Eliyan targets copper interconnect limits with NuLight chiplet platform. October 14, 2026 Press play to listen to this content SANTA CLARA, Calif., Oct. 14, 2026 - Eliyan, a leader in foundational connectivity products enabling next-generation AI compute, memory, and networking systems, today introduced the Nexus and Oscar NuLight chiplets, the world's first 2D microVCSEL interconnect platform designed to extend AI scale-up connectivity beyond the practical bandwidth and reach limits of copper. The platform includes Nexus, a 1.6T reverse gearbox, and Oscar, an electrical interface chip (EIC) that connects high-speed electrical interfaces to microVCSEL and photodiode optical arrays. Together, they provide scalable building blocks for linking compute resources across large AI systems, providing the enhanced reach, low power, and high reliability that these systems demand. Eliyan CEO and co-founder Ramin unveiled the technology at this week's OCP Summit 2026 with a presentation detailing the technology architecture and products. Addressing the Copper Wall As AI scale-up domains expand across multiple racks, copper connections face increasing constraints in delivering both high bandwidth and longer reach. Eliyan's NuLight platform addresses this "copper wall" with a high-bandwidth, high-density architecture that spreads bandwidth across more optical lanes operating at lower data rates than standard PAM4 SerDes connections. Parallel non-return-to-zero (NRZ) optical signaling simplifies per-lane signal processing, enabling more power-efficient optical links than traditional optical interconnects. The microVCSEL-based architecture targets an initial optical reach of approximately 50 meters, with a design objective of combining optical reach with copper-like reliability, availability, and operating characteristics. "Scaling AI infrastructure requires efficient, reliable connectivity that reaches beyond a single rack," said Ramin Farjadrad, co-founder and CEO of Eliyan. "We have pioneered another breakthrough interconnect technology that we created from the ground up to solve the copper wall in the AI data center. The industry's rapid adoption of our proposed 2D microVCSEL interconnect proves Eliyan is on the right track again. With our NuLight chiplet platform, customers can scale aggregate bandwidth through reusable building blocks. At the same time, on-the-fly lane repair addresses the reliability requirements of large AI scale-up and scale-in networks. This is the next step in expanding our platform across the AI connectivity path." Nexus Bridges High Speed Electrical Interfaces and Parallel Optics Designed in TSMC 3nm, Nexus combines power-efficient, configurable-reach 212G PAM4 SerDes with reverse gearbox functionality and high-speed die-to-die connectivity. Its compact footprint supports tight coupling with optical components. The reverse gearbox distributes each high-speed PAM4 electrical channel across four lower-speed NRZ channels, providing the electrical bridge to slow-and-wide optical arrays while supporting fully retimed implementations. Nexus includes advanced telemetry with forward error correction (FEC) monitoring, termination and regeneration, as well as support for IEEE auto-negotiation and host link training. These capabilities support link diagnostics and management in dense optical systems. Oscar Interfaces with microVCSEL and Photodiode Arrays Oscar complements Nexus with laser-driver and TIA electrical interfaces to vertical-cavity surface-emitting lasers (VCSELs) and photodiode arrays in very dense arrays, with state-of-the-art crosstalk cancellation and heat-management schemes. Optical Lane Repair Supports Reliable AI Connectivity The platform uses patented technology for its on-the-fly repair architecture that uses spare optical lanes to protect active links. If a lane degrades or fails, the architecture redirects traffic to a spare lane without interrupting link operation. Combined with link diagnostics, this capability meets a critical requirement for AI scale-up and scale-in networks, where interconnect failures cause costly downtime and interrupt massive AI processing operations. A Modular Platform from OSFP to Co-Packaged Optics The NuLight platform provides a path to co-packaged optics (CPO), where future versions of Oscar will interface directly with host ASICs using die-to-die connectivity. NuLight's microVCSEL array approach draws on mature, highly available GaAs laser technology and avoids the need for external indium-phosphide lasers in the optical engine. Availability Both Nexus and Oscar chiplets are sampling now. About Eliyan Eliyan Corporation develops advanced connectivity technologies that enable next-generation AI, cloud, and high-performance computing systems. Its portfolio of differentiated interconnect technologies, memory expansion, and chiplet solutions addresses critical bandwidth, power efficiency, and scalability challenges across modern compute infrastructure. Eliyan's technologies enable customers to build higher-performance systems with greater memory capacity, improved power and area efficiency, and most importantly, higher bandwidth at lower cost. For more information, visit www.eliyan.com. Silicon to systems engineering is reshaping HPC for manufacturing As product design becomes more interconnected,... For all the talk about a shortage of AI computing power, and the need for... Most engineers know what an overloaded web service looks like. Latency goes up. Queues start... A new study from Google and MIT finds that AI is accelerating the scientific process,... 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Eliyan receives takeover bid following $1 billion Series C funding. October 9, 2026 Eliyan has attracted a takeover bid after securing $1 billion in Series C funding. This development highlights the growing interest in battery energy storage systems (BESS) as demand surges for long-duration energy solutions. InfraSale's audience should monitor how this bid may impact the competitive landscape in the BESS market. investment battery storage renewables

Chiplet interconnect startup Eliyan valued at $1bn following $145m Series C funding round. Umesh Padval, managing partner of Seligman Ventures, will also join the company's board July 31, 2026 Chiplet interconnect manufacturer Eliyan has raised $145 million in a Series C funding round, valuing the startup at $1 billion. The oversubscribed round was led by Seligman Ventures, with participation from both new and existing investors, including Cisco Investments and Lumentum. In addition to the funding, Umesh Padval, managing partner of Seligman Ventures, will join Eliyan's Board of Directors. In a statement, Eliyan said the financing will support the development of its next-generation interconnect technologies and allow the company to expand its ecosystem partnerships and scale manufacturing. Founded in 2021 by Ramin Farjadrad, the former CTO and VP of networking at Marvell Semiconductor, along with Syrus Ziai, and Patrick Soheili, Eliyan's chiplet interconnect technology speeds up the processing for AI chips, with the company claiming it achieves up to four times the performance and half the power of other solutions. The company's NuLink PHY and NuGear offerings address both die-to-die and die-to-memory interconnect challenges through its Universal Memory Interface (UMI), a bi-directional interconnect method that enables a bandwidth-efficient connection to memory, in both standard organic substrates and advanced packaging. Chiplets are tiny integrated circuits with specialized functions, which can be combined to make larger integrated circuits. They contain multiple smaller dies, instead of one monolithic die. "AI infrastructure is undergoing one of the largest architectural transitions in computing history," said Farjadrad, who is Eliyan's CEO. "As compute, memory, packaging, and networking become increasingly interconnected, traditional approaches to system connectivity are reaching their limits. Eliyan was founded to address these challenges at the architectural level. This financing, together with the support of leading strategic and financial investors, positions us to accelerate product development, customer adoption, and ecosystem expansion as we help enable the next generation of AI infrastructure." More in investment / M&A / financing.