Full-Time
Semiconductor foundry delivering specialized chips
No salary listed
Company Does Not Provide H1B Sponsorship
Malta, NY, USA
In Person
On-site in Malta, New York; 12-hour shifts (6:00am–6:00pm) or compressed schedule may apply; on-call/holiday coverage expected.
Associate's
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GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.
Company Size
10,001+
Company Stage
IPO
Headquarters
Town of Malta, New York
Founded
2009
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Professional Development Budget
GLOBALFOUNDRIES shares fell 7.2% on Monday to $50.05, despite beating June-quarter revenue estimates and raising its outlook for its fastest-growing segment. The semiconductor foundry's communications infrastructure and data centre market grew 62% year-over-year, driven by demand for silicon photonics and silicon germanium chips used in optical networking equipment. However, this high-growth segment represents only 16% of total revenue, approximately $290 million of the $1.786 billion reported for the quarter. Meanwhile, the company's largest segment, smart mobile devices at 36% of revenue, is expected to decline by a low-teens percentage in 2026 due to memory pricing pressures. Overall company revenue grew just 6% year-over-year. The foundry said it is oversubscribed on silicon germanium capacity through 2027 and is expanding within existing facilities. The stock has shown significant volatility, moving in different directions across four trading sessions following the earnings report.
GlobalFoundries reported second-quarter fiscal 2026 revenue of $1.786 billion, up 9% sequentially and 6% year over year. Non-IFRS gross margin expanded to 29.9%, whilst diluted earnings reached $0.46 per share. Communications infrastructure and data-centre revenue surged 62% year over year, driven by silicon photonics and silicon-germanium demand. The company raised its full-year outlook for this segment to 50–60% growth, up from the high-30% range previously expected. Silicon photonics revenue is now projected to more than double in 2026. The firm guided third-quarter revenue of $1.885 billion and earnings per share of $0.51, plus or minus $0.05. GlobalFoundries completed acquisitions of Synopsys' ARC Processor IP Solutions and Photeon Technologies' custom power team, expecting these to contribute $100 million to $120 million in technology-services revenue for 2026.
GlobalFoundries will receive $300 million in US government funding to support research for technology used in artificial intelligence infrastructure. The semiconductor manufacturer's award comes through the CHIPS Act programme. The funding will help develop advanced semiconductor technologies needed for AI systems and related infrastructure.
GlobalFoundries Chief Strategy Officer Michael James Hogan sold 2,700 ordinary shares and gifted 100 shares on 8 and 9 July 2026, according to an SEC filing. The transactions reduced his direct shareholding by 78%, leaving him with 795 shares. The sales were executed at $66.83 per share under a pre-arranged Rule 10b5-1 plan. The dispositions occurred after GlobalFoundries shares delivered a 70% one-year return as of 9 July 2026. GlobalFoundries operates as a global semiconductor foundry, manufacturing integrated circuits for telecommunications, automotive, industrial, consumer electronics, and computing sectors. The company reported trailing twelve-month revenue of $6.8 billion and net income of $778 million, with a market capitalisation of $38.2 billion.
GlobalFoundries has qualified its SLATE wafer-to-wafer bonding technology on the 9SW radio-frequency silicon-on-insulator platform for production, with volume manufacturing expected in the second half of 2027. The technology enables 3D integration for cellular front-ends, reducing die size by up to 45% for space-constrained mobile applications. Manufactured at GF's 300mm Singapore facility, SLATE allows designers to bond two 9SW wafers and stack large field-effect transistors vertically. The technology supports applications including switches, low-noise amplifiers and antenna tuners in 5G mobile devices and satellite communications. The 9SW platform, introduced in 2023, delivers over 20% efficiency enhancement whilst reducing standby currents for longer battery life. An integrated process design kit is available through GF Connect, with prototyping accessible via GlobalShuttle multi-project wafer programme.