Full-Time
Global Technical Leader
Data Center Architecture and Customer Engagement
Posted on 8/22/2025
Intel
10,001+ employees
Pioneers microprocessors, CPUs for PCs
Compensation Overview
$214k - $302.1k/yr
Company Historically Provides H1B Sponsorship
Austin, TX, USA + 3 more
More locations: Santa Clara, CA, USA | Hillsboro, OR, USA | Phoenix, AZ, USA
In Person
This role will require an on-site presence.
US Top Secret Clearance Required
 Sales & Solution Engineering (1) |
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- Deep architectural expertise across at least three of the following: data center systems, networking, storage, power and cooling, rack-level integration, platform software, or security infrastructure.
- Demonstrated experience leading cross-functional technical teams with customer-facing responsibilities.
- Strong executive communication and technical storytelling skills.
- Proven ability to operate across organizational boundaries and influence product development and strategy.
- Build and Lead the Data Center Architecture and Customer Engagement Team: Establish, scale, and manage a global organization of high-impact technical pods composed of specialized architects in networking, storage, compute systems, software, and security.
- Drive Systems-Level Customer Engagements: Lead with architecture, not just products. Enable the team to operate as trusted engineering partners embedded in the world's most demanding infrastructure deployments.
- Engage Across the Stack: Bridge the physical and logical layers of data center design - from facility planning and power and cooling to rack integration, orchestration software, and workload optimization.
- Accelerate Intel Wins in Strategic Programs: Align with sales leaders and business units to secure critical design wins across AI, HPC, cloud, enterprise, and telco segments.
- Act as Technical Voice at Executive Level: Represent Intel's technical vision to senior customer engineering teams, CTOs, CIOs, and infrastructure decision-makers around the globe.
- Shape the Product Feedback Loop: Capture real-time technical insights and pain points from the field to influence Intel's roadmap and accelerate solution delivery.
- Experience designing or deploying AI infrastructure at scale (AI factories, GPU clusters, sovereign clouds).
- Global customer engagement experience, especially in multinational or government-regulated environments.
Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1999
Simplify's Take
What believers are saying
- Data center and AI revenue surges 22% to $5.1 billion in Q1 2026 amid agentic AI boom.
- Nova Lake launches H2 2026 with 52 desktop cores and 288MB cache challenging AMD dominance.
- OpenAI MRC protocol partnership accelerates Intel's networking in 131,000-GPU supercomputers.
What critics are saying
- Gross margins drop from 41% Q1 to 39% Q2 2026 due to 18A ramp costs and input inflation.
- TSMC's 2nm volumes outpace Intel 18A yields below 50% by Q4 2026, ceding foundry market.
- $3.9 billion Mobileye impairment triggers further $1-2 billion write-downs in 2027.
What makes Intel unique
- Intel pioneers hybrid CPU architectures with Coyote Cove P-cores and Arctic Wolf E-cores in Nova Lake.
- Intel Capital invests $500 million in China Technology Fund II targeting wireless broadband and clean tech.
- Intel leads agentic AI CPUs coordinating workloads and memory for autonomous task execution.
- Intel's 18A foundry node enables custom data center CPUs via Nvidia's $5 billion investment.
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Benefits
We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.
Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.
Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.
Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.
Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.
Growth & Insights and Company News
6 month growth
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↑ 1%Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar. Bhubaneswar: Intel CEO Lip-Bu Tan Sunday said that the Rs 2000 crore 3D Glass Solution project in Bhubaneswar is a major step toward strengthing India's semiconductor ecosystem and advancing global technology collaboration. Joining the groundbreaking ceremony of the Project on virtual mode, the Intel CEO Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth. Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the government of Odisha for their proactive support and partnership in enabling the project. Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space. Highlighting Odisha's strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing. The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India's role in the semiconductor industry. Odisha CM Majhi today laid the foundation stone for project in Info Valley, Bhubaneswar, in the presence of Union Electronics & IT Minister Aswini Vaishnaw and Odisha Electronics & IT Minister Mukesh Mahalinga. Odisha Chief Secretary Ms. Anu Garg, E & IT Additional Chief Secretary Vishal Dev, Union E & IT Additional Secretary Amitesh Sinha, and 3D Glass Solution President & CEO Babu Mandaba were also present at the event. It may be mentioned here that Intel is associated with 3D Glass Solutions for long.
Intel has launched its Core Series 3 processors, marking the first time in years that non-Ultra Core CPUs feature genuinely new silicon. Codenamed Wildcat Lake, these chips represent a departure from previous non-Ultra models, which relied on the outdated Raptor Lake architecture from 2023's 13th-generation Core family. The new processors use two silicon tiles: a compute tile with up to two Cougar Cove P-cores, four Darkmont E-cores, and Xe3 integrated graphics, plus a platform controller tile. Built on Intel's 18A manufacturing process, they support up to 48GB LPDDR5X-7467 memory and operate at 15W base power. However, the chips' 17 TOPS NPU falls short of Microsoft's 40 TOPS requirement for Copilot+ PC features. Intel claims over 70 designs from partners will launch in coming months.
Intel has hired Samsung Electronics executive vice president Shawn Han to bolster its foundry business as the chipmaker seeks to expand in outsourced chip manufacturing. Han will join Intel next month as general manager of foundry services, reporting to Naga Chandrasekaran, head of Intel's foundry division. The appointment reflects Intel's push to attract customers to its manufacturing operations. Han's extensive experience at Samsung, a major player in contract chipmaking, is expected to support Intel's efforts to compete in the foundry market.
I cannot generate a summary for this article as it is written in German, not English. The task requires me to work with English-language source material to produce an English-language business news summary. If you would like a summary of this article, please provide an English translation of the content, or provide a different article in English.
Intel has appointed Aparna Bawa as Executive Vice President and Chief Legal & People Officer, overseeing global legal, ethics, compliance, people and culture functions. She will report directly to CEO Lip-Bu Tan. Bawa joins from Zoom during a period of significant transformation at Intel. The company's shares have risen 28.3% over the past week and 42.4% over the past month, trading at $65.17. The combined role places legal risk management, culture and talent decisions under single leadership as Intel reshapes itself around AI, foundry services and major cloud and automotive clients. With recent agreements involving Google, SambaNova and the Terafab project with Tesla, SpaceX and xAI, Intel faces increasingly complex contracts and regulatory exposure. The appointment signals how the company is organising to support long-term execution during operational transformation.