B

Black Semiconductor

Graphene photonics enable optical chip interconnects

Photonics Circuit Designer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeAachen, GermanyIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering, Photonics, Physics, or a related technical field is required, with strong fundamentals in optics, electromagnetics, and semiconductor device physics.
  • At least 5 years of experience in photonic integrated circuit schematic capture and mask layout, including code-based or graphical-user-interface-based design using Cadence Virtuoso, Synopsys photonic design flows, or equivalent tools.
  • Experience implementing photonic integrated circuit designs using foundry process design kits, including layout constraints, process rules, and manufacturability considerations.
  • Strong design rule checking and layout-versus-schematic experience, including verification debugging and closure.
  • Practical understanding of photonic device behavior, including waveguides, coupling, loss budgets, and layout trade-offs.
  • Experience taking photonic designs through tape-out and foundry submission.
  • Strong Python scripting skills for layout automation, regression flows, verification workflows, and data analysis.
  • Ability to collaborate across photonics, electrical integrated circuit, packaging, simulation, and product teams to resolve design trade-offs.
  • Experience with photonic integrated circuit design and verification workflows, including Cadence Virtuoso or Synopsys photonic flows, Ansys Lumerical, foundry process design kits, design rule checking and layout-versus-schematic toolchains, Python-based automation using NumPy, SciPy, and pandas, Git, and standard integrated circuit design workflows.

Responsibilities

  • Own photonic integrated circuit schematic capture and physical layout implementation, including photonic components, links, and full chip assemblies using industry-standard photonic integrated circuit design flows.
  • Define photonic integrated circuit floor plans, waveguide routing, and photonic integrated circuit/electrical integrated circuit interconnect structures while balancing optical performance, electrical integration, and packaging constraints.
  • Develop and maintain process design kit-based design workflows, including parameterized cells, compact and behavioral models, and design rules to ensure consistency between layouts, netlists, and simulation models.
  • Drive verification and tape-out readiness, including design rule checking and layout-versus-schematic execution, extraction debugging, verification closure, and coordination with foundry partners.
  • Automate and improve design workflows through scripting, regression testing, layout checks, and data analysis.
  • Document implementation decisions and communicate design trade-offs across architecture, simulation, electrical integrated circuit, packaging, and product teams.

Desired Qualifications

  • Experience with photonic integrated circuit/electrical integrated circuit co-design, two-and-a-half-dimensional or three-dimensional packaging floor planning, or advanced package integration.
  • Experience with Verilog-A or compact model development for photonic devices.
  • Experience in semiconductor product development, including reliability, qualification, and production requirements.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Series A
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

Recently Posted Jobs

Explore more opportunities at Black Semiconductor

See more jobs