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Full-Time

Optical Packaging & Components Engineer

Confirmed live in the last 24 hours

Celestial AI

Celestial AI

51-200 employees

Optical interconnects for hyperscale data centers

Data & Analytics
Hardware
Enterprise Software
AI & Machine Learning
Aerospace

Compensation Overview

$180k - $225kAnnually

+ Equity

Senior, Expert

Santa Clara, CA, USA

Category
Electronics Design Engineering
Embedded Systems Engineering
Electrical Engineering
Requirements
  • Strong experience designing and working with fiber-optic and integrated-optics components and sub-assemblies.
  • Strong experience working with DFB laser diodes. A clear grasp of laser fundamentals is a big plus.
  • Strong understanding of standard packaging processes for integrating external components into Silicon photonics products and platforms.
  • Experience running reliability assessment and qualification programs for optical components.
  • Experience with free-space design software (Zemax, Code-V)
  • Ability to collect and analyze large datasets (i.e. experience with JMP, DataConductor or similar data analysis tools)
  • Prior experience with vendor engagements for component procurement is a plus.
  • Minimum MS in engineering or physics. PhD is preferred.
  • Minimum 7 years of relevant experience.
Responsibilities
  • Contribute to the development and packaging of optical components and sub-assemblies used in Silicon Photonics products. The components include laser packages and fiber arrays.
  • Be part of the team responsible for the full life-cycle support of the components, from initial design & development, procurement and full characterization to packaging and high-volume manufacturing.
  • Work with assembly partners on process development for integration of these components into the final product. Also support performance and reliability assessments of the final assemblies.
  • Own test and demonstration vehicles that implement and integrate these optical assemblies into larger systems.

Celestial AI focuses on enhancing the performance of hyperscale data centers through its technology called Photonic Fabric™, which is an optical compute interconnect. This technology improves memory sharing by reducing the total DRAM requirements by up to 35%, leading to significant cost savings for data centers. It achieves this by utilizing optical interconnects that lower power consumption and increase bandwidth capacity, which is crucial for multi-tenant cloud environments where lower latency memory pooling can save around 23%. Additionally, Celestial AI's technology enables the disaggregation of High Bandwidth Memory (HBM) by using optics instead of traditional PCIe connections, addressing future needs for higher bandwidth connections among compute units. The company aims to provide this optical connectivity to data centers, facilitating advancements in Generative AI and other complex computing tasks, positioning itself as a key player in the evolution of advanced computing.

Company Stage

Series C

Total Funding

$337.9M

Headquarters

Sunnyvale, California

Founded

2020

Growth & Insights
Headcount

6 month growth

12%

1 year growth

22%

2 year growth

125%
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Simplify's Take

What believers are saying

  • The recent $175 million Series C funding round, led by prominent investors, underscores strong financial backing and growth potential.
  • Appointment of industry veteran Diane Bryant to the Board of Directors brings valuable expertise and credibility to the company.
  • Adoption of Photonic Fabric™ by leading hyperscalers indicates market validation and potential for widespread industry impact.

What critics are saying

  • The highly competitive nature of the high-performance computing market could challenge Celestial AI's ability to maintain its technological edge.
  • Dependence on the successful integration and adoption of Photonic Fabric™ technology by hyperscalers and other partners poses a risk if market acceptance is slower than anticipated.

What makes Celestial AI unique

  • Celestial AI's Photonic Fabric™ technology offers a unique optical compute interconnect that significantly reduces DRAM requirements and power consumption, setting it apart from traditional data center solutions.
  • The company's focus on disaggregating HBM over optics instead of PCIe provides a forward-looking approach to meet future bandwidth and latency needs, unlike competitors relying on conventional interconnects.
  • Strategic collaborations with hyperscalers and AI computing providers enable Celestial AI to address critical performance chokepoints, positioning it as a leader in advanced AI infrastructure.