Full-Time
Senior Staff / Principal SoC Floorplan Lead
EnCharge AI
51-200 employees
Analog in-memory AI hardware and software
No salary listed
Bengaluru, Karnataka, India
In Person
Bachelor's, Master's, PhD
 Hardware Engineering (1) |
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- At least 12 years of hands-on experience in physical design SoC floorplanning, preferably in the data center domain, including at least 3 years as a lead or primary owner of SoC-level floorplanning.
- A proven track record of taping out large, complex chips for data center, networking, or artificial intelligence and machine learning applications.
- Deep understanding of how Register-Transfer Level structures and architectural decisions affect physical design power, performance, and area.
- Extensive experience with bump planning, flip-chip package requirements, and die-to-package co-optimization.
- Strong knowledge of analog/mixed-signal intellectual property integration, shielding, and custom routing constraints.
- Expertise with industry-standard physical design tools, specifically Cadence Innovus.
- A Bachelor of Science, Master of Science, or Doctor of Philosophy in Electrical Engineering, Computer Engineering, or a related field.
- Own the SoC-level floorplan from concept to tape-out for high-performance, large-scale artificial intelligence and data center chips on advanced process nodes such as 5 nanometers and 3 nanometers or below.
- Partner with architecture and Register-Transfer Level teams to provide early physical feasibility feedback, drive block partitioning and shape optimization, and plan data flow to optimize power, performance, and area.
- Lead bump planning and input/output ring definition, and work with packaging teams on flip-chip and advanced packaging constraints to optimize signal escape and power delivery.
- Manage placement and custom routing strategies for critical analog/mixed-signal intellectual property, high-speed SerDes, including PCIe and Ethernet, memory interfaces, phase-locked loops, and sensitive clock distributions.
- Design and analyze the top-level power delivery network, ensuring robust power delivery for high-current artificial intelligence workloads while minimizing IR drop.
- Manage macro placement, block-level pin assignments, and top-level feedthrough planning to optimize global timing and routing congestion.
- Build and maintain scalable floorplanning workflows and scripts using Tool Command Language and Python.
- Experience with multi-die or chiplet integration, including 2.5D packaging, 3D packaging, interposers, or Universal Chiplet Interconnect Express.
- Strong scripting and automation skills using Tool Command Language, Python, Perl, and Makefile.
- Knowledge of advanced clocking architectures, including H-trees and meshes, for highly synchronous artificial intelligence fabrics.
EnCharge AI develops hardware and software for artificial intelligence computation, ranging from edge devices to cloud servers. The company utilizes analog in-memory computing through chiplets, ASICs, and PCIe cards to process AI tasks directly within memory, which reduces the power and space required for complex calculations. Unlike competitors using traditional digital methods, EnCharge AI offers significantly lower CO2 emissions and a lower total cost of ownership by integrating its specialized technology into the existing semiconductor supply chain. The company's goal is to democratize advanced AI by making it economically viable and sustainable for businesses to solve large-scale human challenges.
Company Size
51-200
Company Stage
Series B
Total Funding
$162.9M
Headquarters
Santa Clara, California
Founded
2022
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Simplify's Take
What believers are saying
- February 13, 2025 Series B raised over $100 million from Tiger Global and Samsung Ventures.
- EN100 offers 200+ TOPS in 8.25W, attracting OEMs for on-device AI.
- CES 2026 highlighted on-device AI demand, directly matching EnCharge's edge-to-cloud pitch.
What critics are saying
- EnCharge lacks broad commercial shipments; 2025 launch claims still need OEM design wins.
- NVIDIA, Qualcomm, and Intel dominate client AI silicon, crushing EnCharge's pricing power.
- If EN100 misses volume production in 2026, EnCharge fails as a hardware startup.
What makes EnCharge AI unique
- EnCharge's analog in-memory chips perform matrix math inside memory, slashing energy use.
- EN100 launched May 29, 2025 with M.2 and PCIe forms for laptops, workstations.
- Princeton roots, Naveen Verma leadership, and 150 patents support technical credibility.
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Benefits
Health Insurance
401(k) Retirement Plan
Remote Work Options
Growth & Insights and Company News
6 month growth
↓ -2%1 year growth
↓ -3%2 year growth
↓ -4%EnCharge AI has introduced the EN100 accelerator to run AI inference directly on local devices.
EnCharge AI, an AI chip startup from Princeton University, has raised $144 million to advance its analog in-memory computing technology. Their EN100 AI accelerator chip offers improved performance per watt, enabling advanced AI on laptops and edge devices while reducing energy use. The funding will help expand their technology and software suite. Investors include Tiger Global, Samsung Ventures, and others. The company is poised for growth in the AI PC and edge device market.
EnCharge AI has appointed Jason Huang as VP of Finance and Leslie Szeto as Director of HR following a $100 million Series B funding round. Huang will enhance financial strategy for growth, while Szeto will focus on talent acquisition and organizational development. These hires support EnCharge's transition from development to commercialization of its AI accelerator products. Huang and Szeto bring extensive experience in high-growth transitions, IPOs, and acquisitions.
EnCharge AI has secured over $100 million in a Series B funding round, bringing its total funding to over $144 million. The company is developing a new AI accelerator chip that aims to match desktop GPU performance with only 1% of the power consumption. Their chip, which uses analog capacitors for computation, is expected to launch later this year for mobile devices, PCs, and workstations, with commercialization planned for 2025.
EnCharge AI raises $100m from Samsung, Foxconn.