onsemi

onsemi

Semiconductors for intelligent power and sensing

Overview

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial use. Its products include power management ICs and sensors that regulate energy and provide precise control signals for systems like EVs, ADAS, factory automation, robotics, and energy infrastructure. These chips work by efficiently handling electrical power, converting energy, and delivering sensing data and control outputs that enable safer, more capable machines. The company differentiates itself by specializing in intelligent power and sensing across both automotive and industrial markets and selling through direct OEM partnerships plus a global distributor network to support scalable deployment with energy efficiency at the core of its offerings.

About onsemi

Simplify's Rating
Why onsemi is rated
B
Rated B on Competitive Edge
Rated A on Growth Potential
Rated C on Differentiation

Industries

Automotive & Transportation

Hardware

Industrial & Manufacturing

Energy

Company Size

10,001+

Company Stage

IPO

Headquarters

Scottsdale, Arizona

Founded

1999

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Simplify's Take

What believers are saying

  • Q2 2026 revenue reached $1.6 billion, with AI data center demand driving growth.
  • Management lifted 2030 targets to nearly $11 billion revenue and 53% gross margin.
  • Subaru's September 16, 2026 EPP evaluation validates onsemi's traction-inverter roadmap.

What critics are saying

  • The Synaptics acquisition closes mid-2027, exposing onsemi to regulatory and integration failure.
  • June 2026 Czech SiC layoffs signal cost pressure and weaker internal wafer economics.
  • AI demand concentration and allocation tradeoffs leave automotive and industrial customers vulnerable to supply starvation.

What makes onsemi unique

  • onsemi's September 16, 2026 EPP uses silicon wafers for package-level power integration.
  • Its SiC, GaN, and silicon portfolio spans automotive inverters, industrial systems, and AI power.
  • The June 25, 2026 Synaptics deal adds connected compute and embedded software capabilities.

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Funding

Total Funding

$2.6B

Above

Industry Average

Funded Over

3 Rounds

Post IPO Convertible funding comparison data is currently unavailable. We're working to provide this information soon!
Post IPO Convertible Funding Comparison
Coming Soon

Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Health Savings Account/Flexible Spending Account

Paid Vacation

Paid Sick Leave

Paid Holidays

401(k) Retirement Plan

401(k) Company Match

Stock Price

Growth & Insights and Company News

Headcount

6 month growth

↑ 0%

1 year growth

↑ 0%

2 year growth

↑ 1%
Wccftech
Sep 21st, 2026
Onsemi ditches traditional PCB substrate for silicon wafer, unlocking up to 5x power density for AI chips and EVs.

Onsemi ditches traditional PCB substrate for silicon wafer, unlocking up to 5x power density for AI chips and EVs. Onsemi's EPP (Embedded Power Platform) aims to utilize silicon wafers to enable more efficient and power-dense chips. As power demands grow, Onsemi is working on its EPP solution to make semiconductors more efficient & denser. Currently, power modules within a chip are placed within the PCB (Printed Circuit Board), but as more advanced packaging solutions are being developed, Wccf Tech Inc is seeing the embedding of power systems within the package substrate. Intel's EMIB is one example where the TSVs route power to the chip around the embedded package, and EMIB-T takes it one step further by routing power through the embedded die. EPP reimagines the package from passive housing into an active contributor to system performance. By using the silicon wafer itself as the package, EPP enables the seamless integration and interconnection of silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies within a highly integrated wafer-level architecture. Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimized for electrical, thermal and mechanical performance. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from day one. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market. With EPP (Embedded Power Platform), OnSemi is taking a slightly different approach where the company is planning to utilize 12-inch silicon wafers as the package substrate. The tech doesn't rely on using a conventional PCB as the substrate. EPP replaces that sequential model with a common platform that can be co-designed, co-simulated and co-optimized. This approach is designed to help customers: Electric Vehicle Applications: Electric vehicle traction inverters are often constrained by efficiency losses, thermal limitations, development complexity and system size. EPP addresses these challenges with up to 4x higher power density and 15% lower power losses compared to conventional approaches, enabling smaller, lighter and more efficient inverter designs. Its scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications, allowing automakers to reuse a common design across multiple vehicle models and power classes. This approach can reduce R&D and manufacturing costs, accelerate qualification and development cycles, improve vehicle range or lower system costs, and help bring new vehicle programs to market faster. * Achieve 3 - 5x higher power density, depending on the application * Accelerate development cycles to as little as four months * Improve thermal performance and heat dissipation * Reduce electrical losses through lower parasitic inductance * Enable greater device control and higher switching frequencies * Identify design trade-offs earlier and reduce costly late-stage changes * Scale a common architecture across power levels, device types, applications semiconductor technologies AI Infrastructure Applications: As AI rack power increases, more space and cooling capacity must be dedicated to the systems that deliver, convert and protect that power. This can limit how much compute capacity can fit within a rack. In an early EPP-based solid-state circuit-breaker design, the solution was approximately 50% smaller and 20% cooler than existing designs. By reducing packaging overhead and using the full EPP footprint to conduct heat, EPP can support more compact power systems, improve thermal management and enable greater power density in AI infrastructure. The EPP will then place various power semis within the silicon wafer. These include silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). Additionally, EPP can house various drivers and controllers within the wafer. OnSemi is claiming that the EPP methodology not only makes power systems within the chip smaller and more efficient, but also adds to power density. With EPP, a chip can feature up to 3x-5x power density gain. The shorter connections required to connect the chip to the base board result in a reduction in power losses that are caused by current flow and voltage fluctuations. Heat dissipation is another area where EPP leads over traditional methods due to its better thermal characteristics from the use of a silicon wafer. As for adoption, Onsemi's EPP is said to play a key role in chips designed for AI data centers and also EVs (Electric Vehicles). In that regard, Onsemi has unveiled Subaru as one of its early partners on the EPP project. Subaru will utilize EPP for its upcoming EVs and will receive EPP engineering samples and simulation models from OnSemi. In data centers, EPP will be utilized for solid-state circuit breakers, as they can reduce product size by up to 50% and lower temperatures by 20%. Additional partners for EPP are expected this year, and wider sampling to key customers is expected later this year. About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking. Follow Wccftech on Google to get more of its news coverage in your feeds.

Yahoo Finance
Sep 17th, 2026
onsemi targets $2.5B AI data-centre revenue by 2030, sets 53% gross margin goal

Onsemi has announced plans to generate over $2.5 billion in revenue from AI data centres by 2030, starting from an expected $500 million in 2026. The growth is driven by increasing power demands in higher-voltage infrastructure. The company unveiled its Embedded Power Platform, which integrates gallium nitride and silicon carbide technologies to enhance power density and efficiency. The platform is currently being sampled for automotive, industrial and AI applications. Onsemi set 2030 financial targets including 12–14% annual revenue growth, nearly $11 billion in total revenue, 53% gross margins and 38% operating margins. The firm plans to generate over $3.5 billion in free cash flow and return 100% to shareholders after investments and acquisitions. CEO Hassane El-Khoury emphasised that AI infrastructure is increasingly constrained by power delivery and management capabilities.

Yahoo Finance
Sep 16th, 2026
Subaru evaluates onsemi's Embedded Power Platform for next-gen EV architectures

Subaru has entered a strategic technology engagement with onsemi to evaluate its Embedded Power Platform for future electric vehicles. The collaboration will give Subaru early access to EPP technology, engineering samples, simulation models and technical expertise. The platform represents an integrated approach to power system design that could improve efficiency, simplify development and support future vehicle architectures. Power electronics are becoming increasingly important for vehicle performance and design flexibility as automakers expand their electrified portfolios. The engagement allows Subaru to assess how advances in power semiconductor integration can support system-level optimisation. Meanwhile, onsemi will gain practical customer insights to support continued EPP development. Subaru's Managing Executive Officer Tamotsu Inui said the company is encouraged by the platform's potential for future electrified-vehicle architectures.

Mining Press Releases
Sep 16th, 2026
Subaru to evaluate onsemi's Embedded Power Platform for Future evs.

Subaru to evaluate onsemi's Embedded Power Platform for Future evs. Strategic technology engagement will explore the potential of advanced power integration for future electrified-vehicle architectures Subaru has entered into a strategic technology engagement with onsemi on its Embedded Power Platform (EPP), marking an important milestone in the evaluation of next-generation power architectures for future electrified vehicles. Through early access to engineering samples, simulation models and technical expertise, Subaru will assess how a more integrated approach to power system design would improve efficiency, simplify development and support future vehicle architectures. SCOTTSDALE, Ariz., Sept. 16, 2026 (GLOBE NEWSWIRE) - onsemi today announced a strategic technology engagement with Subaru Corporation to evaluate its Embedded Power Platform (EPP). The engagement will give Subaru early access to EPP technology and engineering expertise as the company explores next-generation power architectures for future electrified vehicles. Power electronics are playing an increasingly important role in vehicle performance, efficiency and design flexibility as automakers expand their electrified vehicle portfolios. The engagement enables Subaru to explore how advances in power semiconductor integration can support broader system-level optimization, including new approaches to power system architecture, efficiency and vehicle design flexibility, while providing onsemi with practical customer insights to support the continued development of EPP. "Advancing our electrification strategy requires us to continually assess technologies that can improve vehicle performance, efficiency and system integration," said Tamotsu Inui, Managing Executive Officer Chief General Manager of Engineering Div, Chief General Manager of Technical Research Center, Subaru. "Our early engagement with onsemi gives us an opportunity to evaluate EPP's integrated approach to power system design while drawing on onsemi's modeling, simulation and engineering expertise. We are encouraged by the platform's potential and look forward to continuing our technical engagement as we develop future electrified-vehicle architectures." "The transition to electrification is driving increasingly sophisticated vehicle architectures and placing growing pressure on automakers to improve efficiency, simplify development and accelerate innovation. That is creating an opportunity to rethink power systems from the ground up," said Dinesh Ramanathan, Senior Vice President of Corporate Strategy, onsemi. "Subaru's engagement brings valuable customer insight to EPP's continued evolution, using the platform in advanced customer systems and exploring how its integrated power architecture would support the next generation of electrified vehicles." Potential Benefits for Future Electrified Vehicles EPP is a breakthrough power platform that enables more power in less space by embedding multiple semiconductor devices directly into a silicon-based wafer-level package. By transforming the package from a passive housing into an active contributor to electrical and thermal performance, EPP enables a new class of highly integrated power systems designed for the growing demands of vehicle electrification. For future electrified vehicles, EPP has the potential to support smaller, lighter and more efficient traction inverter systems while reducing development complexity and accelerating time to market. Because the platform can scale across multiple power levels using a common architecture, automakers can reduce engineering effort, minimize requalification costs and accelerate development cycles. The result is a faster path from concept to production, with lower development costs and greater flexibility across future vehicle programs. These potential advantages are what make early technical collaboration so important. Building on a longstanding relationship between Subaru and onsemi, the collaboration reflects the companies' shared commitment to advancing technologies that will shape the next generation of vehicle electrification and helping bring those technologies to realization. The initial phase focuses on early engineering evaluation and technical learning as the companies explore advances in power-semiconductor integration that can translate into scalable system-level solutions that meet the performance, efficiency and thermal demands of next-generation mobility. More Information: About Embedded Power Platform: About onsemi onsemi (Nasdaq: ON) delivers intelligent power and sensing technologies that enable electrification, energy efficiency, safety, and automation across automotive, industrial, and AI data center end-markets. With a highly differentiated and innovative product portfolio, onsemi helps customers solve complex challenges to achieve higher efficiency, improved performance and lower system cost, while supporting a safer, cleaner, and more energy efficient world. The company is part of the S&P 500(R) index. Learn more at www.onsemi.com. onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the Company references its website in this news release, information on the website is not to be incorporated herein. Krystal Heaton Director, Head of Public Relations onsemi (480) 242-6943 [email protected] Photos accompanying this announcement are available at onsemi Embedded Power Platform chip. onsemi Embedded Power Platform wafer. Legal Disclaimer: EIN Presswire provides this news content "as is" without warranty of any kind. We do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the author above.

AktienSensor
Aug 30th, 2026
ON Semiconductor Raises $1.5M Private Placement to Fund Advanced Node Projects in Newfoundland & Mexico

ON Semiconductor’s $1.5 m private placement fuels new exploration projects, positions it for sub‑5 nm nodes, and strengthens its capital‑efficient strategy in the evolving semiconductor market.

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