Full-Time

Senior Laser & Semiconductor Optical Amplifiers Characterization Engineer

Lightmatter

Lightmatter

201-500 employees

Photonic computing hardware for AI acceleration

Compensation Overview

$210k - $267k/yr

+ Equity Grant + Performance-based Equity

Mountain View, CA, USA

Hybrid

Hybrid role; on-site in Mountain View, CA required.

Category
Electrical Engineering (1)
Required Skills
Python
MATLAB
Oscilloscope

Get referred to Lightmatter

Find people who can refer or advise you

Requirements
  • PhD or Master’s degree in Electrical Engineering, Physics, Applied Physics, Photonics, Optics, or a related technical field.
  • 5+ years of hands-on experience in semiconductor laser, SOA, photonics, or optical device characterization.
  • Strong understanding of semiconductor laser physics, optical gain, carrier dynamics, rate equations, thermal effects, feedback sensitivity, linewidth, RIN, and optical noise mechanisms.
  • Deep hands-on experience with optical and electro-optical lab measurements.
  • Strong familiarity with laser characterization metrics such as threshold current, slope efficiency, wall-plug efficiency, LIV curves, SMSR, RIN, linewidth, wavelength tuning, optical spectrum, power stability, and wavelength stability.
  • Strong understanding of semiconductor optical amplifiers, including gain, saturation behavior, ASE, noise, carrier dynamics, polarization dependence, wavelength dependence, and thermal effects.
  • Experience operating optical and RF instruments, including laser current drivers, TEC controllers, OSAs, optical power meters, photodetectors, RF spectrum analyzers, oscilloscopes, bias tees, optical filters, polarization controllers, optical switches, and fiber-coupled components.
  • Strong Python programming experience for instrument automation, data analysis, plotting, statistical analysis, and automated reporting.
  • Experience using software tools for device design support, modeling, simulation, or data-driven analysis.
  • Strong analytical skills and ability to debug open-ended device, setup, and measurement problems independently.
  • Ability to communicate complex technical results clearly and drive conclusions across design, characterization, packaging, and systems teams.
Responsibilities
  • Lead hands-on characterization of semiconductor lasers, tunable laser sources, DFB lasers, DBR/ECL lasers, laser diodes, and semiconductor optical amplifiers.
  • Measure and analyze key laser and SOA performance metrics, including output power, wavelength, optical spectrum, SMSR, RIN, linewidth, gain, saturation power, ASE, noise figure, tuning behavior, optical stability, wavelength stability, and thermal sensitivity.
  • Develop advanced LIV, L-I-V-T, wavelength tuning, power stability, RIN, SMSR, linewidth, and long-term drift measurement methodologies.
  • Characterize devices across current, voltage, temperature, optical loading, polarization, optical feedback, aging, and operating conditions.
  • Analyze SOA gain, gain saturation, wavelength-dependent gain, polarization-dependent gain, ASE noise, carrier dynamics, thermal behavior, and nonlinear effects.
  • Build, validate, and maintain automated optical and RF measurement setups using Python, PyVISA, LabVIEW, MATLAB, or similar tools.
  • Use modeling and design-analysis software to support characterization planning and data interpretation, including tools for laser physics, optical gain, rate-equation analysis, thermal modeling, optical spectrum analysis, and system-level performance estimation.
  • Develop scripts and software workflows for instrument control, automated data collection, calibration, data processing, visualization, statistical analysis, and automated reporting.
  • Debug complex optical, electrical, RF, and thermal measurement issues, including optical coupling, polarization sensitivity, back-reflection, RF noise, grounding, calibration error, thermal drift, and instrument limitations.
  • Define measurement best practices, calibration procedures, data quality checks, and test documentation standards.
  • Translate characterization results into actionable feedback for laser design, photonics integration, packaging, system architecture, and reliability teams.
  • Support device bring-up from early engineering samples through mature validation and production-readiness phases.
  • Mentor junior engineers and help establish high-quality characterization practices across the team.
  • Prepare clear technical reports, design reviews, data summaries, and recommendations for cross-functional engineering teams.
Desired Qualifications
  • PhD in Electrical Engineering, Physics, Applied Physics, Photonics, Optics, or a related field.
  • Prior experience characterizing DFB lasers, DBR lasers, tunable lasers, ECLs, laser diodes, or SOAs for integrated photonics or optical communication systems.
  • Experience with advanced laser-noise measurements, including RIN, linewidth, phase noise, frequency noise, optical feedback sensitivity, and relaxation oscillation analysis.
  • Familiarity with laser and SOA modeling, including rate-equation modeling, gain modeling, thermal modeling, optical feedback analysis, and wavelength tuning behavior.
  • Experience using commercial or internal simulation/design tools for photonic device analysis, laser design support, or system-level optical performance modeling.
  • Experience with III-V semiconductor materials, heterogeneous integration, laser packaging, fiber coupling, optical isolators, and thermal control.
  • Experience with high-speed optical or RF measurements involving fast photodetectors, RF spectrum analyzers, oscilloscopes, LNAs, bias tees, and calibration/de-embedding.
  • Experience developing automated test platforms for device characterization and validation.
  • Experience analyzing large characterization datasets and creating automated dashboards or reports.
  • Experience supporting reliability, qualification, or production-oriented validation of semiconductor lasers or optical amplifiers.
  • Demonstrated ability to lead technical work independently, define test strategy, mentor junior engineers, and influence cross-functional engineering decisions.

Lightmatter develops photonic computing hardware to speed up AI workloads using light-based processing. Their photonic systems run AI tasks faster and use about 90% less energy than traditional processors. They target AI and autonomous vehicle workloads and collaborate with universities to advance electro-photonic systems. Revenue comes from hardware sales, software licenses, and partnerships, with a goal of bringing scalable photonic computing to market for faster, energy-efficient AI and AV applications.

Company Size

201-500

Company Stage

Series D

Total Funding

$822M

Headquarters

Boston, Massachusetts

Founded

2017

Get referred to Lightmatter

Find people who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • NVIDIA NVLink Fusion integration strengthens enterprise credibility and ecosystem access.
  • Guide DR and Passage L20 directly target hyperscaler bandwidth and rack-density bottlenecks.
  • vClick Optics and partner validation can reduce packaging risk and speed adoption.

What critics are saying

  • NVIDIA can bundle comparable optical interconnects and compress Lightmatter's pricing power.
  • Guide DR sampling starts in Q4 2026, leaving rivals time to win design-ins.
  • Passage L20 is a temporary bridge, exposing customers to architecture-skipping risk.

What makes Lightmatter unique

  • Photonic chips replace electrical interconnects with light for AI scale-up bandwidth.
  • Passage and Envise address both chip communication and matrix computation.
  • Lightmatter targets co-packaged optics, near-package optics, and laser networking products.

Help us improve and share your feedback! Did you find this helpful?

Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Health Savings Account/Flexible Spending Account

Unlimited Paid Time Off

Flexible Work Hours

Remote Work Options

Paid Vacation

Paid Sick Leave

Paid Holidays

Sabbatical Leave

Hybrid Work Options

Stock Options

Company Equity

401(k) Retirement Plan

Wellness Program

Mental Health Support

Gym Membership

Phone/Internet Stipend

Home Office Stipend

Commuter Benefits

Training & Development

Conference Attendance Budget

Professional Development Budget

Family Planning Benefits

Fertility Treatment Support

Adoption Assistance

Childcare Support

Elder Care Support

Relocation Assistance

Employee Referral Bonus

Tuition Reimbursement

Professional Certification Support

Mentorship Program

Meal Benefits

Employee Discounts

Company Social Events

Growth & Insights and Company News

Headcount

6 month growth

-1%

1 year growth

2%

2 year growth

0%
Business Wire
Mar 11th, 2026
Lightmatter achieves record 1.6 Tbps per fiber with photonic interconnect chiplet

Lightmatter has achieved a record-breaking 1.6 Tbps throughput per fibre with its Passage Co-Packaged Optics chiplet, marking a significant milestone in AI interconnect performance. The technology, developed in collaboration with Qualcomm Technologies, uses a 16-wavelength DWDM architecture and delivers up to eight times more bandwidth per fibre than existing solutions. The silicon-proven platform combines Lightmatter's photonic engine with Qualcomm Technologies' 112G PAM4 optical SerDes chiplet, addressing interconnect bottlenecks limiting AI model scaling. The architecture reduces power consumption whilst enabling connectivity for next-generation processors and switches, with Passage L-Series photonic engines on track to deliver 100 Tbps and beyond. The record-breaking Passage L-Series photonic interconnects are now available through evaluation kits for lead customer testing.

The Associated Press
Mar 11th, 2026
Lightmatter launches vClick Optics, first detachable fiber array for high-volume CPO production with <1.5 dB loss

Lightmatter has unveiled vClick Optics, the industry's first detachable fibre array unit for co-packaged optics advanced packaging. The technology enables high-volume manufacturing of 3D CPO-enabled chips by allowing manufacturers to verify optical engines before final integration, reducing yield loss risks. vClick Optics achieves insertion loss below 1.5 dB and supports high-bandwidth Dense Wavelength Division Multiplexing for 32-100Tbps optical interconnects. The technology integrates SENKO's connector solutions with Lightmatter's photonic technology and is compatible with advanced packaging flows from major foundries. Developed in partnership with ASE and SENKO Advanced Components, vClick transforms permanent fibre attachment into a plug-and-play solution. Lightmatter will showcase the technology at the Optical Fiber Communication conference in Los Angeles from 15-19 March 2026.

The Register
Mar 11th, 2026
Lightmatter's photonics chip cuts datacenter fiber costs in half with 6.4Tbps bidirectional tech

Lightmatter has unveiled its Passage L20 optical engine, designed to halve fibre usage in datacentres through near-package optics (NPO) rather than co-packaged optics. The chip, aimed at a 2027 launch, connects via copper to switch ASICs and breaks signals into up to 32 bidirectional fibres operating at 200 Gbps each. The L20 offers 6.4 Tbps throughput whilst consuming 30 watts. Just 16 units could replace 512 traditional 200 Gbps pluggable modules in a 102.4 Tbps switch, significantly reducing power consumption. CEO Nick Harris views NPO as a temporary solution before co-packaged optics arrive around 2028. Lightmatter also introduced vClick, a surface-attach fibre array compatible with advanced packaging technologies. The company expects to begin sampling L20 chips in late 2026.

Yahoo Finance
Jan 29th, 2026
Synopsys ties up with Lightmatter on co-packaged optics for AI chips

Synopsys has partnered with Lightmatter to integrate its 224G SerDes and UCIe IP into Lightmatter's Passage 3D Co-Packaged Optics platform, targeting low-latency, high-bandwidth AI infrastructure. The collaboration reinforces Synopsys' positioning in co-packaged optics and high-speed connectivity for AI chips. However, analysts suggest the deal alone is unlikely to materially shift near-term prospects compared to larger catalysts like first-quarter 2026 results due 25 February and progress integrating Ansys following recent debt issuance. Fair value estimates from the Simply Wall St Community range widely from $376,000 to $556,000 per share. With Synopsys trading at a premium valuation, investors face execution risks around AI initiatives and Ansys integration. The company's shares have declined but may be up to 36% below fair value.

Business Wire
Jan 27th, 2026
Lightmatter and GUC partner to bring 3D co-packaged optics solutions to AI hyperscalers

Lightmatter, a leader in photonic interconnect solutions for AI, has partnered with Global Unichip Corp. (GUC) to commercialise Passage 3D Co-Packaged Optics solutions for hyperscale AI infrastructure. The collaboration combines Lightmatter's photonic interconnect technology with GUC's ASIC design and advanced packaging expertise. The Passage platform uses silicon photonics to deliver enhanced bandwidth density and power efficiency for chip-to-chip communications, addressing connectivity bottlenecks in next-generation AI and high-performance computing workloads. By extending AI cluster scale-up capabilities across multiple racks, the solution aims to improve training time and throughput for frontier AI models. GUC will integrate Passage into its ASIC designs using advanced node chiplet and packaging workflows. The partnership targets hyperscale data centre operators seeking to overcome bandwidth and power constraints.