Full-Time

Senior Equipment Engineering Technician

Updated on 9/3/2026

GlobalFoundries

GlobalFoundries

10,001+ employees

Semiconductor foundry delivering specialized chips

Compensation Overview

$48.2k - $83.2k/yr

+ Relocation assistance + Quarterly performance bonus + Employee Stock Purchase Plan + 401(k) match

Company Does Not Provide H1B Sponsorship

Essex Junction, VT, USA

In Person

Bachelor's, Associate's

Category
General Maintenance & Repair (1)
Required Skills
Microsoft Office
Microsoft Windows
OSHA
Microsoft Outlook

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Requirements
  • Follow detailed instructions and procedures to complete tasks.
  • Perform work safely and responsibly in accordance with FAB9 Environmental, Health, Safety, and Security policies.
  • Work independently and collaboratively in a fast-paced environment.
  • Support and engage in training activities.
  • Perform preventive and corrective maintenance on equipment according to operating procedures.
  • Monitor, control, and test semiconductor equipment for manufacturing readiness.
  • Recover equipment from process interruptions, complete event documentation, and communicate end-of-shift pass-downs.
  • Use time management to prioritize and plan daily work and scheduled activities.
  • Stand for more than 85% of a 12-hour shift, excluding breaks.
  • Walk on uneven surfaces for more than 85% of a 12-hour shift.
  • Lift, pull, or carry at least 50 pounds periodically throughout the shift.
  • Lift equipment and tools during maintenance activities; equipment above 50 pounds requires a two-person lift.
  • Manually manipulate hand tools and small hardware for more than 85% of a 12-hour shift, excluding breaks.
  • Perform activities involving climbing vertical ladders, bending, stooping, kneeling, crouching, reaching, and crawling for more than 85% of a 12-hour shift, excluding breaks.
  • Use a computer for typing and visual screen time for more than 85% of a 12-hour shift, excluding breaks.
  • Work in a cleanroom environment according to semiconductor protocols and requirements.
  • Wear required cleanroom clothing for at least 10 hours per day.
  • Wear upgraded personal protective equipment, including safety shoes, safety glasses, chemical splash apron and gloves, and a full-face shield when required.
  • Remain compliant with OSHA and NIOSH 29 CFR 1910.134 clean-shaven requirements to use an N95 dust mask or other air-filtering devices, including a full-face respirator, for extended periods.
  • Have a high school degree or equivalent.
  • Have either a two-year technical degree and four years of relevant experience, two years of relevant military experience and four years of relevant experience, or six years of relevant experience in areas such as automotive repair, BOCES, HVAC, aviation, cable installation, computer routing, telecommunications, or electrical work.
  • Have basic reading and writing comprehension skills.
  • Have basic computer navigation skills, including Windows, Microsoft Office, and Outlook.
  • Stand for an extended period during a 12-hour shift.
  • Work any shift, including alternating day or night shifts.
Desired Qualifications
  • Review Statistical Process Control charts for process quality and react to out-of-control conditions, including defect troubleshooting.
  • Develop and enhance operating procedures.
  • Actively participate in continuous improvement projects, learning, and skills development.
  • Read and comprehend schematics, blueprints, and electrical diagrams.
  • Use basic hand tools and apply quality workmanship principles.
  • Apply troubleshooting and structured problem-solving techniques.
  • Understand the basic principles of electrical, mechanical, and pneumatic systems.
  • Have an associate degree in engineering technology, military equivalent, trade equivalent, or equivalent experience.
  • Have four or more years of direct experience working in semiconductor manufacturing.
  • Use project management skills to innovate and execute solutions and navigate ambiguity.
  • Have strong written and verbal communication skills.
  • Have strong planning and organizational skills.

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify Jobs

Simplify's Take

What believers are saying

  • Q2 2026 revenue reached $1.786 billion, and management raised communications growth to 50-60%.
  • Silicon photonics revenue is set to roughly double in 2026, with 2028 run-rate above $1 billion.
  • GF won $300 million CHIPS Act funding and opened its $4 billion Singapore fab in 2026.

What critics are saying

  • Smart mobile devices were 36% of Q2 2026 revenue and face low-teens decline.
  • Tower Semiconductor litigation started March 26, 2026 and can consume management, cash, and customers.
  • High-80s utilization and oversubscribed SiGe through 2027 leave little room for demand shocks.

What makes GlobalFoundries unique

  • GF owns specialty nodes for RF-SOI, silicon photonics, and silicon-germanium.
  • GF runs fabs in the U.S., Europe, and Singapore, reducing supply-chain fragility.
  • GF stopped chasing 7nm in 2018, focusing on automotive, IoT, and communications chips.

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Benefits

Professional Development Budget

Growth & Insights and Company News

Headcount

6 month growth

-2%

1 year growth

-1%

2 year growth

-1%
Omega Technology Solutions Group, Inc.
Sep 9th, 2026
Kepler Computing raises $468M to boost memory density without EUV lithography

Kepler Computing has raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures, and Bill Gates to develop memory chips that bypass expensive extreme ultraviolet lithography. The San Jose startup uses ferroelectric materials and 3D stacking to increase high-bandwidth memory and SRAM density whilst working with existing semiconductor fabs. The company claims it can convert a fab to next-generation capability in eight months versus the typical 24-month timeline. However, the technology faces contamination challenges because its composite material includes iron, requiring dedicated equipment or encapsulation. Kepler has been testing at GlobalFoundries facilities in Singapore and Vermont, producing chips on approximately 2,000 wafers. The US Department of Commerce committed up to $245 million in July to support domestic development. First HBM samples are planned for late 2025, with US production targeted for 2028.

Associated Press
Sep 2nd, 2026
GlobalFoundries and RAAAM tape out GCRAM chip, achieving 40% area shrink and 60% power reduction vs SRAM

GlobalFoundries and RAAAM Memory Technologies have announced a collaboration to develop Gain-Cell RAM (GCRAM) technology on GlobalFoundries' FDX platform. The partnership has achieved a significant milestone with the successful tape-out of a GCRAM test vehicle. The technology addresses growing on-chip memory demands for edge AI, automotive, and IoT devices. Using RAAAM's patented GCRAM, the companies achieved a 40% memory area reduction and up to 60% power savings compared to SRAM. The firms have jointly designed and taped out a GCRAM test chip. They plan to provide GCRAM design access to lead customers in early 2027. NXP Semiconductors is evaluating the solution. Victor Wang, vice president of front end innovation at NXP, noted the technology's potential for increasing on-chip memory capacities and improving system-level efficiency.

PR Newswire
Sep 2nd, 2026
QuickLogic launches enhanced eFPGA Hard IP for GlobalFoundries 12LP with 250K+ LUT scalability

QuickLogic has released an enhanced embedded FPGA Hard IP for GlobalFoundries' 12LP process. The new offering includes a DSP Multiply-and-Accumulate unit with enhanced preadder, cascade connections, and SIMD functionality for applications such as phased array radar, electronic warfare, and satellite communications. The eFPGA fabric can now scale beyond 250,000 LUTs for designs requiring larger embedded programmable logic. An optional Configuration Bit Health Monitor detects and corrects errors induced by Single Event Upsets whilst the design is active. The technology enables programmable logic to be embedded directly within SoCs, allowing hardware functions and interfaces to be updated post-manufacturing. QuickLogic showcased the enhanced IP at the GlobalFoundries Technology Summit North America in Santa Clara, California, on 2 September 2026.

Associated Press
Sep 1st, 2026
Navitas ships Gen 5 GaNFast semiconductors from US factory in GlobalFoundries partnership for AI infrastructure

Navitas Semiconductor has begun shipping its fifth-generation GaNFast gallium nitride power semiconductors manufactured in the United States through a partnership with GlobalFoundries. The first shipments from GlobalFoundries' Burlington, Vermont facility are scheduled for September, with strategic customer samples expected before year-end. The collaboration, announced in November 2025, combines Navitas' proprietary GaN technology with GlobalFoundries' 200mm manufacturing capabilities. The partnership aims to strengthen the domestic supply chain for AI infrastructure and critical national security applications. The initial product family includes 650V GaN FETs with various resistance specifications. Navitas has pioneered GaN power semiconductor innovation since 2014 and holds more than 300 issued and pending patents across GaN and silicon carbide technologies. The partnership marks a significant milestone in establishing trusted US-based production of advanced power semiconductors for AI infrastructure, high-performance computing, and industrial applications.

Crypto Briefing
Aug 27th, 2026
GlobalFoundries secures $1.5B credit facility led by JPMorgan, maturing in 2031

GlobalFoundries has secured a $1.5 billion credit facility led by JPMorgan, maturing in 2031. The semiconductor manufacturer recently prepaid approximately $664 million in outstanding term loans in early 2025. The company maintains a strong financial position with roughly $3.3 billion in cash and marketable securities against total debt of approximately $1.1 billion. Its most recent quarterly revenue exceeded $1.7 billion. The new facility expands GlobalFoundries' borrowing capacity from a previous $1 billion revolving credit arrangement. JPMorgan, which already maintains relationships with the company through equity research and structured products, now takes on a lead lending role. GlobalFoundries produces specialised semiconductors for automotive, IoT, and communications infrastructure sectors. The expanded credit line provides additional financial flexibility amid industry-wide buildout plans and shifting trade dynamics.