Job Description

The HDD Wafer Manufacturing Engineering group focuses on ramping new designs from NPI stage to High Volume Manufacturing (HVM) with both high yields and exceptional quality. The Wafer Failure Analysis team plays a key role during the volume ramp as well as sustaining the product in high volume manufacturing.  The HDD Wafer Failure Analysis Engineer is responsible for driving root cause understanding and corrective action implementation related to in-line manufacturing failure modes.

We are looking for a self-driven and motivated team member to join the Wafer Yield and Failure Analysis group at the Great Oaks (San Jose) Wafer Manufacturing site.

Your tasks

• Identify issues impacting yield in the wafer process, quickly assess impact, establish containment, and drive to root cause understanding with corrective action implementation.
• Collaborate with cross-functional teams (process, integration, equipment, quality and operations) focusing on wafer scrap elimination and element yield impact reduction.
• Work in a fast paced environment where it is critical to balance both meeting demand and quality requirements.
• Produce Wafer paper FA reports utilizing 8D (Eight Disciplines) for problem solving

Qualifications

Qualifications

Required skills and qualifications

• Bachelor’s degree in Electrical, Mechanical, Chemical  Engineering, Materials Science, or a related field.
• Experience working in cross functional teams
• Experience in problem solving methodologies, such as DMAIC and 8D
• Strong verbal and written communication skills
• Ability to work independently and manage multiple tasks simultaneously. 

Preferred skills and qualifications

• Experience working in a highly complex manufacturing environment
• Experience in programming languages, like MatLab and/or Python
• Experience with Failure Analysis
• Experience with project management.