Principal Product Application Engineer

Nexperia and Semikron Danfoss explore strategic collaboration on SiC Power Modules for automotive applications. Combining semiconductor and module expertise to advance high-performance solutions for electric vehicles. Nuremberg, Germany / Nijmegen, Netherlands; June 9, 2026 - Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The collaboration aims to combine Nexperia's expertise in SiC semiconductor technology with Semikron Danfoss' leading capabilities in power module packaging and integration. Together, the companies intend to evaluate how a joint approach can enable high-performance, scalable solutions for next-generation electric vehicles. SiC technology plays a critical role in improving the efficiency, power density, and performance of electric drivetrains. By bringing together complementary competencies across the value chain - from chip to module - the companies aim to advance optimized solutions tailored to the demanding requirements of automotive applications. As part of the collaboration, both companies will explore joint engineering approaches, including early integration and co-design, to unlock the full performance potential of SiC-based systems. Carsten Götte, SVP Semikron Danfoss Automotive Power Modules Division, said: "By combining advanced semiconductor technology from Nexperia with our module expertise, we see strong potential to achieve more together than either could alone. We look forward to exploring how this collaboration can create additional value for our customers in the rapidly evolving electric vehicle market." Edoardo Merli, SVP and Head of Business Group Wide Bandgap, IGBT & Modules (WIM), Nexperia, said: "Strong partnerships are essential to unlocking the full potential of wide bandgap technologies, including SiC and GaN. With our continued R&D investments and strong focus on early-stage collaboration, we actively drive the alignment of semiconductor and system requirements from the outset. We are excited to explore how this partnership with Semikron Danfoss, a global leader in power electronics, can advance our module offering." Both companies share a strong European heritage and longstanding industry experience, providing a solid foundation for exploring future collaboration opportunities in the automotive power electronics space. * Semikron Danfoss: www.semikron-danfoss.com * Nexperia's wide bandgap semiconductor technology: www.nexperia.com/technology-hub/wide-bandgap-semiconductors

Nexperia brings QDPAK packaging to 1200V SiC MOSFETs. Tuesday 9th June 2026 Top-side cooled SMD package provides practical route to higher power density and efficiency Nexperia has released 1200V SiC MOSFETs in QDPAK packaging with a top-side cooled surface-mount package optimised for high-power density and thermally demanding applications. Designed for high-efficiency, high-voltage power conversion applications, these devices enable the electrical performance of Nexperia's SiC technology with simplified thermal management and mechanical integration, enabling higher output power, increased efficiency and improved thermal performance in compact designs. Available in both industrial-grade and automotive-qualified variants, the portfolio offers RDS(on) options of 17, 30, 40, 60 and 80 mΩ, delivering a scalable QDPAK platform for applications ranging from high-power systems to compact designs with demanding thermal and mechanical constraints. QDPAK packaging addresses the problem of heat dissipation through the PCB. By enabling a direct die-to-heatsink thermal path from the top side of the package, these devices reduce reliance on the board as the primary heat-spreading path and allow the semiconductor and PCB thermal domains to be managed more independently. Compared to conventional D2PAK-7 packaging, top-side cooled packages can deliver up to 3 kW higher output power at comparable thermal limits, while also providing around 40 °C additional thermal headroom at the same power level. Building on the existing X.PAK platform, QDPAK further extends power handling capability, enabling operation at approximately 3 kW higher power at comparable case temperatures, while offering around 23 °C additional thermal headroom at similar power levels. The devices are suitable for EV onboard chargers (OBC), high-voltage DC-DC converters, EV charging infrastructure, photovoltaic inverters, uninterruptible power supplies (UPS), motor drives and datacenter power systems, QDPAK devices help engineers optimise both electrical and mechanical system performance.

Nexperia closes US deal against chip shortages. Dutch chipmaker Nexperia is joining forces with American Polar Semiconductor. Together, the companies will produce the latest generation of power semiconductors in an American wafer fab. The strategic collaboration aims to ensure a more stable global supply chain of computer chips for, among others, AI servers, robotics, and the automotive industry. The announcement comes at a time when global demand for advanced power chips, so-called power MOSFETs, is rising sharply. These specific semiconductors play a crucial role in the energy efficiency and heat regulation of heavy electronic systems. By combining Nexperia's technology with Polar's large-scale production capacity in Minnesota, both parties hope to better respond to market needs. American production base. For Nexperia, which has its headquarters in Nijmegen, the deal is an important step in its long-term strategy. Polar Semiconductor has over sixty years of experience in the semiconductor industry and is currently significantly expanding its production capacity in the United States. The factory is also certified for the strict quality standards of the automotive sector, where reliability is essential. Fredrik Öberg, manager of the MOS division at Nexperia, emphasizes that portfolio expansion is central to the company's future plans. According to the chipmaker, Polar's focus on flawless manufacturing perfectly aligns with its own quality standards. Polar CEO Reza Kazerounian also sees the collaboration as confirmation of their course to build a specialized fab for sensors and high-voltage semiconductors. The partnership with a global player like Nexperia underscores, according to him, the success of recent investments in their American production site. Resilient supply chain. The semiconductor sector has been repeatedly hit by vulnerabilities in global logistics chains over the past few years. Nexperia's interim CEO Stefan Tilger indicates that this step is necessary to offer customers a stable foundation in the future. By partially locating production in the United States, Nexperia is building a more resilient network that is less dependent on geopolitical fluctuations or regional logistics problems. Within the collaboration, Nexperia will develop a wide range of new MOSFET variants, divided over various voltage classes and package types. The focus here is on robustness and optimizing switching performance. The companies have not disclosed financial details about the production agreement or specific volumes.