Full-Time

RTL Design Engineer

Deadline 8/17/26
Broadcom Limited

Broadcom Limited

10,001+ employees

Semiconductor products and infrastructure software provider

Compensation Overview

$127.1k - $203.4k/yr

+ Bonus + Equity Grants

Irvine, CA, USA + 1 more

More locations: Chandler, AZ, USA

In Person

Category
Electrical Engineering (1)
Required Skills
Verilog
Python
Perl
Requirements
  • MS +10 years of relevant industry experience.
  • Experience with digital implementation flow from RTL synthesis to timing closure.
  • Deep understanding of timing analysis with Primetime flow and generation of Liberty models.
  • Experience with Tessent tool for DFT insertion and verification
  • Proficient with Perl, Python and Tcl scripting.
  • Strong problem solving skills with attention to detail.
  • Must be self-motivated and able to work effectively across internal and external engineering teams.
Responsibilities
  • Lead the digital design and verification of a broad range of analog mixed signal IP and IOs, including leading-edge AI programs on advanced nodes.
  • Define the digital architecture and verification strategies for complex AMS and IO subsystems.
  • Design, synthesis, and verification of Verilog/SystemVerilog RTL.
  • Analysis, debug, and resolution of Lint and Clock Domain Crossing issues in the design.
  • Design convergence to timing closure utilizing RTL optimization strategies.
  • Conduct formal verification of design with Synopsys Formality / Cadence Conformal.
  • Generate timing constraints for Synthesis and Static Timing Analysis at the block-level and SoC top-level.
  • Drive comprehensive test plans to ensure quality of design.
  • Collaborate with cross-functional teams, ranging from analog/mixed-signal circuit designers to SoC-level system integration.
  • Create and maintain detailed specification, design, and verification documentation.
Desired Qualifications
  • Solid understanding of transistor-level circuit behavior.
  • Familiar with Cadence Schematic/Layout, SPICE/Spectre circuit simulation.
  • Experience with advanced FinFET process nodes , including features, technology limitations and PPA tradeoffs.

Broadcom designs and sells semiconductors and infrastructure software for data centers, telecom networks, and consumer devices. Its semiconductors include processors, switches, storage controllers, and networking chips; its software portfolio includes DX Unified Infrastructure Management for observability across traditional and cloud environments. The company differentiates itself by offering a large, integrated portfolio that combines high-performance hardware with enterprise-grade software for a wide range of customers. Its goal is to help customers build fast, reliable, and scalable IT infrastructure at scale.

Company Size

10,001+

Company Stage

IPO

Headquarters

Palo Alto, California

Founded

2005

Your Connections

People at Broadcom Limited who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • AI semiconductor revenue is projected to exceed $100 billion by fiscal year 2027.
  • High-margin software renewals and hybrid-cloud demand support earnings even if margins compress.
  • Spring security updates with AI vulnerability detection create new cross-sell opportunities for enterprises.

What critics are saying

  • Two unnamed customers with $6 billion orders and late-2026 shipments pose a high cancellation risk.
  • Nvidia and AMD merchant GPUs threaten Broadcom's custom ASIC pricing power within 12–18 months.
  • Alphabet's external TPU adoption directly reduces Broadcom's design-in leverage and socket share.

What makes Broadcom Limited unique

  • Broadcom leads in AI semiconductor custom ASICs for hyperscalers like Google and OpenAI.
  • Its infrastructure software segment delivers 79% operating margins, stabilizing overall profitability.
  • Broadcom uniquely combines semiconductor, VMware-based software, and AI security in one platform.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

401(k) Retirement Plan

401(k) Company Match

Employee Stock Purchase Plan

Employee Assistance Program

Paid Vacation

Paid Sick Leave

Paid Holidays

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
Investing.com
Jun 11th, 2026
Broadcom launches $2.5B debt tender offer for senior notes

Broadcom has launched a cash tender offer to purchase up to $2.5 billion of its outstanding senior notes across six series with maturities ranging from 2030 to 2038. The notes have an aggregate principal amount of $9.4 billion outstanding. The tender offer is part of Broadcom's debt management strategy. The company currently carries total debt of $64.9 billion against a market capitalisation of $1.77 trillion, operating with what analysts describe as a moderate debt level and a healthy current ratio of 2.24. The offers expire on 17 June 2026, with an expected settlement date of 18 June. Total consideration will be determined based on a fixed spread plus reference yield from US Treasury securities. Barclays Capital and Citigroup Global Markets are serving as dealer managers.

Yahoo Finance
Apr 14th, 2026
Meta partners with Broadcom for custom AI chips through 2029

Meta and Broadcom have announced a strategic partnership under which the chipmaker will provide technology supporting Meta's training and inference accelerator chips through 2029. The deal extends Meta's custom AI chip development plans as the social media giant continues to invest in artificial intelligence infrastructure.

CNBC
Apr 14th, 2026
Meta commits to 1 gigawatt of custom AI chips with Broadcom through 2029

Meta and Broadcom have announced an extended partnership through 2029 for designing Meta's custom AI accelerators. Meta has committed to deploying one gigawatt of its training and inference accelerators under the agreement. The deal expands an existing collaboration between the two companies focused on Meta's in-house chip development. As part of the arrangement, Broadcom CEO Hock Tan has agreed to leave Meta's board of directors. Broadcom shares rose 3% in extended trading following the announcement. The partnership underscores Meta's continued investment in custom silicon to power its artificial intelligence infrastructure and reduce reliance on third-party chip suppliers.

The Associated Press
Apr 14th, 2026
Meta and Broadcom partner on industry-first 2nm AI chip with multi-gigawatt rollout

Broadcom and Meta have announced a multi-year strategic partnership to support Meta's AI compute infrastructure through 2029. The collaboration centres on Meta Training and Inference Accelerator (MTIA) chips, with an initial deployment exceeding one gigawatt as part of a sustained multi-gigawatt rollout. The partnership will deliver what the companies call the industry's first 2nm AI compute accelerator. Broadcom will provide its XPU platform for chip co-development and advanced Ethernet technologies for networking across Meta's expanding AI compute clusters. The technology will underpin Meta's deployment of generative AI features across WhatsApp, Instagram and Threads. Meta aims to deliver what it calls "personal superintelligence" to billions of users globally. Broadcom CEO Hock Tan will transition from Meta's board to an advisory role focusing on Meta's custom silicon roadmap.

Yahoo Finance
Apr 12th, 2026
AI hardware stocks show strong financial performance despite bubble fears

A Motley Fool survey found that 41% of investors believe AI stock prices have reached speculative levels and are likely in a bubble. However, recent financial results from leading AI hardware companies suggest otherwise. Nvidia's sales rose 73% to $68.1 billion in Q4 2026, with non-GAAP earnings per share up 82%. TSMC's earnings increased 35% and revenue jumped 21% to $33.7 billion in Q4 2025. Broadcom's sales grew 29% to $19.3 billion, with non-GAAP earnings per share rising 28% in Q1 2026. Each company holds dominant market positions: Nvidia controls 86% of the AI data centre processor market, TSMC manufactures 70% of the world's processors, and Broadcom is estimated to hold 60% of the application-specific integrated circuit market by next year.