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HyperLight

Photonic integrated circuits for data centers

Overview

HyperLight designs and manufactures photonic integrated circuits (PICs) using a thin film lithium niobate on insulator (TFLN) platform for data centers and telecommunications networks. Its PICs, such as electro-optic modulators, deliver high bandwidth (over 110 GHz) with low drive voltage, low insertion loss, and strong optical power handling. The company differentiates itself through its TFLN platform, focus on low power and high-bandwidth performance, and the ability to customize PICs for specific applications at high volume. Its goal is to enable faster, more reliable data and telecom networks by providing efficient, scalable photonic solutions.

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About HyperLight

Simplify's Rating
Why HyperLight is rated
B-
Rated B on Competitive Edge
Rated B on Growth Potential
Rated C on Differentiation

Industries

HardwareIndustrial & Manufacturing

Company Size

51-200

Company Stage

Series C

Total Funding

$117M

Headquarters

Cambridge, MA

Founded

2018

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What believers are saying

  • June 2026 Series C raised $80 million to expand capacity and qualification.
  • 400G-per-lane sampling and OFC 2026 demonstrations show tangible product momentum.
  • NVision's October 2026 partnership broadens HyperLight into quantum PICs beyond datacom.

What critics are saying

  • HyperLight remains a pre-scale hardware company until 2026 customer qualifications convert into volume orders.
  • UMC and Wavetek execution risk can delay 6-inch and 8-inch wafer ramp-through 2027.
  • CPO and silicon-photonics rivals can displace TFLN if 400G-per-lane economics fail.

What makes HyperLight unique

  • HyperLight owns TFLN Chiplet patents and 400G-per-lane PICs for AI optics.
  • Its 1.6T-DR8 reference transceiver used one laser and cut module power 20%.
  • MediaTek, UMC, Jabil, Foxconn, and QIA validated its manufacturing ecosystem in June 2026.

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Funding

Total Funding

$117M

Above

Industry Average

Funded Over

2 Rounds

Series C funding is usually for startups that are doing well and are looking for more money to fuel major growth, such as acquiring other companies, expanding into global markets, or launching new product lines. Investors typically include larger venture capital firms and private equity.
Series C Funding Comparison
Above Average

Industry standards

$50M
$50M
$62M
$80M
$100M

Benefits

  • Health Insurance
  • Vision Insurance
  • Dental Insurance
  • 401(k) Company Match
  • Paid Parental Leave
  • Life Insurance
  • Disability Insurance
  • Commuter Benefits
  • Professional Development Budget
  • Mentorship Program

Growth & Insights and Company News

6 month growth

4%

1 year growth

-1%

2 year growth

-1%
The Quantum Insider
Oct 28th, 2026
NVision and HyperLight partner to develop photonic quantum chips.

NVision and HyperLight partner to develop photonic quantum chips. Mohib Ur Rehman Insider Brief * NVision has announced a peer-reviewed Nature paper on individually addressable organic molecular spin-photon interfaces and a partnership with HyperLight to integrate molecular qubits onto thin-film lithium niobate photonic integrated circuits. * The companies aim to combine NVision's molecular qubits with HyperLight's photonic chip technology to develop quantum hardware with optical connections between qubits and compatibility with established foundry manufacturing processes. * NVision is targeting a demonstration of on-chip performance by the end of 2026, with its longer-term roadmap aiming for 1,000 physical qubits and then 1,000 logical qubits by 2030. PRESS RELEASE - NVision, a quantum technology company, announced the publication of landmark peer-reviewed research in Nature and a strategic partnership with HyperLight Corporation ("HyperLight"), an industry leader in thin-film lithium niobate (TFLN) photonics. The companies will integrate NVision's thin-film molecular qubits directly onto advanced photonic integrated circuits (PICs). Together, these milestones establish a practical path to quantum computing at scale, using photonic connectivity to link quantum resources within and across processors. This opens a path toward millions of qubits on chips compatible with standard foundry manufacturing. The Nature publication confirms the first ever individually addressable organic molecular spin-photon interface, which is the key ingredient for connecting stationary qubits with photons. Until now, molecular spins could not be individually and coherently controlled, preventing them from serving as true qubits. That barrier has now been broken: the core building block can be controlled at the single-molecule level. This opens a new path to scale, where molecular qubits can be deposited as thin films, much like OLED materials, directly on top of PICs, turning established photonic chip technology into a platform for scaling quantum computers. "This proves what we've long believed: that organic chemistry offers a fundamentally better building block for quantum," said Dr. Sella Brosh, CEO of NVision. "For years, the industry has been locked in a hardware race using modalities that would require decades and multi-billion-dollar proprietary fabrication facilities to achieve scale. With the creation of the world's first manufacturable organic qubit, we now enter quantum's molecular era, establishing a new architecture based on photonic connectivity from the get-go, with a clear path to scale through existing foundry infrastructure." Alongside the Nature publication, NVision announced a strategic partnership with HyperLight, a global leader in TFLN electro-optic PICs for high-bandwidth environments such as AI data centers, telecom and metro networks. The collaboration will integrate NVision's molecular qubits as a thin film that can be deposited directly onto photonic chips, extending HyperLight's TFLN Chiplet(TM) technology further into quantum applications. "Integrating NVision's breakthrough molecular qubits onto our PICs unlocks a compelling path for scalable quantum hardware while showcasing the capabilities and versatility of HyperLight's TFLN technology," said Kevin Luke, co-founder and Head of Custom Development at HyperLight. "Photonic interconnectivity is essential for scaling quantum processors, and combining our optical chip infrastructure with manufacturable molecular thin films allows us to deliver high-density, chip-scale quantum connectivity that leverages decades of investment in semiconductor fabrication." The milestone directly advances NVision's Photonic Integrated Quantum Circuits (PIQC) platform from foundational physics into commercial hardware development. Following initial chip deliveries from foundry partners, NVision is targeting a live demonstration of on-chip performance on PICs by the end of 2026. The company's long-term commercial roadmap targets scaling to 1,000 physical qubits, progressing toward 1,000 logical, fault-tolerant qubits on chip by 2030 housed within a deployable data-center form factor. Unlike monolithic quantum architectures that force qubits into tight physical proximity, which creates severe crosstalk, control complexity and thermal bottlenecks, NVision's Photonic Integrated Quantum Circuit (PIQC) architecture uses optical links to decouple qubits from local spatial constraints. The engineered carbene molecules function at accessible cryogenic temperatures (2K-4K) and emit photons natively at precise optical frequencies, enabling direct intra-chip and inter-chip quantum entanglement. "Chemistry gives us a design freedom that semiconductor-based qubits, such as in silicon, simply do not have. By addressing quantum design at the molecular level, we can tune the performance that matters most, including quantum memory, gate speed and photon emission, within a single molecule," said Dr. Ilai Schwartz, CTO of NVision. "Because our qubits interact directly with light from the start, we achieve connectivity without proximity, making photonic networking a foundational capability of our platform rather than something we have to add later." To achieve this milestone, NVision combined large-scale computational screening with targeted synthesis, evaluating more than 150 candidate molecules, out of which 40 were synthesized in the laboratory. The resulting carbene system is engineered to interface directly with photons, making photonic connectivity a practical building block for scalable architectures. Crucially, the platform tolerates up to 70% photon loss, enabling reliable operation with standard silicon photonics rather than requiring ultra-low-loss, specialized optical infrastructure. First prototype integrated chips resulting from the collaboration are expected in Q4 2026. For detailed technical specifications, architectural white papers, and access to the peer-reviewed Nature study, visit: http://www.nvision-quantum.com. Mohib Ur Rehman. Covering quantum and emerging technologies, Mohib explores the intersection of technology, security, and society. His work also frequently examines surveillance infrastructure and the institutions shaping the digital world. In addition to his work at The Quantum Insider, he co-runs SK NEXUS, an independent technology publication that helps readers understand the technologies shaping their lives. Stay Ahead of Quantum Get the latest research, company news, and market intelligence every week. MENTIONED IN THE ARTICLE More in Industry News

Angel Business Communications Ltd
Oct 28th, 2026
NVision and HyperLight advance quantum PICs.

NVision and HyperLight advance quantum PICs. Wednesday 28th October 2026 Partnership with HyperLight aims to advance scalable quantum computing through thin-film integration with photonic integrated circuits. Quantum technology company NVision has partnered with HyperLight to integrate molecular qubits directly onto photonic integrated circuits (PICs), following the publication of research validating an individually addressable organic molecular spin-photon interface in Nature. The collaboration will combine NVision's thin-film molecular qubits with HyperLight's thin-film lithium niobate (TFLN) photonic technology, aiming to enable scalable quantum computing using photonic connections between and within processors. The research demonstrates individual control of molecular spins, a key step towards using them as qubits. The molecules can be deposited as thin films onto photonic chips, potentially enabling integration with existing semiconductor foundry manufacturing processes. NVision's architecture uses optical links to connect qubits, reducing reliance on close physical proximity. The company says its engineered molecules operate at temperatures of 2-4 K and can tolerate up to 70% photon loss, supporting compatibility with standard silicon photonics. Initial integrated chip prototypes from the partnership are expected in the fourth quarter of 2026. NVision is targeting an on-chip performance demonstration by the end of the year, with a longer-term goal of scaling towards fault-tolerant quantum computing.

Associated Press
Sep 8th, 2026
VentureTech Alliance joins HyperLight's Series C to advance TFLN photonics platform

HyperLight Corporation, a leader in thin-film lithium niobate photonics, announced that VentureTech Alliance has joined its Series C financing round. VTA is a venture firm focused on the semiconductor industry with investments across circuit design, foundry technology, and photonics. The addition extends HyperLight's ecosystem of investors spanning silicon ICs, foundry manufacturing, and networking. CEO Mian Zhang stated that bringing TFLN into volume production requires industry-wide alignment on process, design rules, and qualification data. HyperLight's TFLN Chiplet Platform supports data centre pluggables, coherent modules, and co-packaged optics in a single architecture. Products supporting 200G-per-lane operation are in production, with 400G-per-lane solutions now sampling. The platform is backed by over 150 patents covering device architecture and manufacturing processes.

Business Wire
Jun 19th, 2026
HyperLight Announces $80 Million Series C to Accelerate TFLN Deployment for AI Infrastructure

HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financi...

The Montreal Gazette
Jun 18th, 2026
HyperLight announces $80 million Series C to accelerate TFLN deployment for AI infrastructure.

HyperLight announces $80 million Series C to accelerate TFLN deployment for AI infrastructure. CAMBRIDGE, Mass. - HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise... June 18, 2026 at 11:38 a.m. CAMBRIDGE, Mass. - HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise Singapore), CDIB-TEN Capital, and Qatar Investment Authority (QIA), as well as strategic investors from leading silicon IC and networking companies. Existing investors Summit Partners, The Engine, Foothill Ventures, and Xora Innovation continue to actively support the company's growth. The financing brings together companies across the AI infrastructure value chain - including silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure investment - reflecting broad ecosystem support for scaling TFLN photonics into production. "This financing is about more than capital - it is about ecosystem alignment," said Mian Zhang, CEO of HyperLight. "AI infrastructure requires optical interconnects that can deliver higher bandwidth, lower power, and manufacturing scale across pluggable optics and co-packaged optics. HyperLight has spent years building the TFLN technology, manufacturing foundation, and ecosystem relationships required to support that transition. This round accelerates our ability to scale with customers and partners globally." HyperLight's TFLN Chiplet(TM) Platform is designed to unify the requirements of short-reach IMDD-based data center pluggables, longer-reach coherent datacom and telecom modules, and co-packaged optics (CPO) within a single high-volume manufacturable architecture. With products supporting 200G-per-lane operation and 400G-per-lane solutions now sampling, the platform combines ultra-high modulation bandwidth, CMOS-level drive voltage, and ultra-low optical loss to reduce power consumption as AI networks scale to higher lane speeds. "Next-generation AI infrastructure requires optical connectivity that enables 3.2T and beyond," said Brian Hsu, Managing Director of MediaTek Innovation Fund. "TFLN's combination of bandwidth and efficiency makes it a compelling technology for high-speed interconnects, and HyperLight is well positioned to support this transition." HyperLight will use the funding to expand manufacturing capacity, accelerate customer qualification, scale its TFLN Chiplet(TM) Platform, and deepen partnerships across foundry, semiconductor, networking, and systems integration domains. The financing builds on HyperLight's recently announced strategic manufacturing partnership with UMC and Wavetek for high-volume foundry production of the TFLN Chiplet(TM) Platform on both 6-inch and 8-inch wafers. HyperLight's platform approach consolidates diverse customer requirements into a standardized, production-ready architecture, reducing ecosystem complexity, lowering manufacturing risk, and enabling rapid, cost-competitive adoption of TFLN photonics at global scale. About HyperLight HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.

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