Texas Instruments advances next-generation industrial systems with CAN XL transceiver. TCAN6062 CAN XL transceiver serves as an industrial communications offering for humanoids, industrial robots and HMI systems. Texas Instruments By Robotics 24/7 Staff August 12, 2026 Texas Instruments TI said that its TCAN6062 CAN XL transceiver delivers more data at faster speeds for applications such as humanoid robots, industrial robots and HMI systems. Stay up-to-date with news and resources you need to do your job. Research industry trends, compare companies and get weekly market intelligence with Robotics 24/7. Texas Instruments (TI) introduced what it said is the industry's first commercially available CAN XL transceiver, designed to help industrial engineers keep pace with the growing data demands of modern networks. The company said that the TCAN6062 Controller Area Network (CAN) extended data-field length (XL) transceiver supports payloads up to 2,048 bytes per frame and data rates as high as 20Mbps, while ensuring that priority messages are delivered first and on time, with the performance on which humanoid robots, industrial robots and human-machine interface (HMI) systems depend. Texas Instruments said that TCAN6062's backward compatibility with CAN flexible data rate (FD) and CAN signal improvement capability (SIC) operations enables seamless migration to CAN XL, allowing teams to evolve existing designs incrementally without requiring a full redesign. Additionally, the company said that the transceiver allows engineers to consolidate communication layers and use Ethernet in mixed-network architectures with Transmission Control Protocol/Internet Protocol (TCP/IP) tunneling, enabling efficient transfers of diagnostics, sensor data, control traffic and over-the-air updates on a single network. Why do these communication advancements matter? TI said that industrial systems are generating and demanding more data than ever before, with applications requiring fast, deterministic communication to synchronize motion control, sensor feedback and diagnostic data. These applications have introduced new networking requirements, often leading engineers to accept system-level trade-offs to compensate for bandwidth constraints. TI said that the TCAN6062 CAN XL transceiver bridges that gap, offering engineers a path to higher-bandwidth networks while maintaining the proven reliability CAN is known for. The specification for CAN XL has been standardized for years, but Texas Instruments said that it is the first to deliver and bring the hardware that makes it possible to the mass market. By introducing the TCAN6062, TI said that the company is transforming the innovative protocol into a broadly available, ready-to-use technology that engineers can implement in their next-generation designs. "As industrial systems become more intelligent and interconnected, what we ask of our networks continues to evolve," said Dwight Byrd, general manager, Interface Products at TI. "Engineers need more data, higher speeds and greater flexibility, all without compromising performance or reliability. TI's TCAN6062 CAN XL transceiver puts that capability in their hands today, helping them build faster, more capable industrial systems." The company said that the TCAN6062 CAN XL transceiver's SIC helps reduce ringing by as much as 80% in complex networks, simplifying validation in high-node architectures. Combined with wide input/output voltage compatibility and protection up to +/-58V, TI added that the transceiver offers broad design flexibility across a range of industrial applications. TCAN6062 CAN XL and the CiA. As members of the CAN in Automation (CiA) technical group that developed International Organization for Standardization (ISO) 11898-2:2024, TI said that its engineers helped shape the physical layer specification for CAN XL, ensuring the protocol was built to support the real-world demands of industrial applications. "CAN has been the backbone of industrial communications for decades," said Holger Zeltwanger, managing director at CiA. "Texas Instruments' long-time membership and collaboration with CiA builds on that legacy, helping shape CAN XL by contributing to a standard that will guide the entire industry. Now with the introduction of the first commercially available CAN SIC XL transceiver, CAN XL is accessible to engineers worldwide, reflecting our shared commitment to solving the engineering challenges of today and tomorrow." Texas Instruments said that the TCAN6062 represents the next generation of its CAN transceiver portfolio. Spanning CAN FD, CAN SIC and now CAN XL, TI said that it offers a comprehensive range of offerings, giving engineers the flexibility to deliver more data faster, farther and more reliably. "CAN XL opens the door to a new era of applications, enabling systems to deliver higher performance at a reasonable cost. CAN XL is the better and cheaper CAN FD, but can also tunnel Ethernet," said Arthur Mutter, Ph.D., chairman of the CAN XL Special Interest Group at CiA and senior executive, Networking Technologies at Bosch. "With TI now offering a CAN SIC XL transceiver, system designers can leverage CAN XL to exchange data rapidly (up to 20 Mbit/s) and reliably in all applications, from industrial and robotics to automotive safety." Latest in humanoid. Latest in components. Latest robotics news.

The silicon bottleneck: how mature nodes power the AI infrastructure boom. Need to know. * The AI Backbone Runs on Legacy Silicon: While advanced nodes focus on digital compute, mature and specialty nodes (28 nm and above, on 200 mm/300 mm wafers) supply the indispensable power management ICs (PMICs), gate drivers, and isolators required to power AI systems. * BCD Technology Enables Single-Chip Power Systems: Bipolar-CMOS-DMOS (BCD) technology combines low-voltage digital control, high-voltage power switching (LDMOS), and precision analog functions onto a single die, enabling highly integrated power regulation. * Process Complexity Differs from Moore's Law: Analog manufacturing relies on precision matching, thick/thin gate oxide integration, and deep-trench isolation (DTI) rather than sub-nanometer extreme ultraviolet (EUV) lithography scaling. * Capacity Squeeze and Geopolitical Realignment: Foundry capacity reallocations to interposers and high-margin PMICs are driving fab utilization toward ~90%, while China expands its legacy footprint (target ~45% global mature capacity by 2027) alongside 300 mm expansions by US IDMs like Texas Instruments. Specialty and mature nodes, typically 28 nanometers (nm) and larger, often built on 200 millimeter (mm) and 300 mm silicon wafers, form the critical backbone of the AI buildout. Unlike advanced digital logic that scales to increase transistor density, analog and mixed-signal circuits prioritize signal precision, low noise, high-voltage control, and circuit isolation. The primary manufacturing technology is Bipolar-CMOS-DMOS (BCD). BCD combines low-voltage digital CMOS logic, high-voltage Lateral DMOS power switches, and precision analog components on one chip /ST/. This integration enables power-management integrated circuits (PMICs), voltage regulators, gate drivers, and isolators to convert and deliver stable power to AI accelerators. Process complexity comes from balancing thick gate oxides for high voltages with thin gate oxides for digital logic, creating deep-trench isolation to separate circuit domains, and integrating passive components. These requirements do not improve with traditional scaling and require stable, well-characterized process flows rather than extreme ultraviolet (EUV) lithography. AI data-center power density is now the main demand driver. As equipment racks scale toward hundreds of kilowatts and eventually megawatt-class systems, analog content per rack rises sharply to support multi-phase voltage regulation, intermediate bus converters, sensors, and circuit protection. Analysts project the market for analog semiconductors in AI data centers to grow from roughly $7.9 billion in 2025 to $27 billion by 2030 - a ~28% annual growth rate - outpacing the general analog market. This demand, combined with automotive, industrial, and edge-AI needs, creates severe supply constraints. Fab capacity is tightening rather than expanding smoothly. Leading foundries have reduced 200 mm wafer output and moved 300 mm mature capacity toward higher-margin AI products, such as PMICs, power discretes, and silicon interposers. This shift pushes fab utilization toward 90% and causes price increases expected to extend into 2027 /Taipei Times/. China is building a larger share of global mature-node capacity that is projected to approach 45% by 2027 through expansion at SMIC, Hua Hong, and other foundries, while taking overflow orders for high-voltage and lower-margin chips. Texas Instruments is countering this trend by expanding 300 mm analog capacity in Texas /EETimes/ and Utah to lower production costs and increase supply chain security. Wafer reclaim works at higher success rates on mature nodes than on advanced nodes /Mordor Intelligence/, and companies recycle limited power components, but neither practice solves core factory capacity limits. Key process and product companies include Texas Instruments, Analog Devices, Infineon, STMicroelectronics, and Onsemi on the integrated design and manufacturing side. Foundry capacity is concentrated at GlobalFoundries, UMC, TSMC's mature lines, SMIC, and Hua Hong. In South Korea, DB HiTek remains a vital pure-play 200 mm foundry, supplying specialized PMICs and high-voltage power components /PR Newswire/. Regional concentration remains a risk: Taiwan holds critical specialty process expertise even as it expands advanced nodes, while China's rapid mature-node expansion creates both additional supply and supply-chain division risks for international customers. The result is a supply squeeze in the hardware layer that keeps AI systems powered and operational.