Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Lead a group of wafer process integration engineers for magnetic recording head development.
• Design and architect integrated wafer processes/flow for next generation magnetic head by utilizing material/wafer fabrication, characterization, and data analysis knowledge.
• Work closely with module engineering teams to develop processes in sub-building blocks and validate process scheme to ensure it satisfying both design and manufactory robustness needs. 
• Interfaced with Design/Program teams to understand device performance requirements; and define physical metrics in wafer processes that fulfill such requirements.
• Pull and analyze data from inline wafer and backend database; establish inline processes to backend performance correlation and build prediction model; identify the process optimization opportunities and set up DOE to drive the improvement activities.
• Troubleshoot the defect and performance failure related to wafer process/integration and provide fix solution in timely manner.
• Work closely with sister site process/integration team for process transfer and product matching.
• Manage and control inline wafer WIP; set up process disposition route for product and process development; Maintaining or creating detailed documentation of product/process information.

Qualifications

Requirements

For consideration you MUST HAVE:

• MS or PhD in Physics, EE, ChemE, ME, Materials Science or related disciplines.
• 5+ years of experience in wafer processing for HDD or related industry.  Direct experience in wafer process integration, or hands on experience with multiple wafer processes, such as photolithography, ion mill, thin film deposition, plating/etching, CVD, RIE, CMP, QST testing are plus.
• Outstanding statistical analysis skill, SPC, proficient in JMP, Matlab, SQL etc.
• Optical related experience is a plus
• Creative, self-motivated, honest, and team player