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GlobalFoundries

Semiconductor foundry delivering specialized chips

Quantum Superconducting Materials Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeMalta, NY, USA$143k - $247k

About the Job

Requirements

  • A Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited degree program.
  • At least 15 years of prior related work experience with an MS degree.
  • An overall GPA of at least 3.0 and proven good academic standing.
  • Fluency in written and spoken English.
  • Willingness to travel up to 20%.

Responsibilities

  • Lead selection and development of materials systems for cryogenic and superconducting packaging, including superconducting metals, interconnect materials, dielectric, substrate, and bonding interface materials.
  • Establish material schemes compatible with millikelvin-to-cryogenic operating environments.
  • Evaluate material suitability for electrical conductivity and superconductivity, thermal conductivity and isolation, and mechanical robustness under cryogenic cycling.
  • Drive integration of materials into 2D, 2.5D, and 3D advanced packaging architectures.
  • Define material stacks and interfaces across BEOL/RDL layers, interposers and TSVs, and bump and bonding interfaces.
  • Ensure material compatibility with process flows, tools, and downstream assembly operations.
  • Own materials-related process integration from early development through prototyping and qualification.
  • Drive process development, optimization, and control plans for deposition, plating, bonding, and surface preparation.
  • Enable prototypes and development lots to move smoothly across fab and assembly workflows.
  • Develop deep understanding of temperature-dependent material properties, including superconducting transitions, electrical resistivity and RF loss, thermal transport behavior, and mechanical stress/CTE mismatch.
  • Define and use electrical, thermal, and structural characterization methods to evaluate material performance.
  • Correlate material behavior with device- and system-level performance impacts.
  • Identify and analyze failure mechanisms, including delamination and interface failure, diffusion and intermetallic formation, and stress-induced cracking during thermal cycling.
  • Develop material solutions and process mitigations to enhance reliability.
  • Drive long-term reliability strategies for cryogenic operation.
  • Develop materials solutions that improve yield and process robustness and reduce cycle time and cost.
  • Partner with integration teams to ensure scalable and manufacturable material choices.
  • Work directly with material suppliers and equipment vendors to evaluate new materials, including superconducting films and hybrid materials, and define material specifications and qualifications.
  • Collaborate with OSATs and partners to enable wafer-level and die-level integration flows.
  • Interface with interconnect, bump, TSV, and assembly integration teams, as well as device, qubit, and system engineering teams.
  • Enable co-optimization of materials, process, and system architecture.
  • Drive development of next-generation materials for scalable quantum systems, including superconducting interconnect stacks and cryogenic-compatible dielectrics and bonding materials.
  • Contribute to the APPC quantum packaging roadmap and capability build-out.
  • Track and evaluate emerging materials and integration schemes.
  • Generate material specifications and process guidelines, integration documentation, and characterization reports.
  • Communicate results to internal and external stakeholders.
  • Support intellectual property generation, publications, and conference outputs.
  • Define materials strategy across multiple quantum platforms and customers.
  • Lead external technical engagements, such as R&D consortia, suppliers, and quantum customers.
  • Mentor engineers and establish materials selection frameworks and best practices.
  • Perform activities safely and responsibly and support Environmental, Health, Safety & Security requirements and programs.
  • Take part in hiring other Advanced Packaging team members in Singapore.
  • Mentor and guide new hires to assume their roles and responsibilities.
  • Perform other duties as assigned by the manager.

Desired Qualifications

  • A PhD education level with at least 12 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, or similar settings.
  • Project management skills, including the ability to innovate and execute on solutions that matter and navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning and organizational skills.

About the Company

GlobalFoundries

Semiconductor foundry delivering specialized chips

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company size
10,001+
Company stage
IPO
Headquarters
Town of Malta, New York
Founded
2009

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