Job Details:
Job Description:
Responsibilities may be quite diverse of a nonexempt technical nature.
U.S. experience and education requirements will vary significantly depending on the unique needs of the job.
Job assignments are usually for the summer or for short periods during breaks from school.
This is an internship and compensation will be given accordingly based on candidate’s education level and internship duration.
The Packaging Research and Development Engineering Intern will look at defects and issues occurring within our products and processes.
Using a range of lab capabilities, they will gather and interpret data to provide insight into the root cause of the defect and recommend actions to aid resolution.
The ideal candidate will conduct hands on lab work, perform technical research, and utilize programming skills to create databases.
Other duties may include optimizing current lab capabilities for failure analysis to develop innovative techniques/approaches to accelerate failure identification and mechanism understanding.
The ideal candidate should exhibit the following behavioral traits:
This internship has a 6 month duration.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
Candidate must be pursuing a Master’s Degree with 6+ months of experience and or PhD Degree with 1+ years of experience in either Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Data Science, Statistics, Electrical Engineering, Chemistry, Physics or related field.
- Focus ion beam (FIB).
-Scanning Electron Microscopy (SEM).
-Laser processing.
-Data visualization and digital image processing, machine learning, and/or programming languages such as Python, SQL, etc.
Preferred Qualifications:
- Advanced microscopy techniques such as TEM.
- Light to matter interactions on various materials.
- Python and SQL programming.
- Semiconductor packaging technology.
Job Type:
Student / Intern
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
Business group:
As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence.
