Full-Time
Senior Director
Multiple Teams
GlobalFoundries
10,001+ employees
Semiconductor foundry delivering specialized chips
Compensation Overview
$198k - $333k/yr
Company Does Not Provide H1B Sponsorship
Malta, NY, USA + 1 more
More locations: Essex Junction, VT, USA
In Person
The role is based in Burlington, Vermont.
Bachelor's, Master's, PhD
 Engineering Management (1) |
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- A bachelor's degree in engineering, Materials Science, Physics, or a related field is required; an advanced degree is strongly preferred.
- At least 15 years of progressive experience in semiconductor or photonics packaging, including significant experience in advanced packaging and/or optical/photonic integration.
- A proven track record building or scaling a technical organization, including hiring and developing senior technical leaders.
- Deep technical expertise in advanced packaging, including assembly, package design, yield, and qualification/reliability, and/or optical packaging, including fiber attach and co-packaged optics.
- Experience managing outsourced assembly and test partner relationships.
- Strong executive presence and experience partnering with senior leadership, customers, and cross-site global teams.
- Demonstrated ability to operate in a matrixed, multi-site global organization.
- Excellent communication, organizational design, and change-leadership skills.
- Experience with package design and assembly architecture, advanced packaging, optics, laser solutions, optical alignment, fiber attach processes, co-packaged optics, product engineering, test engineering, qualification, reliability, statistical process control, root-cause analysis, returns analysis, and failure analysis.
- Define the organizational structure, recruit and develop the leadership team, and set the technical and operational strategy across advanced packaging, optics, and product engineering for the Integrated Optics portfolio.
- Own the technical strategy and roadmap for Optical Packaging Technology Development across advanced packaging, optics, and product engineering.
- Lead package design and assembly architecture decisions for optical and photonic modules, including substrate, interposer, and co-packaging approaches.
- Drive yield enhancement programs using statistical process control and root-cause analysis to close yield gaps in packaging and assembly.
- Own packaging qualification and reliability strategy, including qualification test plans, stress testing, and reliability modeling to meet customer and industry standards.
- Direct the optics function's technical roadmap covering optics and laser solutions, optical alignment and fiber attach processes, and co-packaged and advanced optics integration architectures.
- Guide product engineering technical investigations, including returns analysis and failure analysis methodology, to connect field issues with process and design changes.
- Partner with test engineering to co-develop test strategy, coverage, and qualification requirements aligned to package and optical architecture.
- Set technical requirements and provide engineering oversight for external assembly and test partners by reviewing process capability, yield, and quality data.
- Evaluate and down-select advanced packaging and optical integration technologies, including co-packaged optics, fiber attach methods, and EIC/PIC integration schemes, for technology roadmaps.
- Collaborate cross-functionally with Silicon Products Development on EIC/PIC and optical engine architecture to ensure package-silicon co-design alignment.
- Own the profitability and growth of the business line, develop programs and strategies to meet financial objectives, maintain external relationships, and ensure compliance with internal policies and legal regulations.
- Support Environmental, Health, Safety, and Security requirements and programs and perform other assigned projects or duties as needed.
- Comfort operating in a matrixed, multicultural environment.
- Strong alignment with values of integrity, innovation, and operational excellence.
- Ability to lead through influence and build trust across diverse teams.
GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.
Company Size
10,001+
Company Stage
IPO
Headquarters
Town of Malta, New York
Founded
2009
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Simplify's Take
What believers are saying
- Q2 2026 revenue reached $1.786 billion, and gross margin expanded to 29.9%.
- Communications infrastructure and data center revenue surged 62% year over year in Q2 2026.
- The Commerce Department approved $300 million in CHIPS funding for AI infrastructure R&D.
What critics are saying
- Smart mobile devices were 36% of Q2 2026 revenue and should decline low-teens.
- Memory pricing and handset shortages already hit the largest end market in 2026.
- If silicon photonics execution slips in 2027, GF loses its main growth engine.
What makes GlobalFoundries unique
- GF's 2026 silicon photonics and SiGe focus beats commodity foundries on specialty mix.
- Dresden's EU-only secure flow and Vermont GaN production target trusted-supply customers.
- FDX and 9SW platforms serve automotive, IoT, and RF front ends better than leading-edge logic.
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Benefits
Professional Development Budget
Growth & Insights and Company News
6 month growth
↓ -2%1 year growth
↓ -1%2 year growth
↓ -1%GlobalFoundries and RAAAM Memory Technologies have announced a collaboration to develop Gain-Cell RAM (GCRAM) technology on GlobalFoundries' FDX platform. The partnership has achieved a significant milestone with the successful tape-out of a GCRAM test vehicle. The technology addresses growing on-chip memory demands for edge AI, automotive, and IoT devices. Using RAAAM's patented GCRAM, the companies achieved a 40% memory area reduction and up to 60% power savings compared to SRAM. The firms have jointly designed and taped out a GCRAM test chip. They plan to provide GCRAM design access to lead customers in early 2027. NXP Semiconductors is evaluating the solution. Victor Wang, vice president of front end innovation at NXP, noted the technology's potential for increasing on-chip memory capacities and improving system-level efficiency.
QuickLogic has released an enhanced embedded FPGA Hard IP for GlobalFoundries' 12LP process. The new offering includes a DSP Multiply-and-Accumulate unit with enhanced preadder, cascade connections, and SIMD functionality for applications such as phased array radar, electronic warfare, and satellite communications. The eFPGA fabric can now scale beyond 250,000 LUTs for designs requiring larger embedded programmable logic. An optional Configuration Bit Health Monitor detects and corrects errors induced by Single Event Upsets whilst the design is active. The technology enables programmable logic to be embedded directly within SoCs, allowing hardware functions and interfaces to be updated post-manufacturing. QuickLogic showcased the enhanced IP at the GlobalFoundries Technology Summit North America in Santa Clara, California, on 2 September 2026.
Navitas Semiconductor has begun shipping its fifth-generation GaNFast gallium nitride power semiconductors manufactured in the United States through a partnership with GlobalFoundries. The first shipments from GlobalFoundries' Burlington, Vermont facility are scheduled for September, with strategic customer samples expected before year-end. The collaboration, announced in November 2025, combines Navitas' proprietary GaN technology with GlobalFoundries' 200mm manufacturing capabilities. The partnership aims to strengthen the domestic supply chain for AI infrastructure and critical national security applications. The initial product family includes 650V GaN FETs with various resistance specifications. Navitas has pioneered GaN power semiconductor innovation since 2014 and holds more than 300 issued and pending patents across GaN and silicon carbide technologies. The partnership marks a significant milestone in establishing trusted US-based production of advanced power semiconductors for AI infrastructure, high-performance computing, and industrial applications.
GlobalFoundries has secured a $1.5 billion credit facility led by JPMorgan, maturing in 2031. The semiconductor manufacturer recently prepaid approximately $664 million in outstanding term loans in early 2025. The company maintains a strong financial position with roughly $3.3 billion in cash and marketable securities against total debt of approximately $1.1 billion. Its most recent quarterly revenue exceeded $1.7 billion. The new facility expands GlobalFoundries' borrowing capacity from a previous $1 billion revolving credit arrangement. JPMorgan, which already maintains relationships with the company through equity research and structured products, now takes on a lead lending role. GlobalFoundries produces specialised semiconductors for automotive, IoT, and communications infrastructure sectors. The expanded credit line provides additional financial flexibility amid industry-wide buildout plans and shifting trade dynamics.
GLOBALFOUNDRIES shares fell 7.2% on Monday to $50.05, despite beating June-quarter revenue estimates and raising its outlook for its fastest-growing segment. The semiconductor foundry's communications infrastructure and data centre market grew 62% year-over-year, driven by demand for silicon photonics and silicon germanium chips used in optical networking equipment. However, this high-growth segment represents only 16% of total revenue, approximately $290 million of the $1.786 billion reported for the quarter. Meanwhile, the company's largest segment, smart mobile devices at 36% of revenue, is expected to decline by a low-teens percentage in 2026 due to memory pricing pressures. Overall company revenue grew just 6% year-over-year. The foundry said it is oversubscribed on silicon germanium capacity through 2027 and is expanding within existing facilities. The stock has shown significant volatility, moving in different directions across four trading sessions following the earnings report.