Full-Time
Power Electronics Application Engineer
Nexperia
1,001-5,000 employees
Manufactures discrete semiconductors, logic devices, MOSFETs
No salary listed
Manchester, UK
In Person
Bachelor's
 Software Engineering (1) |
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- A degree or equivalent in Electronics Engineering, Power Electronics, Physics, or a relevant discipline.
- Significant experience in power electronics, with the ability to operate as a technical authority in customer-facing and cross-functional environments.
- The legal right and willingness to travel globally, occasionally at short notice to key technology hubs such as the United States and Asia, without significant visa processing delays.
- Interest in artificial intelligence infrastructure and data centre power systems.
- Provide technical leadership for the development and deployment of reliable power protection, power distribution, and conversion/control solutions across strategic growth markets.
- Develop system-level understanding of next-generation power distribution architectures, including emerging high-voltage direct-current power architectures in artificial intelligence and 48V intermediate bus systems in artificial intelligence and telecommunications.
- Work with application engineers, product managers, field engineers, sales teams, and key customers to shape application strategy, influence product roadmaps, and support new business development.
- Design, debug, and validate MOSFET-based circuits for high-current systems.
- Create technical literature, demonstration boards, reference designs, design-in tools, simulations, and evaluation testbenches for advanced power distribution architectures such as 48V power distribution systems.
- Work with field teams and customers to translate customer requirements, application trends, and system-level challenges into new product specifications and roadmap inputs.
- Act as a technical interface for strategic customers, global sales teams, field application engineers, and internal stakeholders.
- Represent the business as a subject matter expert in customer meetings, customer visits, internal technical discussions, training sessions, and industry-facing activities.
- Experience in artificial intelligence infrastructure, data centre, server power, telecommunications, industrial, automotive, or other high-reliability power systems.
- Experience working with common power electronics applications and 48V systems.
- Expertise in circuit simulation, including SIMPLIS, LTspice, or PSpice, and printed circuit board design.
- Knowledge of high-current MOSFET operation, MOSFET safe operating area, transient analysis, and thermal design.
- Proven expertise in circuit simulation, including LTspice, PSpice, SIMPLIS, or equivalent, and printed circuit board design.
Nexperia operates as a global supplier of semiconductor components, focusing on discrete semiconductors, logic devices, and MOSFETs. It serves automotive and industrial customers, providing parts that help electronic systems manage power, process signals, and protect data. The company designs, manufactures, and distributes these high-performance components, which are used in applications such as power management, autonomous driving, and data protection. Compared with competitors, Nexperia emphasizes reliability, quality, and targeted expertise in automotive and industrial markets, supported by ongoing improvement and product development. Its goal is to maintain leadership in supplying essential semiconductor parts that enable safer, more efficient, and more capable electronic systems.
Company Size
1,001-5,000
Company Stage
Acquired
Total Funding
$880M
Headquarters
Nijmegen, Netherlands
Founded
1953
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Simplify's Take
What believers are saying
- June 2026 GaN expansion added 35, 50, and 70 mΩ devices for high-power designs.
- June 9, 2026 QDPAK SiC MOSFETs added top-side cooling for EV and datacenter customers.
- February 16, 2026 Invest International loan funded global capacity expansion and line modernization.
What critics are saying
- September 30, 2025 Dutch control and China's export restrictions fractured Nexperia's supply chain.
- Wingtech's ownership fight and court supervision keep management distracted through 2026.
- A forced Dutch divestiture or Chinese retaliation permanently splits Nexperia's manufacturing network.
What makes Nexperia unique
- Nexperia owns wafer fabrication, packaging, and test, reducing dependence on foundries.
- Its 2026 300mm power-discrete ramp boosts output and cost per die versus 200mm lines.
- Automotive-qualified discrete, GaN, and SiC portfolios target EV, datacenter, and industrial power.
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Benefits
Flexible Work Hours
Paid Vacation
Commuter Benefits
Employee Discounts
Company Social Events
Performance Bonus
Paid Sick Leave
Life Insurance
Parental Leave
Professional Development Budget
Growth & Insights and Company News
6 month growth
↑ 2%1 year growth
↑ 2%2 year growth
↑ 2%UK awards £65m for zero-emission vehicle technologies. The UK government has awarded almost £65 million to automotive technology projects as it begins allocating funding under its DRIVE35 programme. The latest awards target the development, commercialisation and manufacturing of zero-emission vehicle technologies as well as connected and automated mobility. By Carla Westerheide 11.08.2026 - 07:36 The funding will support projects ranging from EV batteries and electric motors to power electronics and recycling. Industry will match the government contribution, bringing total investment to nearly £130 million and supporting more than 1,800 jobs. Nearly £50 million of government funding will go towards projects designed to bring zero-emission vehicle technologies towards commercial production. Recipients range from carmaker Bentley and electric motor manufacturer YASA to companies specialising in batteries, power electronics and recycling. Funding targets batteries, motors and power electronics. The largest share of the funding announced for zero-emission technologies, £26.9 million, will go to five companies through DRIVE35's Scale Up fund. Turntide Technologies, EMPEL Systems, Cornish Lithium, Strip Tinning and Watercycle Technologies will receive support to move their technologies towards commercial production. Another £8 million has been allocated to two collaborative projects involving industry and academia. One brings together Bentley and battery startup Ionetic to localise battery cell and pack production for future vehicles. The other is led by Q5D Technologies and involves JLR, Artifex Interior Systems and the University of Warwick. Their AutoLoom project aims to industrialise automated production of vehicle wiring looms. The government is providing a further £9 million to ten projects at an earlier stage of development. Among them, electric motor manufacturer YASA will demonstrate a motor that does not use rare-earth materials. Green Tech Industries plans to develop what it describes as the UK's first automated EV battery disassembly plant, while semiconductor manufacturer Nexperia will develop a new transistor architecture designed to improve the efficiency of EV electrical systems. Eatron Technologies, meanwhile, is working on a 48-volt battery management system using next-generation Infineon chips. Smaller companies are also included in the latest funding round. Through the Mobilise programme, 16 SMEs, startups and spinouts will share £2.7 million for projects covering areas including material recycling, electric motor technology, cybersecurity and connectivity. Beyond zero-emission vehicle technologies, the government is putting £17 million into nine projects under its Connected and Automated Mobility (CAM) Pathfinder programme. Nissan and the University of Warwick's Warwick Manufacturing Group are among the participants, with their ADventure project focusing on an autonomous mobility service for cities. Other funded projects cover brake-by-wire technology for Level 4 automated vehicles, autonomous airport vehicles and automated road maintenance equipment. "Britain invented the modern motor industry and we're determined to ensure the next generation of vehicles are designed and built here too," said Industry Minister Blair McDougall. "This investment will secure skilled jobs, strengthen our manufacturing heartlands and help drive the reindustrialisation of Britain." DRIVE35 provides long-term support through 2035. The awards form part of DRIVE35, which the British government unveiled in July 2025 as a long-term programme to support the transition to zero-emission vehicle manufacturing. As previously reported, the programme was initially presented with £2 billion in funding through 2030 plus £500 million for automotive research and development through 2035. The government now describes DRIVE35 as a £4 billion programme running to 2035. The funding is awarded by the Department for Business, Innovation, Science and Trade through the Advanced Propulsion Centre UK in partnership with Innovate UK. DRIVE35 is intended to support vehicle production, battery manufacturing, automotive technology companies and domestic supply chains as the UK automotive industry transitions towards zero-emission vehicles. 0 comments. about "UK awards £65m for zero-emission vehicle technologies"
Future Electronics and Nexperia highlight a resilient partnership built on engineering excellence and supply chain confidence. Montreal, Canada (forpressrelease) August 4, 2026 - Future Electronics, a global leading distributor of electronic components, is highlighting Nexperia's commitment to engineering excellence, manufacturing integrity, and long-term operational resilience through a featured content campaign focused on building confidence throughout the electronics design lifecycle. In today's rapidly evolving electronics industry, engineers require more than high-performance components. They need assurance that the products they select are supported by stable manufacturing operations, dependable supply chains, and long-term availability. Nexperia continues to demonstrate a strong commitment to these priorities, reinforcing its reputation as a trusted supplier for customers around the world. With a focus on operational stability and business continuity, Nexperia maintains a resilient manufacturing model designed to support long-term customer requirements across multiple markets. Its strong European manufacturing presence, including operations in the Netherlands, contributes to a geographically balanced production strategy that enhances supply chain resilience, governance, and traceability. Nexperia's approach aligns with increasing industry demand for responsible sourcing and sustainable manufacturing practices while maintaining the high standards of quality, performance, and efficiency expected by engineers and product designers. Through its partnership with Nexperia, Future Electronics provides customers with access to proven product architectures engineered for long-term application relevance, supported by disciplined quality systems and operational excellence. Combined with Future Electronics' technical expertise and global distribution network, customers benefit from a reliable foundation for both new designs and ongoing production programs. By combining Nexperia's robust portfolio with comprehensive engineering support and supply chain capabilities, Future Electronics enables customers to design with confidence while reducing risk and supporting long-term project success. Engineers, designers, and purchasing professionals are invited to discover how resilient partnerships and dependable manufacturing can help strengthen their next generation of electronic designs. To learn more about Nexperia solutions available through Future Electronics, visit the dedicated campaign page. About Future Electronics: Future Electronics is a global leader in the electronic components industry. The company's award-winning customer service, comprehensive global supply chain programs, and industry leading engineering design expertise make it a strategic partner of choice for customers worldwide. A WT Microelectronics company, Future Electronics is headquartered in Montreal, Canada, and operates in 44 countries and 159 offices. Its global footprint enables exceptional service and efficient, end to end supply chain solutions. The company is fully integrated and supported by a single IT infrastructure that provides real-time inventory visibility and seamless global operations, sales, and marketing capabilities. For more information, visit www.FutureElectronics.com. Media Contact Jamie Singerman Corporate Vice President Worldwide Future Electronics www.FutureElectronics.com 514-694-7710 Fax: 514-693-6051 [email protected] ### Company :-Jamie Singerman User :- Jamie Singerman Email :[email protected] Phone :-514-694-7710 * Charitable Foundation * 1040ez online form * Income tax forms * Form Tax
Nexperia grows 650V GaN FET portfolio. Wednesday 10th June 2026 Range now includes multiple RDS(on) classes and industry-standard packages Nexperia has announced an expanded portfolio of 650V industrial-grade high-power GaN FETs for demanding power conversion applications. The portfolio includes devices in 35 mΩ, 50 mΩ and 70 mΩ, offered in industry-standard TO-247-3, TO-247-4, TOLL and TOLT packages. The extended portfolio provides power engineers with greater flexibility to balance efficiency, thermal performance and power density across high-power applications, including datacenter and telecom power supplies, renewable energy systems, battery energy storage (BESS), and industrial drives and automation. "The transition towards wide-bandgap power semiconductors is accelerating across industrial, energy and AI infrastructure applications," said Andrea Bricconi, VP and head of Nexperia's GaN product group. "As efficiency, power density and thermal requirements continue to increase, we're focused on making GaN more accessible and scalable for engineers designing high-power applications. Expanding our 650V GaN portfolio is an important step in that direction - and only the beginning of what we're building in the wide-bandgap space". In high-power LLC stages typical of 10-12 kW AI server PSUs, the use of GaN devices enables ~0.8-1.2 percent efficiency improvement at full load compared to silicon, while supporting ~40-70 percent increases in power density at the stage level, driven by higher switching frequencies and reduced passive component size. In a typical 1 kW high-voltage motor drive, GaN devices can reduce inverter power losses by approximately 20-25 percent, enabling an efficiency improvement of ~1-1.5 percent while also supporting smaller thermal management solutions and higher overall system power density. Built on Nexperia's GaN technology platform, the devices combine fast switching characteristics, low switching losses, controlled dynamic behaviour, and robust thermal performance with a range of industry-standard package options. This enables optimisation of both electrical and mechanical design parameters while supporting straightforward integration into existing power system architectures. The 35 mΩ and 70 mΩ devices are available now in TOLL, TOLT, TO-247-3, and TO-247-4 packages, with further 50 mΩ variants scheduled for Q3 2026.
Nexperia and Semikron Danfoss explore strategic collaboration on SiC Power Modules for automotive applications. Combining semiconductor and module expertise to advance high-performance solutions for electric vehicles. Nuremberg, Germany / Nijmegen, Netherlands; June 9, 2026 - Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The collaboration aims to combine Nexperia's expertise in SiC semiconductor technology with Semikron Danfoss' leading capabilities in power module packaging and integration. Together, the companies intend to evaluate how a joint approach can enable high-performance, scalable solutions for next-generation electric vehicles. SiC technology plays a critical role in improving the efficiency, power density, and performance of electric drivetrains. By bringing together complementary competencies across the value chain - from chip to module - the companies aim to advance optimized solutions tailored to the demanding requirements of automotive applications. As part of the collaboration, both companies will explore joint engineering approaches, including early integration and co-design, to unlock the full performance potential of SiC-based systems. Carsten Götte, SVP Semikron Danfoss Automotive Power Modules Division, said: "By combining advanced semiconductor technology from Nexperia with our module expertise, we see strong potential to achieve more together than either could alone. We look forward to exploring how this collaboration can create additional value for our customers in the rapidly evolving electric vehicle market." Edoardo Merli, SVP and Head of Business Group Wide Bandgap, IGBT & Modules (WIM), Nexperia, said: "Strong partnerships are essential to unlocking the full potential of wide bandgap technologies, including SiC and GaN. With our continued R&D investments and strong focus on early-stage collaboration, we actively drive the alignment of semiconductor and system requirements from the outset. We are excited to explore how this partnership with Semikron Danfoss, a global leader in power electronics, can advance our module offering." Both companies share a strong European heritage and longstanding industry experience, providing a solid foundation for exploring future collaboration opportunities in the automotive power electronics space. * Semikron Danfoss: www.semikron-danfoss.com * Nexperia's wide bandgap semiconductor technology: www.nexperia.com/technology-hub/wide-bandgap-semiconductors
Nexperia brings QDPAK packaging to 1200V SiC MOSFETs. Tuesday 9th June 2026 Top-side cooled SMD package provides practical route to higher power density and efficiency Nexperia has released 1200V SiC MOSFETs in QDPAK packaging with a top-side cooled surface-mount package optimised for high-power density and thermally demanding applications. Designed for high-efficiency, high-voltage power conversion applications, these devices enable the electrical performance of Nexperia's SiC technology with simplified thermal management and mechanical integration, enabling higher output power, increased efficiency and improved thermal performance in compact designs. Available in both industrial-grade and automotive-qualified variants, the portfolio offers RDS(on) options of 17, 30, 40, 60 and 80 mΩ, delivering a scalable QDPAK platform for applications ranging from high-power systems to compact designs with demanding thermal and mechanical constraints. QDPAK packaging addresses the problem of heat dissipation through the PCB. By enabling a direct die-to-heatsink thermal path from the top side of the package, these devices reduce reliance on the board as the primary heat-spreading path and allow the semiconductor and PCB thermal domains to be managed more independently. Compared to conventional D2PAK-7 packaging, top-side cooled packages can deliver up to 3 kW higher output power at comparable thermal limits, while also providing around 40 °C additional thermal headroom at the same power level. Building on the existing X.PAK platform, QDPAK further extends power handling capability, enabling operation at approximately 3 kW higher power at comparable case temperatures, while offering around 23 °C additional thermal headroom at similar power levels. The devices are suitable for EV onboard chargers (OBC), high-voltage DC-DC converters, EV charging infrastructure, photovoltaic inverters, uninterruptible power supplies (UPS), motor drives and datacenter power systems, QDPAK devices help engineers optimise both electrical and mechanical system performance.