest at OFC 2026 due to the rise of generative AI technology. This year, over 706 industry leaders from 91 countries worldwide convened, along with 115 guest speakers and more than 17,800 attendees. Together, they addressed key global issues, including quantum networking, artificial intelligence (AI), space optics, and data center connectivity, to offer solutions. Topic One: Micro LED CPO ams OSRAM has accumulated nearly 15 years of experience in Micro LED technology through its Micro LED headlight module, EVIYOS. In addition, the company has been actively developing Micro LED solutions for optical communications together with end customers for more than three years. Building on this foundation, ams OSRAM is preparing for the introduction of its own Micro LED-based optical datacom products, targeting a market launch in 2027. These solutions are expected to combine Micro LED emitters, optics, and dedicated ASICs. Microsoft MOSAIC proposed a Micro LED CPO architecture, with MediaTek providing the AOC integration solution. Avicena showcased its LightBundle eKit demo at OFC, achieving a low bit error rate (BER) of <=10[−]9 and a transmission distance of 5 meters at 512 Gbps. Avicena indicated that its 512 Gbps Micro LED optical interconnect is ready for market, and its 896 Gbps solution will be launched in 2Q26. bEMC In response to the optical communication market, bEMC offers 4-inch semi-polar COW and 6-inch semi-polar COC. The company can also provide Micro LED CPO solutions (including coupling) through supply chain integration. Topic Two: Infrared Optical Communications Lumentum has actively ramped up its capacity for 100 / 200 Gbps EMLs and 70 / 100mW CW LDs, while launching new high-bandwidth EML products delivering 400 Gbps/Lane to meet the market demand for 3.2 Tbps connectivity. Meanwhile, the company successfully launched 400mW CW LDs in 2025, followed by the introduction of 800mW CW LDs at OFC. The latter offer >800mW optical power at 50°C, with <100 kHz linewidth and >40 dB side mode suppression ratio (SMSR), significantly improving signal quality in optical communications. In addition, the company has showcased 1,060nm VCSEL optical interconnection solutions. Coherent is ramping 6-inch InP wafer manufacturing to support high-volume production, while developing 400mW CW laser for silicon photonics based pluggable transceivers and co-packaged optics. To meet the emerging market demand for 3.2Tbps connectivity, the company demonstrated two solutions: one for 420Gbps/Lane EMLs and the other for 420Gbps silicon photonics PICs. Moreover, it partnered with three DSP industry leaders, Broadcom, NVIDIA, and Marvell, to develop 1.6Tbps FRO/TRO transceivers. LPO transceivers, in particular, remove the need for DSPs. Despite a higher bit error rate and a limited range of applications, the LPO approach can significantly reduce power consumption and address thermal issues, making it a particularly attractive solution alongside SiPh CPO designs. WIN Semiconductors is the world's largest 150mm GaAs foundry. Standing out from other GaAs suppliers, the company offers turnkey solutions including epi-wafer, chip fabrication, AOI inspection, and coating. WIN Semiconductors has developed Ridge Waveguide (RWG) and Buried Heterostructure (BH) technologies for CW LDs. Compared with RWG, BH delivers higher current density and output power. Comparatively, backside-emitting VCSELs feature flip-chips and etching directly into GaAs substrates, along with the combination of micro bumps and micro lenses to minimize parasitic effects. This approach effectively improves product characterization and enables a smaller package design, making it suitable for 100 Gbps or 100 m optical communications and 3D sensing solutions for automotive or consumer electronics. Dexerials acquired Kyoto Semiconductor and successfully launched 200 Gbps InGaAs photodiodes. These photodiodes feature a low dark current of only 10nA at 2V, a bandwidth of 50 GHz, and a responsivity of 0.7 A/W. Mitsubishi Electric has successfully launched a 100 Gbps uncooled EML and a 200 Gbps cooled EML. 200 Gbps uncooled EML is to be released in the next phase, aiming for short-range transmission around 100 meters. AOI With a portfolio spanning EMLs / CW LDs, photodiodes, and transceivers, the company recently secured a purchase order worth over USD 200 million for 1.6 Tbps transceivers. At the OFC, AOI demonstrated the high stability of its 800 Gbps / 1.6 Tbps transceivers and the testing results obtained from its 6.4 Tbps OBO optical engines. These devices are made with AOI's 400mW LDs and paired with SiPh PICs, achieving highly efficient optical communications using a 32 x 200 Gbps/Lane signaling technology. Optoway Specializing in EML / CW LD chips, package, and transceivers, offers 100 / 200 Gbps EMLs and 70 / 100mW CW LDs, alongside transceiver customization services. LuxNet is dedicated to EML / CW LD chips, package, and transceiver foundry services, and has developed a similar portfolio featuring 100 / 200 Gbps EMLs and 70 / 100mW CW LDs. NTT Innovative Devices showcased its 102.4 Tbps SiPh CPO, which integrates a Broadcom third-generation Ethernet switch, Tomahawk 6, and is compatible with ELSFPs from four suppliers, including CPT, Furukawa, FIT, and O-NET, achieving 102.4 Tbps with 16 units of 16.4 Tbps optical engines. Cisco showcased its 51.2 Tbps SiPh CPO, equipped with 64 units of 800 Gbps FR8 optical engines, a complete liquid cooling solution, and a monitoring system. Its product lifespan meets the requirements of cloud service providers. OFC 2026 Takeaways * Wide and Slow: Driven by the surge of generative AI, demand for high-speed optical communications is accelerating. Micro LEDs boast low power consumption of 1-2 pJ/bit, bandwidth density up to 20 Tbps/mm[2], and a low bit error rate (BER) of <=10[−15], making them well-positioned as a promising alternative to copper interconnects and the go-to solution for short-range, high-speed intra-rack connectivity in scale-up data center networking. In parallel, suppliers including Lumentum and Coherent are launching VCSEL NPO solutions to meet the short-reach transmission demand. * Investment and R&D: To meet the bandwidth requirements beyond 1.6 Tbps, EML and CW LD players are aggressively expanding capacity. In addition, Dexerials is scaling its photodiode production footprint to enhance product performance in terms of sensitivity and response time. * Short Term and Long Term: To address the escalating energy and thermal bottlenecks in data centers, linear pluggable optics (LPO) and SiPh CPO technology have emerged as new market spotlights. TrendForce 2026 Infrared Sensing Application Market and Branding Strategies Release: 01 January 2026 Format: PDF / EXCEL Language: Traditional Chinese / English Page: 168 TrendForce 2025 Micro LED Display and Non-Display Application Market Analysis Release: 29 May / 30 November 2025 Languages: Traditional Chinese / English Format: PDF Page: 119 | If you would like to know more details, please contact: | Global Contact: | / | ShenZhen: | | Grace Li E-mail: [email protected] Tel: +886-2-8978-6488 ext.916 | / | Perry Wang E-mail: [email protected] Tel: +86-755-82838931 ext.6800 Disclaimers of Warranties 1. The website does not warrant the following: 1.1 The services from the website meets your requirement; 1.2 The accuracy, completeness, or timeliness of the service; 1.3 The accuracy, reliability of conclusions drawn from using the service; 1.4 The accuracy, completeness, or timeliness, or security of any information that you download from the website 2. 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