Software Engineering – Intern

IBM and Red Hat launch Lightwell to address open source software security risks. IBM and Red Hat announced on July 8 the commercial launch of Lightwell, a suite of offerings designed to help enterprises reduce open source software risk through automated vulnerability remediation. The new platform includes Lightwell Network, now generally available, and Lightwell Clearinghouse Premier, which is entering a limited-availability phase for financial institutions. Lightwell Network provides access to over 6,500 remediated, digitally signed application-layer dependencies across major ecosystems such as Java and Python. Enterprises can receive continuous streams of binaries, source code, and compliance artifacts - including complete Software Bills of Materials - directly into their existing pipelines. Meanwhile, Lightwell Clearinghouse Premier will serve as an intermediary for secured patch embargoes and vertical threat coordination among participating organizations in regulated industries. The launch builds on IBM's and Red Hat's previously announced $5 billion commitment to open source security from May 2026. Backed by more than 20,000 engineers globally, the companies aim to scale AI-driven remediation capabilities for enterprise customers. "Lightwell represents a fundamental structural shift in how we secure all enterprise software," said Matt Hicks, President and CEO of Red Hat. "By pairing automated remediation with our deep engineering heritage, we aim to deliver the trusted infrastructure required to consume open source reliably, sustainably, and at AI speeds." Rob Thomas, Senior Vice President at IBM, added: "IBM and Red Hat are giving enterprises certified fixes they can pull straight into the systems they already run... backed by a growing network of technology and delivery partners." Industry leaders such as Amazon Web Services (AWS), AMD, F5 Networks, GitLab, Intel, JFrog, Microsoft, NVIDIA, Palo Alto Networks and ServiceNow are collaborating with IBM and Red Hat on Lightwell. Consulting partners including Accenture; Atos; Cognizant; Deloitte; EY cyber teams; HCLTech; Infosys; Kyndryl; LTM; NTT DATA; Tata Consultancy Services (TCS); Tech Mahindra - as well as IBM Consulting - are offering deployment services aimed at accelerating adoption among enterprise customers. With open source making up a significant portion of modern codebases - and rapid advances in generative AI increasing both development speed and potential vulnerabilities - the need for coordinated solutions has grown urgent. Scott DePasquale of ARC said, "No single institution can keep pace with the growing scale and complexity of open source vulnerabilities alone... initiatives that enable coordinated remediation have the potential to strengthen resilience across the industry." Supporting statements from executives at AMD, Atos, Cognizant, Deloitte, F5, HCLSoftware, Intel, JFrog, Kyndryl, LTM, Microsoft, NVIDIA, Palo Alto Networks to Tech Mahindra highlight broad industry support for collaborative approaches addressing software supply chain risk. Lightwell operates under an upstream-always model where security fixes are submitted back to originating communities for review. Future plans include expanding Clearinghouse Premier beyond financial services into government, healthcare, and telecommunications sectors.

Intel names former SK Hynix CEO Seok-Hee Lee as EVP of Intel Foundry; Naga Chandrasekaran will lead front-end technology development and front-end manufacturing (Juby Babu/Reuters). June 18, 2026 Discover more Featured podcasts. A show about the tech industry's inside conversation, hosted by tech reporter Alex Heath and founder whisperer Ellis Hamburger. Nick Bilton, Dick Costolo, and Paul Kedrosky pull back the curtain on AI, startups, and the future rushing toward Harmony Evans, all with healthy dose of irreverence. A podcast mostly about tech. Brought to you weekly by Angela Du, Sally Shin, Mac Bohannon, Helen Min, and Ashley Mayer. The Big Technology Podcast takes you behind the scenes in the tech world featuring interviews with plugged-in insiders and outside agitators. The future is already here. Each week, journalists Kevin Roose and Casey Newton explore and make sense of the latest in the rapidly changing world of tech. Microsoft Vice Chair and President Brad Smith speaks with leaders in government, business, and culture to explore the most critical challenges at the intersection of technology and society.

Intel's new 18A-P process enters production to fight TSMC for AI. by Zak Killian - Wednesday, June 17, 2026, 02:50 PM EDT Intel is taking the fight directly to TSMC with its latest foundry milestone, signaling that its aggressive turnaround strategy is bearing real fruit. At the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits, the company announced that its next-generation Intel 18A-P process node has officially entered the risk production phase. This is the performance-optimized version of Intel's standard 18A node, designed to offer a 9% boost in clocks at the same power, or up to an 18% reduction in power consumption at the same clock rates versus 18A. Crucially, Intel says that its 18A-P process utilizes the exact same design rules as its predecessor, meaning it serves as a seamless drop-in upgrade for companies trying to eke out extra performance without completely re-engineering their blueprints from scratch. That's mostly important for Intel at this stage, but it proves that Intel is capable of smooth transitions to optimized nodes. To achieve these gains, Intel is leaning heavily on structural improvements to the silicon itself. The company introduced a dual-contact transistor option that it calls "Power Boost," which lowers electrical resistance and unlocks higher clock frequencies under heavy loads. Thermal management also sees a major overhaul, with new packaging techniques slashing thermal resistance by up to 40% to keep these high-frequency chips running cooler. Thermal resistance is a major problem with dual-sided chips, which all 18A and 18A-P parts necessarily are due to the implementation of back-side power delivery, known as PowerVia. Of course, PowerVia has many advantages, too, and Intel is capitalizing on its early implementation of backside power delivery. You see, PowerVia moves the power routing wires underneath the transistors to clear up congestion on top. This physical separation has apparently yielded a tenfold reduction in dynamic voltage droop, and cleared out 11% more space on the chip layout, allowing for denser, more efficient chips. This architectural leap arrives at a critical moment as Intel attempts to position itself as the go-to alternative for massive AI and high-performance computing silicon. While TSMC remains the undisputed market leader, Intel's aggressive engineering roadmap has given it an architectural head start in key areas. TSMC's 2nm-class N2 node (currently in volume production, but no products have released with it yet) will debut its version of next-gen GAAFET gate-all-around transistors, but the Taiwanese giant is choosing to play it safe by leaving power delivery on the front of the chip for its entire N2 lifecycle. Backside power delivery isn't coming to TSMC until its 1.6-nanometer A16 node, effectively handing Intel a valuable window of opportunity to pitch its PowerVia-enabled 18A-P process to tech giants seeking maximum AI efficiency right now. Intel is also betting the farm on next-generation manufacturing hardware by heavily adopting ASML's ultra-expensive High-NA EUV lithography machines to print these microscopic features. TSMC, conversely, has publicly committed to stretching its existing, standard EUV machinery all the way through the end of the decade to keep production costs down for clients. For PC enthusiasts and the broader industry, this philosophical split represents the closest competitive race seen decades. Intel's 18A-P node entering risk production proves that the American chipmaker is hitting its strict engineering deadlines and is finally armed with the advanced architecture required to give TSMC a genuine run for its money. The only questions are whether Intel can secure big clients with big orders for chips... and whether Intel can execute well enough to fulfill those orders. A 30-year PC building veteran, Zak is a modern-day Renaissance man who may not be an expert on anything, but knows just a little about nearly everything.