Full-Time

Senior Analog/RF Layout Engineer

Phizenix

Phizenix

No salary listed

Bengaluru, Karnataka, India

Hybrid

Hybrid role based in Bengaluru; some on-site days may be required.

Bachelor's

Category
Electrical Engineering (1)
Required Skills
Linux/Unix

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Requirements
  • Bachelor's in Electrical Engineering or related (Master's degree a plus)
  • 6–8 years in custom IC layout for analog, mixed-signal, and high-speed designs
  • Strong foundation in matching, symmetry, shielding, parasitic control, thermal management, and signal integrity, with interest in growing into layout leadership
  • Command of device-level techniques (common-centroid, interdigitation, guard rings, isolation structures)
  • Solid grasp of DRC, LVS, ERC, parasitic extraction, EM/IR analysis, and physical signoff flows; comfortable working in Linux
  • Bachelor's or Master's in Electrical Engineering or equivalent field
  • 3+ years of layout design experience in analog, mixed-signal, or high-speed IC development
  • Hands-on experience taking block-level layout through tapeout
  • Strong custom-layout, physical-verification, and parasitic-aware implementation skills with Cadence Virtuoso or comparable tools
  • Familiarity with ASIC/SoC tapeout processes and layout automation scripting is preferred
Responsibilities
  • Drive layout and physical implementation of analog/mixed-signal circuits, high-speed interfaces (SerDes, PAM4), and supporting digital blocks
  • Own block-level floorplanning, placement, routing, and integration for complex mixed-signal ICs
  • Translate schematics and performance targets into optimized layouts—tuned for matching, parasitics, signal/power integrity, thermal behavior, yield, and manufacturability
  • Ensure compliance with all foundry rules (DRC, LVS, ERC, density, EM/IR, reliability)
  • Support top-level assembly across analog, digital, and high-speed domains (SerDes, PAM4 paths, clocking, control logic)
  • Review post-layout extraction and support simulation closure, applying best practices for symmetry, shielding, and isolation
  • Partner with packaging and product teams on bump planning, pad ring, ESD structures, and package integration
  • Drive layout-related issues affecting performance, yield, or production readiness; contribute to reviews on feasibility, tradeoffs, and tapeout risk
  • Support tapeout readiness (database checks, signoff), CAD flow/automation improvements, mentoring of junior engineers, and post-silicon debug of layout issues
Desired Qualifications
  • Familiarity with ASIC/SoC tapeout processes and layout automation scripting is preferred

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