Toshiba America Electronic Components is showcasing its latest power semiconductor technologies at the Applied Power Electronics Conference this week in San Antonio. The company is highlighting solutions designed to improve efficiency in data centres and electric vehicles. Toshiba's portfolio includes silicon, silicon carbide and gallium nitride FETs, IGBTs, optical and digital isolation devices, motor control solutions and microcontrollers. New products on display include UMOS 11 MOSFETs with improved switching characteristics, top-side cooled TOGT packages for high power-density applications, and SiC power modules for grid-level and industrial systems. The company will also demonstrate 750V and 1200V SiC die for automotive drivetrain inverters and system reference designs, including 3kW server power supplies for data centres. Conference attendees can visit Toshiba at booth 1753 through 25 March.

Toshiba Electronic Devices & Storage Corporation has launched the TLX9920, a photovoltaic-output photocoupler for solid state relays in automotive equipment. Volume shipments began today. The device is designed as a gate driver for high-voltage power MOSFETs used in SSR, which are increasingly replacing mechanical relays in automotive applications due to their longer lifespan and elimination of contact wear. The TLX9920 complies with AEC-Q101, the automotive electronic component reliability standard. Housed in an SO6L package, it features a creepage distance exceeding 8mm and high isolation voltage of 5,000Vrms minimum, meeting IEC 60664-12 requirements for high-voltage applications. The product suits use in battery management systems, onboard chargers, inverters and energy storage systems in harsh environmental conditions.