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MaxLinear is a fabless semiconductor company that designs RF, analog, and mixed-signal integrated circuits for broadband, connectivity, and data-center markets. Its products include system-on-chip solutions for cable broadband, fiber-to-the-home, and Wi-Fi, plus RF transceivers and high-speed interconnects used in devices like set-top boxes, mobile devices, and automotive systems. It outsources manufacturing to third-party foundries (notably UMC) and competes by offering a broad multi-market portfolio and strategic acquisitions. Its goal is to provide scalable, high-quality semiconductor solutions that enable reliable connectivity across home, mobile, automotive, and data-center applications while expanding its addressable markets through acquisitions.
Industries
Data & Analytics
Hardware
Industrial & Manufacturing
AI & Machine Learning
Company Size
1,001-5,000
Company Stage
IPO
Headquarters
Carlsbad, California
Founded
2003
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Total Funding
$78.7M
Above
Industry Average
Funded Over
3 Rounds
MaxLinear stock has surged 431% over the past year, trading at 13.4 times trailing sales compared to 3.3 for the S&P 500. The semiconductor company's infrastructure business, now its largest revenue segment, drove 145% year-over-year growth in the June quarter, reaching roughly $85 million. Revenue grew 55.2% year-over-year to $168.8 million in the June quarter. The company raised its 2026 optical data-centre revenue guidance to between $210 million and $230 million, driven by 5-nanometre PAM4 DSP and SerDes technology deployed at hyperscale customers. MaxLinear's trailing twelve-month operating margin remains negative at -11.6%. The June quarter included substantial wafer prepayments against order backlog extending into 2027. Management expects September-quarter non-GAAP gross margin of 60% at midpoint.
MaxLinear expands AI Infrastructure control-plane portfolio with intelligent eFuse solutions for Power Protection and telemetry. August 11, 2026 August 10, 2026 MaxLinear, a leader in high-performance analog, mixed-signal and connectivity semiconductor solutions, announced the expansion of its AI infrastructure portfolio with two new 16V high-current electronic fuse (eFuse) solutions, the MxL745950 and MxL745951P. AI infrastructure is driving unprecedented increases in rack power density, power-domain complexity, and serviceability requirements. The devices are designed to help hyperscalers, OEMs, ODMs, and networking equipment providers protect, monitor, and manage critical power paths across AI servers, accelerator trays, data center switches, fan trays, power shelves, plug-in modules, and rack-scale platforms. As AI clusters scale from server-centric deployments to rack-scale systems, power-path protection is becoming a mission-critical element of platform reliability. MaxLinear's new eFuse portfolio brings together integrated hot-swap protection, scalable high-current operation, compact implementation, and intelligent monitoring to help customers improve uptime, isolate faults, accelerate root-cause analysis, and gain deeper visibility into power-domain behavior across large-scale AI deployments. Industry demand for AI infrastructure continues to accelerate. Market research estimates that data center semiconductor revenue will reach approximately $843 billion by 2030. Hyperscaler capital spending is also rising sharply as operators expand AI compute capacity to support training, inference, and emerging agentic workloads. These trends are increasing the need for highly reliable power protection, telemetry, and serviceability across servers, networking systems, accelerator platforms, and rack-level infrastructure. Industry estimates place the global eFuse market at approximately $1.0B today, with growth expected through 2030 as electronic systems require more intelligent, compact, resettable, and programmable power protection. When viewed together with adjacent hot-swap and intelligent power-path protection ICs used in data center, telecom, automotive, and industrial infrastructure, the broader opportunity expands into a multi-billion-dollar power-protection market. Discover more Agricultural Equipment Supply Chain Enterprise Technology The MxL745950 is a 16V, 50A electronic fuse with 1mΩ on-resistance in a compact 5mm x 5mm LGA-32 package. It integrates current sensing, temperature monitoring, fault indication, programmable soft-start and parallel-operation capability for higher-current applications, such as servers, networking systems, and plug-in modules. The MxL745951P is a 16V, 60A stackable eFuse with 0.79mΩ on-resistance, PMBus(TM)/I[2]C interface support, high-precision telemetry, configurable protection thresholds, non-volatile fault recording, and active current balancing during start-up and steady-state operation. The device provides digital telemetry for input voltage, input current, input energy, output voltage, output current, input power, and output power, enabling platform designers to add more intelligent power monitoring and fault visibility in AI and high-performance computing infrastructure. "As AI infrastructure scales, the opportunity is expanding beyond compute silicon into the control, power, and telemetry technologies required to operate dense racks reliably," said Amit D. Bavisi, Ph.D., Senior Vice President and General Manager, Analog Mixed-Signal Business Unit at MaxLinear. "Our new eFuse solutions extend MaxLinear's role across AI servers, accelerator trays, switches, fan trays, power shelves, and rack-level platforms by helping customers build more observable, serviceable, and resilient power architectures." Discover more Public Relations Social Sciences Why AI Infrastructure Requires Intelligent Power Protection * Rack-level fault isolation: Integrated protection and fault-management capabilities help isolate subsystem failures before they impact broader rack operation. * Operational visibility: High-precision telemetry and fault recording help operators improve power-domain visibility and accelerate root-cause analysis. * Scalable current handling: Parallel operation and active current balancing support increasingly dense AI platforms and higher-current accelerator deployments. * Serviceability and uptime: Hot-swap and inrush-control capabilities help support maintenance and replacement workflows in live or service-sensitive infrastructure. * Control-plane integration: Complements MaxLinear's AI infrastructure portfolio spanning connectivity, monitoring, rack management, console access, telemetry, power management, and protection.
MaxLinear unveils Carmel as AI servers push console speeds higher. MaxLinear, Inc. (NASDAQ: MXL) has introduced Carmel, a high-speed USB-to-UART device designed to support console access, debugging, monitoring and infrastructure management across AI servers and hyperscale data-centre platforms. The MxL81434 combines 480Mbps High-Speed USB connectivity with four UART channels capable of operating at up to 15Mbps each. It also integrates an I[2]C master and 32 general-purpose input/output (GPIO) channels, allowing several platform-management functions to be consolidated into a single device. The launch comes as AI data-centre architectures become increasingly complex, with server and rack-scale systems requiring faster access for system bring-up, diagnostics, provisioning and recovery. MaxLinear said the market opportunity for USB-to-UART devices is significant, estimating a serviceable available market of about 200 million units driven by AI data-centre deployments. Carmel expands the company's existing USB-to-UART portfolio, which includes Coronado and Laguna, into higher-performance console-access applications. The company is targeting AI servers, accelerator platforms, universal baseboards (UBBs), rack-scale AI systems, hyperscale cloud infrastructure and enterprise data centres. A key feature of Carmel is its ability to provide four independent UART connections at up to 15Mbps per channel. MaxLinear said the configuration is intended to support data-intensive debugging, provisioning, diagnostics and recovery workflows where higher-speed console access can reduce system bring-up and troubleshooting times. The device also incorporates 1,024-byte transmit and receive first-in, first-out (FIFO) buffers. These are designed to maintain data throughput while reducing the processing burden on the host system. Beyond serial connectivity, the integrated I[2]C master and 32 GPIOs allow the device to support additional management functions, including platform monitoring, reset control and debug access. The integration could help server designers reduce the number of discrete components required for these functions. Carmel is also specified with +/-15 kV human-body-model electrostatic discharge (ESD) protection, addressing the electrical robustness requirements of server and data-centre environments. "As AI infrastructure scales, the performance requirements for console access, debug, and platform management continue to increase," said Amit D. Bavisi, senior vice-president and general manager of MaxLinear's Analog Mixed-Signal Business Unit. The product is being introduced as AI infrastructure operators increase compute density and deploy larger accelerator-based systems. In such environments, management and serviceability interfaces remain important for bringing systems online, diagnosing failures and recovering platforms without relying solely on application-level software. WT Microelectronics is supporting distribution of the new product. Johnny Hsu, vice-president of marketing at WT Microelectronics, said the distributor expects Carmel to address increasingly diverse console-access, management and debugging requirements among cloud service providers. MaxLinear's move comes as semiconductor suppliers increasingly target the supporting infrastructure around AI compute, extending beyond processors, memory and networking into components responsible for system management and serviceability. The company expects Carmel samples to become available in the fourth quarter of 2026.
MaxLinear launches RackCommander control-plane portfolio for next-generation AI infrastructure. MaxLinear, Inc. (NASDAQ: MXL), a leader in high-performance connectivity, mixed-signal, and power-management semiconductor solutions, today introduced RackCommander, a portfolio of connectivity, monitoring, control, and power-management products that help enable modern rack-level control-plane architectures for AI, cloud, enterprise, and edge infrastructure. Building on MaxLinear's recently announced Coronado and Laguna USB-UART solutions for AI data center control-plane connectivity, RackCommander brings together products across the key functions needed to manage increasingly complex rack-scale infrastructure. With Full- and High-Speed USB UARTs, RS-485 transceivers, GPIO expanders, power management, and power protection technologies, MaxLinear offers a comprehensive silicon portfolio for rack management and console-port applications. These solutions are designed to support control-plane and console-access requirements for AI infrastructure, including Universal Baseboards (UBBs), multi-node systems, and rack-scale architectures. As AI infrastructure transitions from server-centric architectures to rack-scale systems, the management challenge is changing dramatically. A modern AI rack may include multiple compute trays, dozens of accelerators, power shelves, liquid-cooling subsystems, sensors, service processors, and multiple management controllers. Traditional server-centric management approaches were not designed to efficiently manage these increasingly complex rack-scale environments. Industry analysts project datacenter semiconductor revenue to reach approximately USD 843 billion by 2030. Independent market surveys also project sustained growth for rack-controller and rack-management infrastructure as operators deploy increasingly dense AI systems. Future AI racks require a control plane that spans console access, infrastructure communications, monitoring, telemetry, protection, and rack-level serviceability. RackCommander helps customers address these requirements with MaxLinear products that can support: * Scalable console connectivity across compute, networking, and storage assets * High-speed sideband connectivity for service access and infrastructure control * Rack-level aggregation of management and telemetry signals * Robust communications between power, cooling, sensors, and infrastructure systems * Expanded monitoring and control across distributed rack resources * Power visibility, protection, and resiliency for critical infrastructure Together, these technologies help customers: * Accelerate deployment of rack-scale AI infrastructure * Simplify console and service access across compute, networking, and storage assets * Aggregate telemetry across the rack * Improve operational visibility and reduce infrastructure downtime * Enable scalable rack-management architectures * Lower system complexity and development effort * Support a resilient management plane that remains available independently of the production network For hyperscalers, OEMs, ODMs, and infrastructure providers, RackCommander highlights MaxLinear products that help enable next-generation AI rack-control systems. This differentiation is increasingly important as AI infrastructure evolves toward rack-level architectures that require a more capable control plane for visibility, connectivity, monitoring, and control across the rack. "AI infrastructure is creating a new control-plane architecture that extends far beyond the traditional BMC," said Amit D. Bavisi, Ph.D., Senior Vice President and General Manager of MaxLinear's Analog Mixed-Signal Business Unit. "Future AI racks must securely connect compute nodes, power shelves, cooling systems, sensors, and service processors into a unified management domain. MaxLinear has assembled a comprehensive silicon portfolio for this transition, spanning full- and high-speed USB-UARTs, RS-485 communications, GPIO expansion, eFuse, monitoring, telemetry, power management, and protection. With RackCommander, MaxLinear is helping customers build the control-plane foundation required for next-generation rack-scale AI infrastructure." "We are excited to work with MaxLinear and a top-tier cloud service provider on RackCommander," said Jack Tu, Senior Vice President and Chief Product Marketing Officer of WPI Group. "As AI infrastructure evolves toward rack-scale architectures, customers are looking for proven technologies that accelerate development and deployment while simplifying management of increasingly complex AI infrastructure. RackCommander brings together a broad range of MaxLinear products that help simplify rack management, improve system visibility, and bring next-generation AI infrastructure solutions to market faster."
MaxLinear has launched two intelligent electronic fuse (eFuse) solutions for AI infrastructure power protection. The MxL745950 is a 16V, 50A eFuse with 1mΩ on-resistance, whilst the MxL745951P offers 16V, 60A capacity with 0.79mΩ on-resistance and PMBus/I²C interface support. Both devices are designed for hyperscalers, OEMs, and ODMs to protect and monitor power paths across AI servers, accelerator trays, and data centre switches. They feature integrated hot-swap protection, current sensing, and fault isolation capabilities. The products are currently sampling, with volume production expected in Q4 2026. MaxLinear will showcase them at the OCP APAC Summit in Taipei on 11-12 August 2026. Market research estimates data centre semiconductor revenue will reach approximately $843 billion by 2030, driven by expanding AI compute capacity.
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Industries
Data & Analytics
Hardware
Industrial & Manufacturing
AI & Machine Learning
Company Size
1,001-5,000
Company Stage
IPO
Headquarters
Carlsbad, California
Founded
2003
Find jobs on Simplify and start your career today