We are looking for a Senior Staff Opto-Mechanical Engineer. As an opto-mechanical engineer on the Integrated Photonics team, you’ll be part of a cross-functional team whose mission is to lead IonQ on its journey to build the world’s best quantum computers to solve the world’s most complex problems. 

In this role, you will drive packaging and optomechanical design for the Integrated Photonics team, which are essential for integrating new devices and improving quantum computer performance. You will work cross-functionally with multiple teams of designers, engineers, and physicists; collect, review, and propose packaging requirements; drive packaging design decisions based on requirement analysis; develop and ensure adoption of alignment techniques; and drive forward the development of process and design changes for packaging and related parts to improve efficiency, performance, and throughput. You will work at the boundary between teams focused on the development of novel devices and the engineering and integration of those devices into production systems.

Responsibilities:

• Own the conception, implementation, and verification of the packaging solutions for various photonic integrated circuits (PICs) produced by the Integrated Photonics team. These include passive optical elements, ion traps, and lasers. 
• Research, design, and develop novel integration solutions to package ion traps, PICs, and micro and bulk optics in an ultra-high vacuum environment which can include 2.5/3D packaging, active optic alignment, thermal management at cryogenic temperatures, high density electrical feedthroughs, and hermetic sealing. 
• Design optomechanical systems to aid with prototype production, device testing, and system integration; provide mechanical drawings to various teams.
• Coordinate with optical, electrical, and mechanical teams to develop and define requirements for each interface and propose a fitting packaging solution.
• Manage external vendors to deliver custom components and materials on time that meet program requirements; propose engagement models for outsourcing aspects of packaging development and prototype production.
• Perform numerical simulations of mechanical designs to model e.g. mode frequency, thermal contraction during cryogenic cycling, thermal drift and stability, etc.
• Design and procure components, tools, fixtures, and materials for hands-on characterization, testing, and validation of packaging solutions.
• Develop, finalize and publish project timelines, identifying key milestones, risks, and completion dates.
• Conduct risk analysis and develop mitigation plans to ensure on-time release and delivery of project deliverables.
• Drive the transition of packaging solutions from prototyping to production, including developing first articles and technology demonstrations.
• Document design decisions and lead design reviews; standardize and document the PIC packaging process; train junior team members to support testing efforts, acting as a mentor for technical competence, prioritization, and company values.
• Provide packaging roadmap.

You’d be a good fit with: 

• Masters or higher in Engineering or a relevant field/discipline
• 15 - 18+ years of hands-on design and development of electronics or optical device packaging experience, ideally working with cryogenically-compatible packages containing both electronic and optical components; relevant experience in a similar field will also be considered
• 5+ years working in a fast-paced new product introduction (NPI) team to deliver novel products
• Experience identifying and using optoelectronic packaging techniques, components, and materials to manage mechanical stress and thermal expansion/contraction, as well as active and passive alignment techniques
• Experience working with laboratory automation hardware (microcontrollers, motorized stages/positioners, sensors, etc.)
• Hands-on experience with CAD tools for mechanical design (Solidworks PDM preferred)
• Experience with product development lifecycle concepts
• Experience with data aggregation and statistical analysis/reporting
• Excellent communication skills and abilities
  
  

You’d be a great fit with:

• PhD in Engineering, Physics or relevant field/discipline
• 13 - 15+ years of experience in developing novel packaging concepts for passive and active PICs as well as micro-optics for a wide range of applications
• 15+ years of experience in selecting and managing external vendors for optical packaging
• Expert in IC, optoelectronic, and hermetic packaging techniques
• Extensive knowledge of epoxy materials, curing processes, optical calibration, both theoretical and hands-on
• Programming experience in Python and other engineering relevant programming languages
• Ability to plan phase-gate qualification, document processes and progress, and present to different audiences
• Ultra-High Vacuum (UHV) device/component handling and knowledge of cryogenic and UHV-compatible materials
  
  

Location: This role is based onsite at our headquarters in College Park, MD with the option to work remotely several days a week at your discretion.
Travel: Less than 10%
Job ID:  1017

The approximate base salary range for this position is $187,358 - $245,300.