Lead Package Design Engineer @ Tenstorrent

INACTIVE

Full-Time

Lead Package Design Engineer

Tenstorrent

201-500 employees

Builds next-generation computers for AI applications

Hardware

AI & Machine Learning

Senior, Expert

Austin, TX, USA

Requirements

BS/MS/PhD in EE/ECE/ME/ChemE or related disciplines
More than 10 years of experience in advanced packaging design and implementation
Hands-on experience with modeling thermo-mechanical stress and/or SI/PI
Well versed in advanced packaging techniques including InFO, CoWoS, FoCoS, EMIB variants, hybrid bonding
Excellent understanding of circuit, mechanical, and thermodynamic fundamentals
Experience with optical module integration is an asset

Responsibilities

All aspects of package design including SI/PI, STA, routing, reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
All aspects of package planning including pre/post silicon bring up, yield improvements, qualification, failure analysis, and system implementation
Collaborating with design engineers to develop a portfolio of chiplets that meets a huge range of price-performance design points while optimizing re-use
Meeting specifications for high speed interfaces such as HBM, DDR, GDDR, PCIE, 112G SerDes
Overseeing OSAT and substrate suppliers
Managing the production of the IC package, including monitoring the manufacturing process and ensuring that the package is produced to the required quality and reliability standards

The Tenstorrent team combines technologists from different disciplines who come together with a shared passion for AI and a deep desire to build great products. We value collaboration, curiosity, and a commitment to solving hard problems. Find out more about our culture.

The person hired for this role will lead package design for high-performance chiplets and SOCs. They will be involved in all stages, from concept to high-volume manufacturing, and will be responsible for designing packaging solutions that meet industry leading power, performance, and cost targets. The work will be done alongside a group of highly experienced engineers across various domains of the AI/ML chip.

Responsibilities

All aspects of package design including SI/PI, STA, routing, reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
All aspects of package planning including pre/post silicon bring up, yield improvements, qualification, failure analysis, and system implementation
Collaborating with design engineers to develop a portfolio of chiplets that meets a huge range of price-performance design points while optimizing re-use
Meeting specifications for high speed interfaces such as HBM, DDR, GDDR, PCIE, 112G SerDes
Overseeing OSAT and substrate suppliers
Managing the production of the IC package, including monitoring the manufacturing process and ensuring that the package is produced to the required quality and reliability standards

Experience & Qualifications

BS/MS/PhD in EE/ECE/ME/ChemE or related disciplines
More than 10 years of experience in advanced packaging design and implementation
Hands-on experience with modeling thermo-mechanical stress and/or SI/PI
Well versed in advanced packaging techniques including InFO, CoWoS, FoCoS, EMIB variants, hybrid bonding
Excellent understanding of circuit, mechanical, and thermodynamic fundamentals
Experience with optical module integration is an asset

Locations:

Austin, TX, Santa Clara, CA, or Toronto, Ontario

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been sanctioned by the U.S. government.

As this position will have direct and/or indirect access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency information and/or documentation will be required and considered as Tenstorrent moves through the employment process.

Tenstorrent

View

Website

View Company Profile

Tenstorrent, a global leader in AI computing, offers a unique work environment that fosters collaboration among experts in computer architecture, ASIC design, advanced systems, and neural network compilers. The company's competitive edge lies in its scalable RISC-V design, a testament to its commitment to technical innovation. With a diverse and inclusive culture spread across offices in Canada, the U.S., Belgrade, and Bangalore, Tenstorrent provides ample opportunities for growth and learning in the rapidly evolving AI industry.

Company Stage

Series C

Total Funding

$334.5M

Headquarters

Toronto, Canada

Founded

2016

Growth & Insights

Headcount

6 month growth

↑ 18%

1 year growth

↑ 72%

2 year growth

↑ 173%

INACTIVE