Microchip introduces 1.2V clock buffers for advanced SoCs and FPGAs. Microchip Technology has introduced its SY757xx family of 1.2V-output LVCMOS clock buffers, designed to simplify clock distribution and voltage translation for high-performance FPGAs, SoCs, AI accelerators and next-generation CPUs. The new devices address the growing need for low-voltage clock solutions as advanced FinFET process technologies drive semiconductor platforms toward lower operating voltages. The increasing adoption of 1.2V devices has created challenges for printed circuit board designers, particularly where existing systems use higher-voltage clock sources. Conventional solutions based on discrete components and voltage-divider circuits can increase component count, complicate board layouts and affect signal integrity and clock duty-cycle accuracy. The SY757xx family provides single-chip voltage translation and clock distribution, helping designers reduce complexity while maintaining timing performance. The new clock buffers support a broad supply-voltage range and operating frequencies, providing flexibility for systems using different clock-source and board power-supply levels. The family supports operation across a 0 Hz to 250 MHz frequency spectrum and provides voltage-translation options ranging from 1.2V to 3.3V. Additive jitter is as low as 26 femtoseconds, supporting the timing precision required by demanding FPGA, SoC and CPU applications. "Our SY757xx family of clock buffers helps customers overcome the growing clock distribution challenges associated with next-generation high-performance FPGA, SoC and CPU platforms," said Maamoun Abou Seido, Vice President of Microchip's Timing and Communications business unit. "By combining ultra-low additive jitter performance with broad VDD and wide frequency support in a single-chip solution, the SY757xx devices simplify board design, reduce component count and help customers maintain the signal integrity and timing accuracy required in today's high-performance computing applications." Microchip is initially launching three products in volume production and eight additional devices in limited-volume sampling. The production devices include the SY75707TWL-TR, which supports differential input to two LVCMOS outputs, and the SY75712TWL-TR and SY75714TWL-TR, which provide two and four LVCMOS outputs, respectively. The devices are offered in compact 8-pin VDFN and TDFN packages. The SY757xx family is suited to applications including AI and machine-learning acceleration, embedded vision, video processing, industrial control, IoT, networking, communications and signal processing. The devices complement Microchip's portfolio of flash-based FPGAs and SoC FPGAs, along with its broader range of microcontrollers, analog, power management, connectivity, timing and memory solutions. Microchip Technology is widely recognized for its semiconductor, embedded systems, and timing solutions used across automotive, industrial, aerospace, communications, and consumer electronics applications. Through ongoing innovation in frequency control and precision timing technologies, the company aims to support next-generation electronic systems that demand higher performance, lower power consumption, and improved operational resilience.

AI Server Applications | Supplier of Infineon OptiMOS(TM), CoolMOS(TM), CoolSiC(TM) and ROHM SiC MOSFETs. With the explosive growth in demand for AI computing power, server power supply systems are rapidly evolving towards an 800V HVDC architecture. Mingjiada Electronics supplies Infineon's OptiMOS(TM), CoolMOS(TM) and CoolSiC(TM), as well as ROHM's SiC MOSFE... With the explosive growth in demand for AI computing power, server power supply systems are rapidly evolving towards an 800V HVDC architecture. Mingjiada Electronics supplies Infineon's OptiMOS(TM), CoolMOS(TM) and CoolSiC(TM), as well as ROHM's SiC MOSFETs and Microchip's mSiC(TM) series, providing comprehensive power semiconductor solutions for AI server power supply design. I. Evolution of AI Server Power Architecture and Power Device Requirements The power consumption of generative AI model training and inference clusters has now exceeded the megawatt level, with power per cabinet rapidly increasing from the traditional 10 kW to 100 kW or even higher. This transformation places unprecedented demands on power MOSFETs: lower on-state losses, greater surge withstand capability, higher thermal stability and superior switching characteristics. Current AI server power supply architectures are evolving along three distinct technological pathways: step-up with current reduction (shifting from 12V/48V to 400V/800V high-voltage DC), reduction in the number of conversion stages (simplifying from multi-stage conversion to 800V | 48V | 12V | Core), and power delivery close to the chip. These changes have made silicon carbide (SiC) and silicon-based super-junction MOSFETs critical components. II. Mingjiada Electronics: A Specialist Power MOSFET Supplier Established in 1996, Shenzhen Mingjiada Electronics Co., Ltd. is a globally renowned authorised independent distributor of electronic components. Headquartered in Shenzhen, the company has established branches in Hong Kong, Japan, Russia and other locations. The company has obtained ISO 9001:2014 international quality management system certification and ISO 14001:2014 environmental management system certification, and specialises in distributing products from over 500 renowned manufacturers. In the field of power devices, Mingjiada Electronics has established long-term, stable partnerships with leading international semiconductor manufacturers such as Infineon, ROHM and Microchip, ensuring product quality and supply reliability. III. Detailed Overview of the Infineon Power MOSFET Series 1. OptiMOS(TM) 7 Series - Designed for Cloud Computing The Infineon OptiMOS(TM) 7 series adopts an 'application-oriented' design philosophy, tailored to specific application requirements. The switching-optimised products in this series are specifically designed for future data centres, servers and telecommunications equipment, offering a Form of Performance (FOM) improvement of up to 25 per cent and significantly enhanced thermal management capabilities through the use of Source Down packaging. The OptiMOS(TM) 7 25V MOSFETs are primarily aimed at intermediate bus converter (IBC) applications and are suitable for 48V voltage conversion to support AI core power supplies. The product portfolio is divided into two main technical categories: hard-switching and soft-switching, with a rated temperature of up to 175°C. 2. OptiMOS(TM) 6 Series - Setting a New Standard for DC-DC Conversion Efficiency Infineon's OptiMOS(TM) 6 80V MOSFETs, housed in a compact 5x6 mm^2 dual-sided heat-dissipating package, have been integrated into the IBC tier of AI server platforms from leading processor manufacturers. Application testing shows that their efficiency is approximately 0.4 per cent higher than previous solutions, equating to a saving of around 4.3 W per kW of load. Rolling out this solution across a hyperscale data centre with 2,000 racks could save over 1.2 MWh of energy per hour. The product delivers superior switching performance in hard-switching topologies, enhancing energy efficiency by reducing conduction losses, whilst the dual-sided heat-dissipating package helps improve thermal management and increase power density. 3. CoolMOS(TM) 8 Series - The Benchmark for Super-Junction MOSFET Technology Infineon's CoolMOS(TM) 8 super-junction MOSFETs have enabled Mimi Electric's 5.5 kW AI server power supply to achieve Titanium Plus efficiency certification. Compared to the CFD7 series, the CoolMOS(TM) 8 features an 18 per cent reduction in gate charge; compared to the P7 series, this figure rises to 33 per cent. The product boasts the fastest turn-off time on the market, with thermal performance improved by 14 per cent to 42 per cent compared to the previous generation. The CoolMOS(TM) 8 integrates a fast body diode, enabling its widespread use across various applications ranging from low-power switching power supplies to high-power systems such as servers, telecommunications equipment and solid-state circuit breakers. 4. CoolSiC(TM) MOSFET G2 Series - Leader in Silicon Carbide Technology Infineon's second-generation 650V CoolSiC(TM) MOSFET is a core component in high-voltage power supplies for AI servers. In a 24kW battery backup unit (BBU) reference design, the DC-DC conversion stage, built around the CoolSiC MOSFET IMT65R033M2H, achieves a conversion efficiency exceeding 99 per cent. Featuring a 650V breakdown voltage, a stable body diode, a junction temperature rating of 175°C and .XT packaging technology, this product demonstrates exceptional reliability under demanding operating conditions such as voltage spikes, high dv/dt transients and sustained thermal cycling. IV. ROHM SiC MOSFET Series ROHM's 750V SiC MOSFET, the "SCT4013DLL", has been adopted in AI server power supply BBUs, where it is configured within power supply units operating under a +/-400V supply architecture. This product offers excellent high-temperature resistance with a maximum junction temperature of 175°C, enabling stable operation even within BBUs where heat generation is increasing due to rising voltage and power density. In next-generation 800 V DC power supply architectures, where the supply voltage to the internal battery pack of the BBU is approximately 560 V, ROHM's 750 V SiC MOSFETs can also be utilised. ROHM has published the white paper "ROHM's 800 V DC Architecture Solutions for AI Servers", providing a comprehensive solution for AI server power supply design. V. Microchip mSiC(TM) Series Microchip's 3.3 kV HV-D3 mSiC power module is specifically designed for solid-state transformer (SST) applications in AI data centres. The module integrates a 3.3 kV silicon carbide MOSFET and a Schottky diode within an industry-standard 62 mm package, enabling highly efficient power delivery directly from the medium-voltage grid to the server rack. Microchip's mSiC MOSFET technology maintains highly competitive RDS(on) stability across a wide temperature range. Compared to low-voltage SiC solutions, the number of series components required is significantly reduced - by approximately half - when connected to 13.8 kV or 34.5 kV grids. The module supports applications ranging from 100 to 300 A and is suitable for solid-state transformers, medium-voltage motor drives and industrial power systems. VI. Typical Application Scenarios for AI Server Power Supplies IBC Intermediate Bus Conversion: OptiMOS(TM) 7/6 High-efficiency DC-DC conversion, enhanced power density PFC/LLC Primary Side: CoolMOS(TM) 8 Titanium-level efficiency, fast switching High-Voltage BBU: CoolSiC(TM) G2 99%+ efficiency, high reliability 800V HVDC: ROHM SiC MOSFETs High-temperature resistance, low losses Solid-state transformers: Microchip mSiC(TM) Medium-voltage direct conversion, reduced number of conversion stages Conclusion With the rapid expansion of AI computing infrastructure, server power supplies face extremely stringent requirements in terms of power density, conversion efficiency and high-temperature reliability. The Infineon OptiMOS(TM), CoolMOS(TM) and CoolSiC(TM), as well as the ROHM SiC MOSFETs and Microchip mSiC(TM) series supplied by Mingjiada Electronics, have become key choices for building highly energy-efficient AI server power supplies, thanks to their leading technical performance and stable supply capabilities. For further product information or to request a quotation, please visit the Mingjiada Electronics website (www.hkmjd.com) or contact its sales team. Contact Us Mobile: +86 13410018555 Email: [email protected] Address: Rooms 1239-1241, Guoli Building, Zhenzhong Road, Futian District, Shenzhen News recommendation.

Marelli and Microchip partner on ASA-ML display connectivity solution. By Zahra Awan September 9, 2026 3 Mins Read Marelli and Microchip Technology have announced a solution that enables graphics and video content generated by a vehicle's central computer to be streamed directly to automotive displays using ASA Motion Link (ASA-ML), an open standard for automotive video connectivity. The demonstrator is designed to simplify display architectures, optimize system costs and increase sourcing flexibility while supporting the transition to software-defined vehicles (SDVs). ASA Motion Link is an open standard for automotive video connectivity and SerDes (serializer-deserializer) communication, defined by the Automotive SerDes Alliance (ASA), a consortium of vehicle manufacturers, Tier 1 suppliers and semiconductor companies. The standard enables high-speed video and graphics transmission across products from multiple technology providers, supporting interoperability and providing an alternative to proprietary video transmission technologies. As a founding member of ASA, Microchip has demonstrated interoperability across its camera solutions and is now extending the technology to display connectivity. As vehicle architectures evolve toward centralized computing and SDVs, vehicle makers are looking for connectivity solutions that can support growing performance demands while reducing complexity, controlling costs and enabling scalable vehicle electronics architectures. In the joint demonstrator solution, graphics and video content generated by the vehicle's central computer is processed and transmitted through Microchip's VS7000 ASA-ML chipset over a high-speed standardized link. Marelli enables display-side integration of the technology by configuring and optimizing the ASA ML deserializer to decode standardized video streams directly at the display. The approach supports the reception and synchronization of centrally generated content, including camera feeds, navigation maps, infotainment graphics and vehicle control interfaces, while simplifying the display-side electronic architecture. "The transition to software-defined vehicles is driving demand for more open, flexible and scalable electronic architectures," said Kelei Shen, president of Marelli's Electronics business. "As an integrator within the automotive ecosystem, Marelli brings together best-in-class technologies from multiple partners to deliver complete solutions for vehicle makers. This collaboration highlights how open standards can accelerate innovation while providing interoperability needed for the next generation of vehicle architectures." "Open standards play a critical role in accelerating innovation by reducing dependency on proprietary technologies," said Kevin So, vice president of Microchip's communications business unit. "Our collaboration with Marelli demonstrates how ASA Motion Link provides automotive manufacturers with a secure, interoperable and scalable connectivity solution that simplifies integration across the ecosystem." The collaboration demonstrates how open-standard connectivity supports in-vehicle networking and electronics by enabling secure communication between centralized computing systems and displays.