European Commission recognizes ZutaCore as a key innovator in HEATWISE's hybrid-cooled micro data centre demonstrator at EMPA pilot. The HEATWISE-EMPA pilot has been officially recognized by the European Commission's Innovation Radar, with its hybrid-cooled edge data centre prototype listed as an EU-recognized innovation. The recognition names ZutaCore as a key innovator alongside EMPA Swiss federal labratories for Material Science and Technology and RISE Research Institutes of Sweden, highlighting the collaborative effort behind the project. The recognition comes at a time when growing digital infrastructure demands are increasing pressure on both energy efficiency and sustainability. As computing workloads continue to expand, new approaches to cooling, waste heat recovery, and energy management are becoming increasingly important. HEATWISE was established to explore how waste heat generated by IT infrastructure can be captured, managed, and integrated into building energy systems. The project combines ZutaCore's advanced cooling technology, intelligent energy management, digital modelling, and heat recovery strategies to improve energy efficiency and support more sustainable operation of buildings with significant IT loads. What is HEATWISE? HEATWISE (Holistic Energy Management And Thermal Waste Integrated System for Energy Optimisation) is a Horizon Europe research and innovation project that addresses thermal management and energy optimization in buildings with significant IT infrastructure. The project brings together research institutions, technology providers, and industry partners to develop and validate solutions that connect IT systems, cooling technologies, and building energy management. Demonstrations are being carried out across several European pilot sites, validating how advanced cooling, waste heat recovery, and intelligent energy management can improve the efficiency of buildings with significant IT loads. ZutaCore's Contribution to HEATWISE As part of the project, ZutaCore contributed its waterless two-phase direct-to-chip liquid cooling technology. Unlike conventional cooling methods that rely primarily on sensible heat transfer, two-phase cooling removes heat through a liquid-to-vapor phase change directly at the processor. This process enables significantly more efficient heat transfer while requiring substantially lower coolant flow than traditional liquid cooling approaches. The technology is particularly well suited to modern AI workloads, where processor power continues to increase and cooling systems must manage higher heat densities without consuming excessive facility resources. Within the HEATWISE project, ZutaCore's technology contributes to the project's hybrid cooling architecture. By enabling efficient heat capture at higher temperatures, the technology supports one of HEATWISE's central objectives: producing directly usable waste heat that can be integrated into building energy systems and reused rather than rejected to the environment. Demonstrating the Benefits of Hybrid Cooling Research conducted through the HEATWISE project demonstrated the practical advantages of combining two-phase direct-to-chip cooling with traditional air cooling. Testing showed that when using CPU only servers the facility water supplied for heat reuse could be maintained at more than 50°C at any load conditions. These elevated water temperatures enabled direct heat reuse, eliminating the need for a heat pump in many applications. The hybrid architecture also enabled the liquid cooling loop to capture up to 70% of the server heat load at elevated inlet temperatures, while using air immersion configuration to capture nearly 100% of the servers' heat output. The results demonstrate how advanced cooling technologies can extend the thermal capabilities of existing infrastructure while supporting more efficient operation and improved heat recovery. From Cooling Waste Heat to Reusing Energy One of the most important outcomes of HEATWISE is its focus on heat reuse. Traditionally, IT systems generate significant amounts of waste heat that are often rejected to the environment. HEATWISE explores how this thermal energy can instead be captured and reused within building energy systems, improving overall energy efficiency and reducing environmental impact. This creates an opportunity to improve overall energy utilization while reducing the environmental impact of digital infrastructure. As governments, operators, and enterprises place greater emphasis on sustainability, heat reuse is becoming an increasingly important component of future data center design. Advancing Sustainable Energy Management for IT-Intensive Buildings AI, edge computing, and high-performance workloads are accelerating the need for more efficient cooling technologies. HEATWISE demonstrates how two-phase liquid cooling can help address the industry's growing thermal and power challenges by improving cooling efficiency, reducing infrastructure overhead, supporting heat reuse, and enabling more effective use of available power. The European Commission's Innovation Radar recognition validates the importance of this work and highlights the role advanced cooling technologies will play in the future of edge data centers. ZutaCore is proud to contribute to HEATWISE alongside all the consortium partners helping develop technologies that support more sustainable, high-performance digital infrastructure. HEATWISE is co-funded by the European Commission and the Swiss State Secretariat for Education, Research and Innovation (SERI). Authors: Lilach Butchmits - HEATWISE Project Manager, ZutaCore Shahar Belkin - Chief Evangelist, ZutaCore

ZutaCore raises $100M Series C from Mitsubishi, Carrier, Samsung for waterless liquid cooling. June 3, 2026 at 6:18 PM - by MLQ Agent Key points. * ZutaCore closed a $100M+ Series C led by Mitsubishi Electric, Carrier Ventures, and Samsung Ventures, bringing total funding to ~$200M 1 * The round values ZutaCore at approximately $600M, with Goldman Sachs serving as exclusive placement agent 34 * Additional investors include Mitsubishi Heavy Industries, Daikin, and Israeli shipping company Zim 4 * ZutaCore's HyperCool platform has been deployed at 75+ sites across the Americas, Europe, and Asia, targeting processors exceeding 4,000W 12 * The company plans to hire ~50 additional employees and expand R&D for megawatt-class deployments 4 ZutaCore, the Foster City, California-headquartered liquid cooling startup, has closed a $100M+ Series C funding round backed by strategic investors Mitsubishi Electric, Carrier Ventures, and Samsung Ventures. The round, announced June 2, brings ZutaCore's total funding to approximately $200M and values the company at roughly $600M, according to Israeli financial outlet Calcalist 14. Goldman Sachs served as exclusive placement agent on the deal 2. Additional investors in the round include Mitsubishi Heavy Industries, Daikin, and Zim, the Israeli shipping company 4. The capital will fund global commercialization, R&D on next-generation thermal management, and support for megawatt-class cooling deployments 1. The fundraise lands amid surging demand for advanced cooling solutions driven by AI chip power densities that have outpaced traditional air-cooled infrastructure. ZutaCore's waterless, direct-to-chip, two-phase liquid cooling technology - branded HyperCool - is designed for processors drawing more than 4,000 watts, a threshold that next-generation AI accelerators are approaching 12. The technology. ZutaCore's HyperCool platform uses a dielectric fluid in a sealed, closed-loop system. The fluid boils at the chip surface, absorbing heat through phase change, then condenses and recirculates - eliminating the need for water entirely. The company claims a roughly 50% reduction in cooling energy consumption versus conventional air-cooled systems 2 . The system is compatible with processors from Intel, AMD, and Nvidia. Alongside the fundraise, ZutaCore announced OmniTherm, a new cold plate enabling waterless two-phase cooling for the Nvidia RTX PRO 6000 Blackwell Server Edition in a single-slot PCIe form factor 12 . ZutaCore operates a 2-megawatt end-of-row emulation platform at its R&D facility in Israel for large-scale testing before customer deployments 2. Strategic investors. The investor roster signals alignment with major industrial players in the data center thermal supply chain. Mitsubishi Electric is a global manufacturer of HVAC and electrical equipment for commercial buildings and data centers. Carrier Global (NYSE: CARR), through its venture arm, had previously invested in ZutaCore and is deepening its exposure as part of a broader push into data center liquid cooling 24 . Samsung Ventures, the corporate venture arm of Samsung Electronics, adds a semiconductor-side strategic angle - Samsung is both a chip manufacturer and a major memory supplier for AI infrastructure. Daikin, another investor in the round, is the world's largest HVAC manufacturer by revenue 4 . Carrier Global shares traded at $67.89 on June 3, up 2.2% on the day, with a market capitalization of approximately $56.4B 5. Company background. Founded in 2016 by CEO Erez Freibach, ZutaCore maintains its R&D and manufacturing operations at Sapirim Industrial Park in Sderot, Israel, with commercial headquarters in the United States and additional offices in Europe, India, and Taiwan 4 . The company currently employs roughly 140 people globally, with about 100 based in Israel. It plans to add approximately 50 employees, with 40 of those hires in Israel 4 . ZutaCore has recently expanded its leadership team, adding a CFO (Yaniv Reinhold), Chief Product Officer (Sharon Shafran as COO), and Chief R&D Officer (Yoni Nir), alongside existing executives including President and CRO Brian Lillie and Chief Product and Technology Officer My Truong 1. Market context. The round arrives as data center operators grapple with cooling infrastructure that cannot keep pace with AI accelerator roadmaps. Nvidia's next-generation Blackwell Ultra and Rubin platforms are expected to push per-chip thermal design power well beyond current levels, making direct-to-chip liquid cooling a near-requirement for dense AI clusters. ZutaCore competes in a crowded liquid cooling landscape that includes GRC (acquired by Vertiv), LiquidCool Solutions, Asetek, and several immersion cooling startups. Its differentiation centers on waterless operation - a meaningful advantage in water-scarce regions - and the two-phase approach, which offers higher heat transfer efficiency than single-phase liquid cooling. With 75+ deployments across the Americas, Europe, and Asia, ZutaCore is transitioning from pilot-stage installations to what the company describes as megawatt-class production deployments 12. Companies mentioned. Further sources. Written with AI assistance, verified and edited by its team. Questions? Contact MLQ.ai.

Mitsubishi Electric backs ZutaCore in $100m series C. ZutaCore, a Foster City, California-based startup developing waterless, direct-to-chip, two-phase liquid cooling systems for data centers, said on June 2 that it raised US$100 million in series C. The round was backed by Mitsubishi Electric, Carrier Ventures, Samsung Electronics via Samsung Ventures, and other investors. The funding will support commercialisation and research and development for AI and high-performance computing. The company said its platform uses two-phase direct-to-chip cooling in a sealed loop. A dielectric fluid boils at the processor, carries heat to a cooling distribution unit, then condenses and recirculates without water in the data hall. ZutaCore said it has completed more than 75 deployments across the Americas, Europe, and Asia. It also set up a 2-megawatt end-of-row emulation platform in Israel to test multi-megawatt cooling performance and system integration before customer rollouts. The raise comes as newer AI infrastructure such as Nvidia's GB200 NVL72 uses liquid cooling to increase compute density and energy efficiency. Carrier had already invested in 2025 through Carrier Ventures as part of a technology partnership tied to the company's data center thermal strategy. ZutaCore also named Yaniv Reinhold CFO, Sarah Warshavsky Oberman chief people officer, Yoni Nir chief research and development officer, and Sharon Shafran COO. Goldman Sachs & Co LLC acted as exclusive placement agent for the fundraising. Stay updated on the go with our mobile app. Get latest insights with smoother, more personalized experience through TIA mobile app. How would you feel if you could no longer use Tech in Asia? Share, tag us, and land on our Wall of!