Compensation Overview

Job Description: 

In this role you will utilize your broad semiconductor packaging experience and partner management experience to drive company’s HPC products from concept to high volume manufacturing. You will be responsible for driving engineering activities with multiple engineering groups such as Packaging, ASIC, AMS, Photonics and external partners to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency. 

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• Work with cross-functional teams and lead package integration and architecture efforts with vendors
• Work with small to large scale 3^rd party vendors, foundries and OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies.
• Actively manage qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints
• Manage internal and external resources effectively and efficiently for thermal/mechanical/electrical simulations and package layouts
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

QUALIFICATIONS: 

• 15+ years of experience in Semiconductor Packaging Design, Process and/or Technology Development
• Experience in project management and communicating technical and project/program status and issue resolution at the executive level
• Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects in various 2.5D/3D package form factors
• Good understanding of cross-functional packaging areas: Si floor plan, package and board level layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, reliability, and cost
• Familiarity with component & system level reliability, testing, and FA
• Experience with photonics packaging is a plus but not necessary
• Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
• Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers
• Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision
• MS or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science or Physics is required

Location: Bay area location is preferred.

For California location:

As an early startup experiencing explosive growth, we offer an extremely attractive total compensation package, inclusive of competitive base salary and a generous grant of our valuable early-stage equity.  The target base salary for this role is approximately $175,000.00 - $200,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.