Microelectronics Numerical Simulation Engineer

• Partner with stakeholders internally and externally to develop numerical models that help in understanding material, configuration, manufacturing, and reliability trade-offs in electronic assemblies.
• Develop numerical models to capture different failure modes and physical phenomena expected during the entire microelectronics device lifecycle design, manufacturing, assembly, testing, and field operation.
• Partner with thermal, packaging, test, manufacturing, reliability and quality engineers to develop validated simulation-based design guidelines to ensure deployment of microelectronics assemblies.
• Design and develop test vehicles to generate experimental data required for model validation and enhancement.
• Participate in the development of roadmaps for materials, models and infrastructure required for numerical models in local and cloud based simulation environments. Attend conferences, standards bodies and related industry forums to get updated of the latest developments in numerical analysis.

Minimum qualifications:

• Bachelor's degree in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
• 8 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
• Experience with Finite Element Analysis and Computational Fluid Dynamics and programming languages like ANSYS (e.g., APDL, Workbench, Icepak), Flotherm, LS-Dyna, Abaqus, Fluent, Icepak, Matlab, Python.
• Experience in thermomechanical reliability and mechanical drop or shock simulation.
• Experience with Statistical Software tools (e.g., JMP, Weibull++, SPSS).

Preferred qualifications:

• Master's degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
• Experience in setting up manufacturing assembly processes, driving product launches and assembly process optimization within manufacturing operations.
• Experience in technical leadership, project management, and executive communication.
• Experience in Coupled Field/Multiphysics, Thermal-Electric simulations, Fluid-Solid Interaction.
• Experience in reliability prediction models, stochastic simulations, uncertainty analysis, multi-scale and multiobjective optimization.

• Bachelor's degree in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
• 8 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
• Experience with Finite Element Analysis and Computational Fluid Dynamics and programming languages like ANSYS (e.g., APDL, Workbench, Icepak), Flotherm, LS-Dyna, Abaqus, Fluent, Icepak, Matlab, Python.
• Experience in thermomechanical reliability and mechanical drop or shock simulation.
• Experience with Statistical Software tools (e.g., JMP, Weibull++, SPSS).