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Company Overview

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us.

Job Description/Preferred Qualifications

The Product Line Manager (PLM) Director for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis for next-generation semiconductor packaging and metrology solutions. This hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products. The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross-functional teams to deliver innovative solutions that meet evolving customer needs.

Responsibilities will include:

Product Strategy & Lifecycle Management

Define and own the product roadmap, including technical direction, feature prioritization, and strategic decisions on architecture and specifications.
Manage the full product lifecycle from concept through end-of-life, ensuring alignment with division goals and objectives.
Oversee project planning, scope, schedule, budget, and resource allocation.
Own the product line’s P&L, including revenue, margin, and cost structure.
Drive Balanced Scorecard metrics: cost, growth, customer satisfaction, and innovation.
Analyze market trends and technology inflections (e.g., 2.5D/3D integration, hybrid bonding, backside power delivery, chiplet architectures, fan-out packaging, co-packaged optics).
Conduct strategic market studies and competitive analysis to guide investment decisions and identify growth opportunities.
Evaluate and prioritize customer feature requests; translate market needs into actionable development plans.
Assess emerging technologies and forecast their growth potential.

Customer & Relationship Management

Build and maintain strong relationships with customers, understanding their requirements and expectations.
Drive product adoption and penetration in advanced packaging and metrology segments.
Lead customer engagement strategies through Field Marketing and Applications Engineering.
Act as the primary point of contact between customers and the division, supporting pre-sales and after-sales projects.

Cross-Functional Leadership & Global Collaboration

Collaborate with R&D, Engineering, Sales, Marketing, Operations, and global teams to ensure successful product execution.
Facilitate clear communication among project teams, stakeholders, and senior management, providing regular updates on status, risks, and mitigation plans.
Champion product vision internally and externally.
Engage with a global installed base, requiring approximately 30–40% business travel (domestic and international), based on business needs.

Required Qualifications

Bachelor’s, Master’s, or PhD in Engineering, Physics, Materials Science, or related technical field.
10+ years of experience in product management, applications engineering, or technical marketing, preferably in the semiconductor or advanced packaging/metrology industry.
Deep understanding of advanced packaging manufacturing processes and equipment (including 2.5D/3D packaging, hybrid bonding, chiplet architectures, fan-out packaging, CoWoS, SOIC, HBM and related metrology or inspection technologies).
Experience with PLM tools, financial modeling, and customer engagement strategies.
Proven ability to develop and execute market strategies and product roadmaps.
Knowledge of wafer inspection technologies and tools.
Strong analytical, communication, and leadership skills.
Willingness and ability to travel internationally (30–40%).

Preferred Qualifications

Experience working with global teams and diverse customer bases.
Ability to translate technical concepts into business value.
Familiarity with competitive analysis and strategic market development for advanced packaging products.

Minimum Qualifications

Doctorate (Academic) Degree and related work experience of 10 years; Master's Level Degree and related work experience of 13 years; Bachelor's Level Degree and related work experience of 15 years

Base Pay Range: $210,900.00 - $369,100.00Primary Location: USA-CA-Milpitas-KLAKLA’s total rewards package for employees may also include participation in performance incentive programs and eligibility for additional benefits including but not limited to: medical, dental, vision, life, and other voluntary benefits, 401(K) including company matching, employee stock purchase program (ESPP), student debt assistance, tuition reimbursement program, development and career growth opportunities and programs, financial planning benefits, wellness benefits including an employee assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave.

Interns are eligible for some of the benefits listed. Our pay ranges are determined by role, level, and location. The range displayed reflects the pay for this position in the primary location identified in this posting. Actual pay depends on several factors, including state minimum pay wage rates, location, job-related skills, experience, and relevant education level or training. We are committed to complying with all applicable federal and state minimum wage requirements where applicable. If applicable, your recruiter can share more about the specific pay range for your preferred location during the hiring process.

KLA is proud to be an Equal Opportunity Employer. We will ensure that qualified individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment. Please contact us at [email protected] or at +1-408-352-2808 to request accommodation.

Be aware of potentially fraudulent job postings or suspicious recruiting activity by persons that are currently posing as KLA employees. KLA never asks for any financial compensation to be considered for an interview, to become an employee, or for equipment. Further, KLA does not work with any recruiters or third parties who charge such fees either directly or on behalf of KLA. Please ensure that you have searched KLA’s Careers websitefor legitimate job postings. KLA follows a recruiting process that involves multiple interviews in person or on video conferencing with our hiring managers. If you are concerned that a communication, an interview, an offer of employment, or that an employee is not legitimate, please send an email to [email protected] to confirm the person you are communicating with is an employee. We take your privacy very seriously and confidentially handle your information.

Director – Product Line Manager

Advanced Packaging & Metrology, E

KLA Corporation

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