Full-Time

Electromechanical Engineer

Substrate

Substrate

11-50 employees

Develops advanced X-ray lithography chipmaking system

Compensation Overview

$150k - $275k/yr

No H1B Sponsorship

San Francisco, CA, USA

In Person

US work authorization required; not eligible for visa sponsorship.

Category
Electrical Engineering (1)
Required Skills
Data Analysis
Requirements
  • MS or PhD in Electrical Engineering, Mechanical Engineering, Physics, or related field
  • 7+ years of experience in semiconductor equipment development, with at least 3 years specific to electrostatic chuck technology
  • Demonstrated expertise in electrostatic principles, high-voltage systems, and materials compatibility
Responsibilities
  • Lead the design, development, and optimization of advanced electrostatic chucks for semiconductor wafer handling and processing
  • Direct a cross-functional team of engineers and collaborate with manufacturing, materials science, and quality assurance teams
  • Develop technical specifications, project plans, and design criteria for ESC systems
  • Oversee prototyping, testing, validation, and production implementation processes
  • Optimize ESC performance parameters including electrostatic force distribution, temperature uniformity, and particulate contamination control
  • Drive innovation to address industry challenges such as RF compatibility, charging/discharging speed, and lifetime reliability
  • Analyze test data and implement design improvements to meet performance and yield targets
  • Collaborate with Substrate staff to understand requirements and deliver solutions that match advanced process needs

Substrate is developing a new chipmaking system that uses X-ray lithography powered by a proprietary particle accelerator to pattern circuits on silicon wafers. The technology aims to lower lithography costs by about half and is demonstrated at U.S. National Laboratories and in its own facilities. It differentiates itself by pursuing a more vertically integrated U.S. foundry to reduce reliance on overseas fabrication and strengthen supply-chain resilience. The goal is to produce its first chips by 2028 and help bring advanced AI and robotics chips manufacturing back to the United States.

Company Size

11-50

Company Stage

Late Stage VC

Total Funding

$100M

Headquarters

San Francisco, California

Founded

2022

Simplify Jobs

Simplify's Take

What believers are saying

  • Secured $100M funding at $1B valuation from Founders Fund, General Catalyst.
  • Plans $10K wafers by 2030, halving costs versus EUV systems.
  • Met VP JD Vance in March 2025 to cut U.S. semiconductor costs.

What critics are saying

  • ASML's High-NA EUV scales to 2nm by 2028, outpacing Substrate.
  • Particle accelerators fail high-volume due to G-force instability.
  • CEO Proud's non-expertise repeats Intel's 1990s X-ray failures.

What makes Substrate unique

  • Substrate develops particle accelerator-based X-ray lithography rivaling ASML.
  • Vertically integrated U.S. foundry targets AI and robotics chip production.
  • Completed 300mm wafer tool operating at production G-forces in-house.

Help us improve and share your feedback! Did you find this helpful?

Your Connections

People at Substrate who can refer or advise you

Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Health Savings Account/Flexible Spending Account

Unlimited Paid Time Off

Flexible Work Hours

Remote Work Options

Paid Vacation

Paid Sick Leave

Paid Holidays

Hybrid Work Options

Stock Options

401(k) Retirement Plan

Wellness Program

Mental Health Support

Gym Membership

Phone/Internet Stipend

Home Office Stipend

Corporate Social Events

Company News

Financial Times
Oct 28th, 2025
Silicon Valley chip start-up raises $100mn to take on TSMC and ASML

Substrate plans to use particle accelerators to lower cost of chip manufacturing