Lead Package Design Engineer
Posted on 1/5/2023

51-200 employees

Computer processor architecture manufacturer
Company Overview
Tenstorrent is on a mission to address the rapidly growing compute demands for software 2.0. The company designs processors that are optimized for neural network inference, training and can also execute other types of parallel computation.
Austin, TX, USA
Experience Level
  • BS/MS/PhD in EE/ECE/ME/ChemE or related disciplines
  • More than 10 years of experience in advanced packaging design and implementation
  • Hands-on experience with modeling thermo-mechanical stress and/or SI/PI
  • Well versed in advanced packaging techniques including InFO, CoWoS, FoCoS, EMIB variants, hybrid bonding
  • Excellent understanding of circuit, mechanical, and thermodynamic fundamentals
  • Experience with optical module integration is an asset
  • All aspects of package design including SI/PI, STA, routing, reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
  • All aspects of package planning including pre/post silicon bring up, yield improvements, qualification, failure analysis, and system implementation
  • Collaborating with design engineers to develop a portfolio of chiplets that meets a huge range of price-performance design points while optimizing re-use
  • Meeting specifications for high speed interfaces such as HBM, DDR, GDDR, PCIE, 112G SerDes
  • Overseeing OSAT and substrate suppliers
  • Managing the production of the IC package, including monitoring the manufacturing process and ensuring that the package is produced to the required quality and reliability standards