Full-Time

Photonics Circuit Designer

Black Semiconductor

Black Semiconductor

51-200 employees

Graphene photonics enable optical chip interconnects

No salary listed

Aachen, Germany

In Person

Bachelor's, Master's

Category
Hardware Engineering (1)
Required Skills
Python
Software Testing
Git
Circuit Design
Electromagnetics
Pandas
NumPy
Data Analysis

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Requirements
  • A Bachelor's or Master's degree in Electrical Engineering, Photonics, Physics, or a related technical field is required, with strong fundamentals in optics, electromagnetics, and semiconductor device physics.
  • At least 5 years of experience in photonic integrated circuit schematic capture and mask layout, including code-based or graphical-user-interface-based design using Cadence Virtuoso, Synopsys photonic design flows, or equivalent tools.
  • Experience implementing photonic integrated circuit designs using foundry process design kits, including layout constraints, process rules, and manufacturability considerations.
  • Strong design rule checking and layout-versus-schematic experience, including verification debugging and closure.
  • Practical understanding of photonic device behavior, including waveguides, coupling, loss budgets, and layout trade-offs.
  • Experience taking photonic designs through tape-out and foundry submission.
  • Strong Python scripting skills for layout automation, regression flows, verification workflows, and data analysis.
  • Ability to collaborate across photonics, electrical integrated circuit, packaging, simulation, and product teams to resolve design trade-offs.
  • Experience with photonic integrated circuit design and verification workflows, including Cadence Virtuoso or Synopsys photonic flows, Ansys Lumerical, foundry process design kits, design rule checking and layout-versus-schematic toolchains, Python-based automation using NumPy, SciPy, and pandas, Git, and standard integrated circuit design workflows.
Responsibilities
  • Own photonic integrated circuit schematic capture and physical layout implementation, including photonic components, links, and full chip assemblies using industry-standard photonic integrated circuit design flows.
  • Define photonic integrated circuit floor plans, waveguide routing, and photonic integrated circuit/electrical integrated circuit interconnect structures while balancing optical performance, electrical integration, and packaging constraints.
  • Develop and maintain process design kit-based design workflows, including parameterized cells, compact and behavioral models, and design rules to ensure consistency between layouts, netlists, and simulation models.
  • Drive verification and tape-out readiness, including design rule checking and layout-versus-schematic execution, extraction debugging, verification closure, and coordination with foundry partners.
  • Automate and improve design workflows through scripting, regression testing, layout checks, and data analysis.
  • Document implementation decisions and communicate design trade-offs across architecture, simulation, electrical integrated circuit, packaging, and product teams.
Desired Qualifications
  • Experience with photonic integrated circuit/electrical integrated circuit co-design, two-and-a-half-dimensional or three-dimensional packaging floor planning, or advanced package integration.
  • Experience with Verilog-A or compact model development for photonic devices.
  • Experience in semiconductor product development, including reliability, qualification, and production requirements.

Black Semiconductor develops chips that combine graphene-based photonics with traditional electronics to enable optical chip-to-chip communication. Its process embeds optical components into the outer layers of CMOS-like chips, allowing electrons to be converted to photons and back via graphene acting as a translator. This integration aims to overcome interconnect bottlenecks, enabling multiple chips to act as a single faster, more energy-efficient system for AI hardware, data centers, HPC, and autonomous driving. The company plans wafer-scale fabrication with a 300mm FabONE in Aachen, targeting pilot production by 2027 and mass production by 2031, supported by European funding and equity investors.

Company Size

51-200

Company Stage

Growth Equity (Non-Venture Capital)

Total Funding

$287.4M

Headquarters

Aachen, Germany

Founded

2020

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Simplify Jobs

Simplify's Take

What believers are saying

  • FabONE construction began March 30, 2026, keeping pilot production on track for 2027.
  • Black Semiconductor still cites €254.4 million financing and next-phase funding in June 2026.
  • Exyte, Critical Manufacturing, and AI-enabled automation strengthen fab execution and yield learning.

What critics are saying

  • Black Semiconductor depends on seven-year public disbursements; any subsidy pause cripples FabONE.
  • 2026 construction, 2027 pilot production, and 2031 mass production create a brutal cash burn.
  • Graphene photonics remains unproven at scale; one yield failure kills commercialization.

What makes Black Semiconductor unique

  • Black Semiconductor couples graphene integration with 300mm optical chip-to-chip interconnects.
  • FabONE targets the world’s first 300mm 2D-material semiconductor pilot line in Aachen.
  • Applied Nanolayers adds wafer-level graphene expertise and accelerates process development.

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Benefits

Health Insurance

Flexible Work Hours

Stock Options

Growth & Insights and Company News

Headcount

6 month growth

3%

1 year growth

3%

2 year growth

3%
BISinfotech
Dec 2nd, 2025
Black Semiconductor Partners with Critical Manufacturing for FabONE Automation

Black Semiconductor partners with Critical Manufacturing for FabONE automation. FabONE facility leverages advanced MES and ai-enabled automation for next-generation graphene-based semiconductor production. Critical Manufacturing, a leading provider of Manufacturing Operations Platforms (MOP), has been chosen by Black Semiconductor GmbH to deliver the Manufacturing Execution System (MES) and automation backbone for the company's new 300mm semiconductor wafer facility, FabONE, in Aachen. The state-of-the-art facility will scale Black Semiconductor's graphene-based chip interconnect technology into a mass-production environment, representing one of Europe's most ambitious semiconductor innovation projects. FabONE: A next-generation greenfield semiconductor fab. FabONE is a fully automated greenfield frontend fab, designed from the ground up for high-efficiency semiconductor production. Black Semiconductor conducted a competitive Request for Proposal (RfP) to select a partner capable of managing the complexities of a next-generation fab. Critical Manufacturing's proven expertise in automated frontend semiconductor facilities was a key factor in its selection. "FabONE represents a significant step for our technology enablement and for the European semiconductor ecosystem," said Samivel Krishnamoorthy, Senior Director of Fab Automation & Integration at Black Semiconductor. "Critical Manufacturing's complete MOM capabilities give us the foundation to achieve production maturity quickly, reliably, and at scale." Comprehensive MES and automation capabilities. Critical Manufacturing will provide a full suite of MES modules for FabONE, integrated with: * Equipment Integration (EI) via Connect IoT modules * Automated Material Handling System (AMHS) connectivity * ERP system integration * AI-enabled data platform for advanced analytics and decision-making Once operational, FabONE is designed to run with minimal operator intervention, enabling Black Semiconductor to validate process stability, demonstrate manufacturability, and progress toward volume production. Advancing European semiconductor innovation. For Critical Manufacturing, the FabONE project represents a major milestone in Europe. The company has extensive experience in automation frameworks for compound semiconductors and microelectronics, and FabONE showcases its readiness to support advanced 300mm frontend semiconductor manufacturing. "Graphene-based chip interconnects are a bold step for the industry," said Tom Bednarz, Managing Director at Critical Manufacturing Germany. "Turning that vision into a production-capable reality requires an MES that can keep pace with constant innovation. We are proud to support Black Semiconductor with a highly automated and adaptable platform." Driving data-driven, industry 4.0 manufacturing. The partnership highlights the growing importance of digital infrastructure in semiconductor competitiveness. By combining Critical Manufacturing's MES expertise with Black Semiconductor's cutting-edge technology, FabONE is positioned to become a cornerstone of next-generation semiconductor manufacturing in Europe, setting new standards for automation, efficiency, and scalability.

Hot Showbiz
May 12th, 2025
Black Semiconductor raises €254.4M for chips

Black Semiconductor has raised €254 million to develop graphene-based chips, providing a significant boost to the European semiconductor sector. The funding aims to support new hardware and software innovations, potentially creating new industries and niches. The European Space Agency (ESA) is also exploring new battery technologies for space missions, seeking alternatives to Russian plutonium. This development could enhance opportunities for European startups, particularly in markets like Dubai.

Hot Showbiz
May 3rd, 2025
Black Semiconductor raises €254.4M for chips

Black Semiconductor has raised €254 million for its graphene-based chips, providing a significant boost to the European semiconductor sector. The investment aims to enhance infrastructure, particularly in low-income urban and rural areas, and improve supply chains for clean industries. The initiative aligns with broader goals of promoting economic security, clean water, and environmental justice.

Black Semiconductor
Mar 28th, 2025
Press Release: Black Semiconductor acquires Applied Nanolayers

Black Semiconductor acquires material specialist Applied Nanolayers to accelerate technology development of energy-efficient, high-performance chip technology.

Black Semiconductor
Mar 28th, 2025
[Press Release] Black Semiconductor acquires material specialist Applied Nanolayers - Black Semiconductor

Black Semiconductor, a chip connectivity pioneer integrating photonics and electronics on the same wafer, has announced the acquisition of Applied Nanolayers (ANL).