Full-Time

Quantum Superconducting Materials Engineer

GlobalFoundries

GlobalFoundries

10,001+ employees

Semiconductor foundry delivering specialized chips

Compensation Overview

$143k - $247k/yr

Company Does Not Provide H1B Sponsorship

Malta, NY, USA

In Person

On-site in Malta, New York; up to 20% travel.

Master's, PhD

Category
Manufacturing & Process Engineering (1)
Required Skills
Quality Assurance (QA)

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Requirements
  • Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 15 years of prior related work experience.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.
Responsibilities
  • Lead selection and development of materials systems for cryogenic and superconducting packaging, including:\n + Superconducting metals (Nb, Al, NbN, etc.)\n + Interconnect materials (In, Cu, Sn-based systems)\n + Dielectric, substrate, and bonding interface materials
  • Establish material schemes compatible with millikelvin–cryogenic operating environments
  • Evaluate material suitability for:\n + Electrical conductivity / superconductivity\n + Thermal conductivity / isolation\n + Mechanical robustness under cryogenic cycling
  • Drive integration of materials into 2D, 2.5D, and 3D advanced packaging architectures.
  • Define material stacks and interfaces across:\n + BEOL / RDL layers\n + Interposers and TSVs\n + Bump and bonding interfaces
  • Ensure compatibility of materials with process flows, tools, and downstream assembly operations.
  • Own materials-related process integration from early development through prototyping and qualification.
  • Drive process development, optimization, and control plans for deposition, plating, bonding, and surface preparation.
  • Enable smooth movement of prototypes and development lots across fab and assembly workflows.
  • Develop deep understanding of temperature-dependent material properties including:\n + Superconducting transitions\n + Electrical resistivity and RF loss\n + Thermal transport behavior\n + Mechanical stress/CTE mismatch
  • Define and utilize characterization methods (electrical, thermal, structural) to evaluate materials performance.
  • Correlate material behavior with device- and system-level performance impacts.
  • Identify and analyze failure mechanisms, including:\n + Delamination and interface failure\n + Diffusion / intermetallic formation\n + Stress-induced cracking during thermal cycling
  • Develop material solutions and process mitigations to enhance reliability.
  • Drive long-term reliability strategies for cryogenic operation.
  • Develop materials solutions that:\n + Improve yield and process robustness\n + Reduce cycle time and cost
  • Partner with integration teams to ensure scalable and manufacturable material choices.
  • Work directly with material suppliers and equipment vendors to:\n + Evaluate new materials (e.g., superconducting films, hybrid materials)\n + Define material specifications and qualifications
  • Collaborate with OSATs and partners to enable wafer-level and die-level integration flows.
  • Interface across:\n + Interconnect / bump / TSV / assembly integration teams\n + Device / qubit / system engineering teams
  • Enable co-optimization of materials + process + system architecture.
  • Drive development of next-generation materials for scalable quantum systems, including:\n + Superconducting interconnect stacks\n + Cryogenic-compatible dielectrics and bonding materials
  • Contribute to APPC quantum packaging roadmap and capability build-out.
  • Track and evaluate emerging materials and integration schemes.
  • Generate:\n + Material specifications and process guidelines\n + Integration documentation and characterization reports
  • Communicate results to internal and external stakeholders.
  • Support IP generation, publications, and conference outputs.
  • Define materials strategy across multiple quantum platforms and customers.
  • Lead external technical engagements (e.g., R&D consortia, suppliers, quantum customers).
  • Mentor engineers and establish materials selection frameworks and best practices.
Desired Qualifications
  • Education – PhD education level preferred with at least 12 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning & organizational skills.

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify Jobs

Simplify's Take

What believers are saying

  • Q2 2026 revenue reached $1.786 billion, and management raised communications growth to 50-60%.
  • Silicon photonics revenue is set to roughly double in 2026, with 2028 run-rate above $1 billion.
  • GF won $300 million CHIPS Act funding and opened its $4 billion Singapore fab in 2026.

What critics are saying

  • Smart mobile devices were 36% of Q2 2026 revenue and face low-teens decline.
  • Tower Semiconductor litigation started March 26, 2026 and can consume management, cash, and customers.
  • High-80s utilization and oversubscribed SiGe through 2027 leave little room for demand shocks.

What makes GlobalFoundries unique

  • GF owns specialty nodes for RF-SOI, silicon photonics, and silicon-germanium.
  • GF runs fabs in the U.S., Europe, and Singapore, reducing supply-chain fragility.
  • GF stopped chasing 7nm in 2018, focusing on automotive, IoT, and communications chips.

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Benefits

Professional Development Budget

Growth & Insights and Company News

Headcount

6 month growth

-2%

1 year growth

-1%

2 year growth

-1%
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Kepler Computing has raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures, and Bill Gates to develop memory chips that bypass expensive extreme ultraviolet lithography. The San Jose startup uses ferroelectric materials and 3D stacking to increase high-bandwidth memory and SRAM density whilst working with existing semiconductor fabs. The company claims it can convert a fab to next-generation capability in eight months versus the typical 24-month timeline. However, the technology faces contamination challenges because its composite material includes iron, requiring dedicated equipment or encapsulation. Kepler has been testing at GlobalFoundries facilities in Singapore and Vermont, producing chips on approximately 2,000 wafers. The US Department of Commerce committed up to $245 million in July to support domestic development. First HBM samples are planned for late 2025, with US production targeted for 2028.

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