Full-Time

Automotive Senior Hardware Engineer / Specialist / Architect

Updated on 8/24/2026

Robert Bosch Venture Capital

Robert Bosch Venture Capital

201-500 employees

Venture capital funding deep tech startups

No salary listed

Coimbatore, Tamil Nadu, India

In Person

Bachelor's, Master's

Category
Hardware Engineering (1)
Required Skills
Altium
Cadence Allegro
Oscilloscope

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Requirements
  • Bachelor’s or Master’s Degree in Electronics, Electrical, or related engineering field.
  • 7–11 years of hands-on experience in automotive hardware design.
  • Proven experience with SoC-based board design (e.g., NVIDIA, Qualcomm, Renesas, TI, NXP, Infineon AURIX).
  • Strong understanding of vehicle computer, communication gateway and zonal ECU domains.
  • Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes).
  • Expertise in ADC, High side and Low side switches, Bridges and Motor drivers.
  • Knowledge of Automotive Safety (ISO 26262 – ASIL B to D compliance).
  • Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing.
  • Understanding of thermal design, power sequencing, and power distribution.
  • Experience in Integration platform, communication gateway and zone ECU's.
  • Proficiency in schematic tools (Altium, Cadence Allegro, Mentor DxDesigner, Zuken CR-8000).
  • Hands-on experience with hardware bring-up, debugging, and lab instruments (oscilloscope, logic analyzer, power analyzer, etc.).
  • Excellent analytical, communication, and documentation skills.
Responsibilities
  • Lead hardware design and development for Vehicle computer, Communication Gateway, Zone ECUs and Power distribution ECUs, from concept to production.
  • Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, SerDes.
  • Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency.
  • Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions.
  • Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews.
  • Collaborate with PCB layout engineers for constraint-driven designs (impedance, stack-up, crosstalk, EMI/EMC).
  • Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis.
  • Work with cross-functional teams (System, Software, Validation, Manufacturing, EMC) through design verification and PPAP stages.
  • Support DFMEA, DFx (DFM, DFT, DFA) activities to ensure manufacturability and reliability.
  • Create design documentation, validation reports, and participate in technical reviews and customer discussions.
Desired Qualifications
  • Experience with ASIL-D compliant ECU development.
  • Exposure to Ethernet TSN, CAN-FD, LIN, FlexRay and in-vehicle communication networks.
  • Knowledge of thermal simulation and mechanical integration.
  • Familiarity with AI/ML accelerator SoCs used in perception and fusion ECUs.
  • Experience working with global OEMs and Tier-1s on production projects.
Robert Bosch Venture Capital

Robert Bosch Venture Capital

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RBVC (Robert Bosch Venture Capital) is a global venture capital firm that backs early-stage deep tech startups in areas like energy efficiency, medical devices, and virtual/augmented reality. It supports companies with funding and access to Bosch’s network and resources to help them scale and bring innovations to market. Unlike traditional VCs, RBVC may purchase solutions for a proof-of-concept while allowing startups to keep their intellectual property, which speeds up development and lowers upfront costs. The firm earns money through equity investments and the eventual success of its portfolio. RBVC’s goal is to accelerate technological advances across multiple industries by connecting startups with Bosch’s ecosystem, customers (from medical centers to data centers), and global reach.

Company Size

201-500

Company Stage

N/A

Total Funding

$3.8B

Headquarters

Frankfurt, Germany

Founded

2007

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Simplify Jobs

Simplify's Take

What believers are saying

  • July 2026: Bosch Ventures backed Quantum Motion's $160 million Series C.
  • January 2026: Neurophos raised $110 million with Bosch Ventures for photonic AI chips.
  • March 2026: 4screen's $21 million Series B expanded Bosch Ventures' connected-car footprint.

What critics are saying

  • Bosch 2025 operating EBIT margin fell to 2%, while provisions hit €2.7 billion.
  • Bosch announced 13,000 Mobility layoffs by 2030, pressuring venture budgets and attention.
  • If Bosch Mobility misses recovery, corporate venture becomes a discretionary line by 2027.

What makes Robert Bosch Venture Capital unique

  • Fund VI launched May 2025 with €250 million for deep-tech startups globally.
  • Open Bosch, updated June 30 2026, turns Bosch units into venture clients.
  • Global offices in Europe, Silicon Valley, China, and Israel source industrial buyers.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

401(k) Retirement Plan

401(k) Company Match

Paid Vacation

Paid Parental Leave

Wellness Program

Company News

Pulse 2.0
Jan 22nd, 2026
Neurophos: $110 Million Series A Raised To Bring Exaflop-Scale Photonic AI Chips To Data Centers

Neurophos has raised $110 million in an oversubscribed Series A round to accelerate the commercialization of its photonic AI chip technology, positioning the Austin-based company to push beyond the power and scalability limits facing today’s AI infrastructure. The financing brings Neurophos’ total funding to $118 million and was led by Gates Frontier, with participation from M12 (Microsoft’s Venture Fund), Carbon Direct Capital, Aramco Ventures, Bosch Ventures, Tectonic Ventures, Space Capital, and additional investors.

Bloomberg
Jan 22nd, 2026
Gates' VC fund leads $110M funding for AI chip startup Neurophos

Neurophos Inc., a chip startup developing technology to outperform AI accelerators, has raised $110 million in funding led by Gates Frontier, Bill Gates' venture capital fund. Microsoft's M12 and Aramco Ventures, the investment arm of Saudi Arabia's state-owned oil producer, also participated. Additional investors in the round included Bosch Ventures, Tectonic Ventures and Space Capital. The company aims to develop new chip technology capable of surpassing current accelerators used to run AI models.

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Berlin's Cloover secures $1.22B financing to make home energy upgrades affordable at €100-150 monthly

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Semiconductor pioneer FMC raises €100 million to set new standards for memory chips

Dresden (ots) - - Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking...