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GlobalFoundries

Semiconductor foundry delivering specialized chips

Quantum Superconducting Materials Engineer

Full-Time
$143k - $247k
Expert
Master's, PhD
Malta, NY, USA
In Person
Hardware Engineering
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • A Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited degree program.
  • At least 15 years of prior related work experience with a Master's degree.
  • An overall GPA of at least 3.0 and proven good academic standing.
  • Fluency in written and spoken English.
  • Ability to travel up to 20%.
Responsibilities
  • Lead selection and development of materials systems for cryogenic and superconducting packaging, including superconducting metals, interconnect materials, dielectric, substrate, and bonding interface materials.
  • Establish material schemes compatible with millikelvin-to-cryogenic operating environments.
  • Evaluate materials for electrical conductivity or superconductivity, thermal conductivity or isolation, and mechanical robustness under cryogenic cycling.
  • Drive integration of materials into 2D, 2.5D, and 3D advanced packaging architectures.
  • Define material stacks and interfaces across back-end-of-line and redistribution layers, interposers and through-silicon vias, and bump and bonding interfaces.
  • Ensure materials are compatible with process flows, tools, and downstream assembly operations.
  • Own materials-related process integration from early development through prototyping and qualification.
  • Drive process development, optimization, and control plans for deposition, plating, bonding, and surface preparation.
  • Enable movement of prototypes and development lots across fab and assembly workflows.
  • Develop understanding of temperature-dependent material properties, including superconducting transitions, electrical resistivity and radio-frequency loss, thermal transport behavior, and mechanical stress or coefficient-of-thermal-expansion mismatch.
  • Define and use electrical, thermal, and structural characterization methods to evaluate materials performance.
  • Correlate material behavior with device- and system-level performance impacts.
  • Identify and analyze failure mechanisms, including delamination and interface failure, diffusion or intermetallic formation, and stress-induced cracking during thermal cycling.
  • Develop material solutions and process mitigations to enhance reliability.
  • Drive long-term reliability strategies for cryogenic operation.
  • Develop materials solutions that improve yield and process robustness and reduce cycle time and cost.
  • Partner with integration teams to ensure scalable and manufacturable material choices.
  • Work with material suppliers and equipment vendors to evaluate new materials and define material specifications and qualifications.
  • Collaborate with outsourced semiconductor assembly and test providers and partners to enable wafer-level and die-level integration flows.
  • Interface with interconnect, bump, through-silicon-via, and assembly integration teams, as well as device, qubit, and system engineering teams.
  • Enable co-optimization of materials, process, and system architecture.
  • Drive development of next-generation materials for scalable quantum systems, including superconducting interconnect stacks and cryogenic-compatible dielectrics and bonding materials.
  • Contribute to the advanced packaging quantum packaging roadmap and capability build-out.
  • Track and evaluate emerging materials and integration schemes.
  • Generate material specifications and process guidelines, integration documentation, and characterization reports.
  • Communicate results to internal and external stakeholders.
  • Support intellectual property generation, publications, and conference outputs.
  • Define materials strategy across multiple quantum platforms and customers.
  • Lead external technical engagements, including research and development consortia, suppliers, and quantum customers.
  • Mentor engineers and establish materials selection frameworks and best practices.
  • Perform activities safely and responsibly and support Environmental, Health, Safety, and Security requirements and programs.
  • Take part in hiring other Advanced Packaging team members in Singapore.
  • Mentor and guide new hires to assume their roles and responsibilities.
  • Perform other duties as assigned by the manager.
Desired Qualifications
  • A PhD and at least 12 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, or similar settings.
  • Project management skills, including the ability to innovate and execute on solutions and navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning and organizational skills.

About the company

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify's Take

What believers are saying

  • Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
  • Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
  • SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.

What critics are saying

  • Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
  • Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
  • If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.

What makes GlobalFoundries unique

  • GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
  • Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
  • GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.

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Benefits

  • Professional Development Budget

Growth & Insights and Company News

Headcount

6 month growth

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1 year growth

0%

2 year growth

0%
Yahoo Finance
Oct 15th, 2026
US doubles GlobalFoundries stake to about 8% in deal with up to $21B Japan-backed chip plants

The US government has doubled its equity stake in chipmaker GlobalFoundries to nearly 8%, President Donald Trump announced Wednesday. He said the stake is now "worth over 2 Billion Dollars" in a company with a market capitalisation of about $27.2 billion. The deal reallocates a $955 million award under the 2022 Chips and Science Act toward modernising the company's facilities. GlobalFoundries said the government is taking an additional stake of about 4%. A new vehicle co-owned by the US and Japanese governments will fund two fabrication plants, described as "up to $21 billion" in investment, with about $10 billion initially. GlobalFoundries will build and operate them, and expects about $3 billion in compensation over the next decade. The first plant is due online in 2029, the second in 2031.

Guggenheim Partners
Oct 14th, 2026
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative | GlobalFoundries

GF has been selected as the technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative.

Sohu
Oct 14th, 2026
GlobalFoundries to build two New York chip plants with up to $21B from Japan, US to take 4% stake

GlobalFoundries will build two new chip factories at its existing site in upstate New York, according to a deal announced on October 14. Japan's government will provide up to $21 billion in funding. The US government will buy about 4% of the company's shares. The two plants will be jointly held by the US and Japan. The new factories will make basic chips, reducing reliance on suppliers in East Asia.

Bloomberg
Oct 14th, 2026
GlobalFoundries to build two chip plants with up to $21B in Japanese backing

GlobalFoundries Inc. plans to build two new chip plants with backing of as much as $21 billion from the Japanese government. The arrangement is part of a US-Japan deal that also includes the US taking a 4% stake in the company.

Yahoo Finance
Oct 8th, 2026
TSMC signs $2B deal with GlobalFoundries for AI chip silicon interposers at New York plant

GlobalFoundries shares rose nearly 6% Thursday after announcing a $2 billion manufacturing deal with Taiwan Semiconductor Manufacturing Company to produce silicon interposers at its New York facility. The five-year agreement will support expanded manufacturing capacity, with volume production expected to begin in the first half of 2028. The facility is set to become the first US-based source of silicon interposers for advanced packaging technologies. These components are crucial for TSMC's Chip-on-Wafer-on-Substrate technology, which connects AI processors with high-bandwidth memory. The deal addresses constraints in TSMC's CoWoS packaging capacity, which has become a bottleneck for AI chip production. Counterpoint Research estimates the supply-demand gap could remain around 20% in 2026 before narrowing to roughly 10% in 2027.