Full-Time

Process Engineer IV

Confirmed live in the last 24 hours

Applied Materials

Applied Materials

10,001+ employees

Materials engineering for semiconductor and display manufacturing

Compensation Overview

$128k - $176k/yr

+ Bonus + Stock Award Program

Senior

Company Historically Provides H1B Sponsorship

Kalispell, MT, USA

Travel required: 20% of the time

Category
Process Engineering
Required Skills
Data Analysis
Requirements
  • Demonstrates depth and/or breadth of expertise in own specialized discipline or field
  • Interprets internal/external business challenges and recommends best practices to improve products, processes or services
  • Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions
  • Communicates difficult concepts and negotiates with others to adopt a different point of view
Responsibilities
  • Design, collect data, analyze and compile reports on a wide range of complex process engineering experiments for multiple products, within safety guidelines
  • Utilize techniques to characterize hardware, define methods and apply new technologies to characterize hardware, and/or perform hardware characterization on a wide range of complex systems for multiple products, within safety guidelines
  • Generate internal and external documentation for products, presentations, technical reports and generate process engineering specifications
  • Develop, plan and execute process engineering projects, within safety guidelines
  • Train engineers in measurement techniques of film properties and guide them in the interpretation of the data, new methodologies, trouble shooting techniques and resolve a wide range of complex process engineering issues/problems for multiple products
  • Interact with customers to resolve a wide range of complex process engineering issues/problems with limited to no supervision
  • Design and implement new technology, products and analytical instrumentation
  • Identify, select and work with vendors and suppliers with limited to no supervision

Applied Materials specializes in materials engineering solutions, focusing on the production of advanced semiconductor chips and displays. The company provides equipment, services, and software that allow clients to modify materials at atomic levels, which is essential for creating next-generation electronic devices. Unlike many competitors, Applied Materials emphasizes precision in materials engineering, enabling clients to innovate effectively. The goal of Applied Materials is to transform technological possibilities into reality, supporting advancements across various industries.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1967

Simplify Jobs

Simplify's Take

What believers are saying

  • Collaboration with CEA-Leti boosts innovation in energy-efficient AI data centers.
  • Investment in BE Semiconductor Industries strengthens semiconductor packaging capabilities.
  • Intel's EPIC Supplier Award highlights strong industry reputation and reliability.

What critics are saying

  • China's semiconductor self-reliance could reduce market share for Applied Materials.
  • Quantum computing collaboration may face delays due to nascent technology challenges.
  • Hybrid bonding technology investment may not yield returns if adoption is slow.

What makes Applied Materials unique

  • Leader in materials engineering for semiconductor and display manufacturing.
  • Provides atomic-level precision in material modification for next-gen devices.
  • Strong partnerships with tech firms and display manufacturers enhance market position.

Help us improve and share your feedback! Did you find this helpful?

Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Relocation Assistance

Performance Bonus

Stock Options

Flexible Work Hours

Company News

EE Journal
Jun 16th, 2025
Applied Materials And Cea-Leti Expand Joint Lab To Drive Innovation In Specialty Chips

Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions To Enable More Energy-Efficient AI Data CentersSANTA CLARA, Calif. and GRENOBLE, France, June 16, 2025 – Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Through an expansion of their joint lab, the organizations plan to develop materials engineering solutions to address emerging infrastructure challenges in AI data centers. The joint lab is focused on device innovations for chipmakers serving ICAPS markets (IoT, Communications, Automotive, Power and Sensors). These specialty chips are used in a wide range of applications – from industrial automation to electric vehicles – and they play a critical role managing data and power distribution within data centers

Keekli
May 22nd, 2025
Ashwini Vaishnaw Calls for Unified Industry-Academia Action to Drive Workforce Readiness for Viksit Bharat 2047

NAMTECH has also partnered with Siemens India, Analog Devices Inc., and Applied Materials Inc. to develop infrastructure, training labs, and scholarship programs in key sectors like semiconductors, robotics, and advanced manufacturing.

Teknovation
May 6th, 2025
U News | Tech Visionary Chris Klaus Empowers Georgia Tech Grads To Launch Start-Ups

From the Georgia Institute of Technology: In a bold move to ignite Atlantas entrepreneurial spirit, renowned tech entrepreneur and Georgia Tech alumnus Christopher W. Klaus announced during his Georgia Tech... The post U News | Tech visionary Chris Klaus empowers Georgia Tech grads to launch start-ups appeared first on Teknovation.biz.

The Qubit Report
May 2nd, 2025
May Day! Quantum Computing Sees New Partnerships, AI Advances, and Policy Support

The company is working with Applied Materials to create a 300-mm manufacturing process for superconducting transition edge sensors.

Canadian Manufacturing
May 1st, 2025
Xanadu announces a quantum computing collaboration with Applied Materials

TORONTO - Xanadu Quantum Technologies Inc., a photonic quantum computing company based in Toronto, Canada, is collaborating with Applied Materials, Inc., a company involved in materials engineering, to develop a 300 mm high-volume-compatible process for building superconducting transition edge sensors (TESs).