Full-Time
Senior Process Engineer
Dry Etch
Posted on 4/18/2026
Intel
10,001+ employees
Pioneers microprocessors, CPUs for PCs
Compensation Overview
$155.5k - $298.4k/yr
Company Historically Provides H1B Sponsorship
Hillsboro, OR, USA + 1 more
More locations: Phoenix, AZ, USA
Hybrid
Hybrid work model; on-site at Hillsboro, OR and off-site work allowed.
 Process Engineering |
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- Bachelor's degree in Electrical Engineering, Physics, Material Science or a STEM-related field of study
- 7+ years of hands-on experience in CMOS device engineering, device physics, logic architecture, and interconnect development on leading-edge nodes
- Direct etch experience in advanced CMOS device technology
- Knowledge of Design of Experiment principles and engineering data analysis tools
- Semiconductor foundry experience
- Drive technology development initiatives that enable both high-volume manufacturing and future technology advancement
- Provide comprehensive process integration and equipment solutions
- Conduct feasibility studies to meet target device specifications
- Lead design and development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design
- Optimize production output for existing products
- Partner with key equipment and materials suppliers to develop enabling technology elements
- Perform process technology feasibility studies using theoretical simulations and practical engineering methods
- Stay current with industrial process and material manufacturing trends
- Develop insights into future Intel process technology needs
- Partner with vendor ecosystem to build cost-sensitive technology roadmaps
- Influence and drive technical direction across Intel and the broader industry
- Develop and mentor technical leaders within the organization
- Act as a change agent while modeling Intel values
- Align organizational goals with technical vision and formulate strategic technical direction
- Demonstrate proven execution in bringing products and technologies to market
- This role involves close collaboration with Logic Technology Development (LTD) and Technology and Foundry Supply Manufacturing (TFSM) teams to support a comprehensive range of applications and customer requirements
- Advanced degree (MS/PhD) in Electrical Engineering, Physics, Material Science or a STEM-related field of study
- Hands-on experience with sub-3nm Gate-All-Around (GAA) FETs
- Experience in ramp and high-volume manufacturing environments
- Experience with industry standards and certifications
- Experience with device parametric data generation and analysis
- Demonstrated success in foundry New Product Introduction (NPI) activities and complex tape-out troubleshooting
- Experience in product data interpretation, root cause analysis, and solution development
- Knowledge of Design of Experiment principles and engineering data analysis tools
Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1999
Simplify's Take
What believers are saying
- Apple agrees to manufacture chips on Intel 18A, reducing TSMC reliance.
- Data center AI revenue surges 22% to $5.1B in Q1 2026.
- OpenAI MRC partnership accelerates Intel's AI supercomputer networking role.
What critics are saying
- $3.9B Mobileye impairment causes $3.7B Q1 2026 GAAP loss.
- Gross margins drop from 41% to 39% in Q2 2026 on 18A costs.
- AMD's EPYC erodes Intel x86 share as server CPU market hits $120B by 2030.
What makes Intel unique
- Intel Foundry's 18A node enters production with yields exceeding targets.
- Nova Lake CPUs launch H2 2026 with 52 cores and 288MB cache.
- Intel Capital invests $20B in Cloud, Devices, Frontier, Silicon domains.
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Your Connections
People at Intel who can refer or advise you
Benefits
We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.
Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.
Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.
Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.
Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.
Growth & Insights and Company News
6 month growth
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↑ 1%Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar. Bhubaneswar: Intel CEO Lip-Bu Tan Sunday said that the Rs 2000 crore 3D Glass Solution project in Bhubaneswar is a major step toward strengthing India's semiconductor ecosystem and advancing global technology collaboration. Joining the groundbreaking ceremony of the Project on virtual mode, the Intel CEO Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth. Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the government of Odisha for their proactive support and partnership in enabling the project. Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space. Highlighting Odisha's strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing. The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India's role in the semiconductor industry. Odisha CM Majhi today laid the foundation stone for project in Info Valley, Bhubaneswar, in the presence of Union Electronics & IT Minister Aswini Vaishnaw and Odisha Electronics & IT Minister Mukesh Mahalinga. Odisha Chief Secretary Ms. Anu Garg, E & IT Additional Chief Secretary Vishal Dev, Union E & IT Additional Secretary Amitesh Sinha, and 3D Glass Solution President & CEO Babu Mandaba were also present at the event. It may be mentioned here that Intel is associated with 3D Glass Solutions for long.
Intel has launched its Core Series 3 processors, marking the first time in years that non-Ultra Core CPUs feature genuinely new silicon. Codenamed Wildcat Lake, these chips represent a departure from previous non-Ultra models, which relied on the outdated Raptor Lake architecture from 2023's 13th-generation Core family. The new processors use two silicon tiles: a compute tile with up to two Cougar Cove P-cores, four Darkmont E-cores, and Xe3 integrated graphics, plus a platform controller tile. Built on Intel's 18A manufacturing process, they support up to 48GB LPDDR5X-7467 memory and operate at 15W base power. However, the chips' 17 TOPS NPU falls short of Microsoft's 40 TOPS requirement for Copilot+ PC features. Intel claims over 70 designs from partners will launch in coming months.
Intel has hired Samsung Electronics executive vice president Shawn Han to bolster its foundry business as the chipmaker seeks to expand in outsourced chip manufacturing. Han will join Intel next month as general manager of foundry services, reporting to Naga Chandrasekaran, head of Intel's foundry division. The appointment reflects Intel's push to attract customers to its manufacturing operations. Han's extensive experience at Samsung, a major player in contract chipmaking, is expected to support Intel's efforts to compete in the foundry market.
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Intel has appointed Aparna Bawa as Executive Vice President and Chief Legal & People Officer, overseeing global legal, ethics, compliance, people and culture functions. She will report directly to CEO Lip-Bu Tan. Bawa joins from Zoom during a period of significant transformation at Intel. The company's shares have risen 28.3% over the past week and 42.4% over the past month, trading at $65.17. The combined role places legal risk management, culture and talent decisions under single leadership as Intel reshapes itself around AI, foundry services and major cloud and automotive clients. With recent agreements involving Google, SambaNova and the Terafab project with Tesla, SpaceX and xAI, Intel faces increasingly complex contracts and regulatory exposure. The appointment signals how the company is organising to support long-term execution during operational transformation.