Full-Time
Advanced Package Technology Engineer
Broadcom Limited
10,001+ employees
Semiconductor products and infrastructure software provider
No salary listed
San Jose, CA, USA + 1 more
More locations: Fort Collins, CO, USA
In Person
 Hardware Engineering (2) |
|---|
| , |
- Master’s Degree in Mechanical Engineering or Electrical Engineering or Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 3+ years of relevant experience
- 4~6 years Hands On experience in 2.5D / 3D Development;In-depth Know-how of Advanced Silicon fabrication, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.
- Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.
- Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization.
- Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.
- Communication extensively with internal and external team members, customers in various global locations and may require travel from time to time
Broadcom designs and sells semiconductors and infrastructure software for data centers, telecom networks, and consumer devices. Its semiconductors include processors, switches, storage controllers, and networking chips; its software portfolio includes DX Unified Infrastructure Management for observability across traditional and cloud environments. The company differentiates itself by offering a large, integrated portfolio that combines high-performance hardware with enterprise-grade software for a wide range of customers. Its goal is to help customers build fast, reliable, and scalable IT infrastructure at scale.
Company Size
10,001+
Company Stage
IPO
Headquarters
Palo Alto, California
Founded
2005
Your Connections
People at Broadcom Limited who can refer or advise you
Simplify's Take
What believers are saying
- AI semiconductor revenue is projected to exceed $100 billion by fiscal year 2027.
- High-margin software renewals and hybrid-cloud demand support earnings even if margins compress.
- Spring security updates with AI vulnerability detection create new cross-sell opportunities for enterprises.
What critics are saying
- Two unnamed customers with $6 billion orders and late-2026 shipments pose a high cancellation risk.
- Nvidia and AMD merchant GPUs threaten Broadcom's custom ASIC pricing power within 12–18 months.
- Alphabet's external TPU adoption directly reduces Broadcom's design-in leverage and socket share.
What makes Broadcom Limited unique
- Broadcom leads in AI semiconductor custom ASICs for hyperscalers like Google and OpenAI.
- Its infrastructure software segment delivers 79% operating margins, stabilizing overall profitability.
- Broadcom uniquely combines semiconductor, VMware-based software, and AI security in one platform.
Help us improve and share your feedback! Did you find this helpful?
Benefits
Health Insurance
Dental Insurance
Vision Insurance
401(k) Retirement Plan
401(k) Company Match
Employee Stock Purchase Plan
Employee Assistance Program
Paid Vacation
Paid Sick Leave
Paid Holidays
Growth & Insights and Company News
6 month growth
↑ 0%1 year growth
↑ 0%2 year growth
↑ 0%Broadcom has launched a cash tender offer to purchase up to $2.5 billion of its outstanding senior notes across six series with maturities ranging from 2030 to 2038. The notes have an aggregate principal amount of $9.4 billion outstanding. The tender offer is part of Broadcom's debt management strategy. The company currently carries total debt of $64.9 billion against a market capitalisation of $1.77 trillion, operating with what analysts describe as a moderate debt level and a healthy current ratio of 2.24. The offers expire on 17 June 2026, with an expected settlement date of 18 June. Total consideration will be determined based on a fixed spread plus reference yield from US Treasury securities. Barclays Capital and Citigroup Global Markets are serving as dealer managers.
Meta and Broadcom have announced a strategic partnership under which the chipmaker will provide technology supporting Meta's training and inference accelerator chips through 2029. The deal extends Meta's custom AI chip development plans as the social media giant continues to invest in artificial intelligence infrastructure.
Meta and Broadcom have announced an extended partnership through 2029 for designing Meta's custom AI accelerators. Meta has committed to deploying one gigawatt of its training and inference accelerators under the agreement. The deal expands an existing collaboration between the two companies focused on Meta's in-house chip development. As part of the arrangement, Broadcom CEO Hock Tan has agreed to leave Meta's board of directors. Broadcom shares rose 3% in extended trading following the announcement. The partnership underscores Meta's continued investment in custom silicon to power its artificial intelligence infrastructure and reduce reliance on third-party chip suppliers.
Broadcom and Meta have announced a multi-year strategic partnership to support Meta's AI compute infrastructure through 2029. The collaboration centres on Meta Training and Inference Accelerator (MTIA) chips, with an initial deployment exceeding one gigawatt as part of a sustained multi-gigawatt rollout. The partnership will deliver what the companies call the industry's first 2nm AI compute accelerator. Broadcom will provide its XPU platform for chip co-development and advanced Ethernet technologies for networking across Meta's expanding AI compute clusters. The technology will underpin Meta's deployment of generative AI features across WhatsApp, Instagram and Threads. Meta aims to deliver what it calls "personal superintelligence" to billions of users globally. Broadcom CEO Hock Tan will transition from Meta's board to an advisory role focusing on Meta's custom silicon roadmap.
A Motley Fool survey found that 41% of investors believe AI stock prices have reached speculative levels and are likely in a bubble. However, recent financial results from leading AI hardware companies suggest otherwise. Nvidia's sales rose 73% to $68.1 billion in Q4 2026, with non-GAAP earnings per share up 82%. TSMC's earnings increased 35% and revenue jumped 21% to $33.7 billion in Q4 2025. Broadcom's sales grew 29% to $19.3 billion, with non-GAAP earnings per share rising 28% in Q1 2026. Each company holds dominant market positions: Nvidia controls 86% of the AI data centre processor market, TSMC manufactures 70% of the world's processors, and Broadcom is estimated to hold 60% of the application-specific integrated circuit market by next year.