Salary Range: 100000 to 200000 (Currency: USD) (Pay period: per-year-salary)

What you will do:

• Payload Computer Product Definition and Design:
• Define next generation payload computer product requirements and conduct meticulous trade-offs.
• Design complex high-speed digital/analogue circuit boards from datasheet to completion for pre-production prototypes. 
• Alongside the development teams, continue to contribute to problem solving with alternatives and feasibility studies.
• Prototyping and Testing:
• Procure and integrate evaluation modules and reference designs to complete a proof-of-concept operation of the platform.
• Design and build adaptation and break-out boards to create demonstration platforms as a stepping stone to full product development.  
• Identify and specify space-grade components and materials for Low-Earth Orbit (LEO) operations.
• Integration and Collaboration:
• Work with the software development teams to verify processing performance and memory bandwidth for the communications protocol stacks.
• Collaborate closely with international satellite development teams, including RF, Electrical, Mechanical, and Product teams.
• Working with junior team members to mentor skills development.
• Product Roadmap and Research:
• Actively contribute to and lead the payload computer roadmap.
• Conduct research in innovative communications systems architectures aligned with the evolving needs of the satellite network.
• Documentation and Communication:
• Prepare comprehensive documentation for design reviews.
• Effectively communicate technical information to diverse audiences. 

What you bring to this role:

• Bachelor’s degree or higher in Electronics/Telecommunication Engineering.
• To be thrilled to be a part of a multi-disciplined and multi-geographical team.
• Proven experience in leading the design and development of complex communications systems.
• Design experience with complex microprocessor/DSP devices – working from supplier reference design and evaluation boards.
• 15+ years of experience in electronics hardware design including analysis, simulation, schematic capture, PCB layout, and testing.
• Design experience in the selection of components, taking into account not only the design specification, but also environmental, cost, EOL, lead time, etc.
• Low level power supply design experience, using simulation (LTspice) and knowledge of power managers and monitoring devices.
• Design experience of complex clocking and timing solutions including jitter, phase noise measurements.
• Design experience with on-board high speed data buses (e.g: PCIe, Serdes, JESD) – including analysis
• Design experience with low/medium speed data buses (e.g: I2C, SPI, LVDS, PECL, RS422, LAN, CAN etc). 
• Design experience of schematic capture and layout of complex PCBs, using the Mentor or Altium Design tool.
• Proficiency performing circuit analysis using suitable simulation tools (e,g: SPICE etc).
• Hands-on attitude to problem-solving, using test equipment – Scopes, DSOs, DMMs, Soldering Iron, ENV chamber.
• Experience with thermal design techniques.
• Demonstrated success working in a dynamic environment.
• Experience with the full V-Model  design cycle, from requirement capture through to design verification.

Bonus points:

• Master’s degree in Electrical Engineering or equivalent.
• Design experience with on-board high speed data buses (e.g: PCIe, Serdes, JESD) – including analysis.
• VHDL/Verilog design experience – to create CPLD/FPGA designs, including test bench validation.
• Ability to write Python scripts (or similar lower-level scripting) to aid testing and investigation. 
• Design experience with ASIC designs.
• Experience designing rigid-flex PCBs and general electro-mechanical design familiarity.
• RF knowledge.
• Experience with EMC (Immunity and Emissions), Environmental (temp, shock, vibration), Reliability (MTBF, MTTF), FMECA.
• We are doing exciting work with satellites, so candidates with and understanding or direct experience on LEO satellite component development, design and in-orbit activities will be viewed very positively.
• Experience with highly integrated multicore packet and baseband processors.