Thermal Engineer

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!

Our Mission
We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.

Position: Thermal Engineer

As an experienced Thermal Engineer (individual contributor), you will work closely with the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, mechanical, and component suppliers. You will be responsible for conducting thermal simulations, testing, and characterization to validate and improve thermal models and solutions for high-performance computing systems.

Key Responsibilities

• Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals.
• Support thermal design of packages and systems from concept through detailed design and manufacturing readiness.
• Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements.
• Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness.
• Research thermal management materials and solutions for advanced electronics.
• Develop and maintain documentation, guidelines, and tools to support design processes and project success.
• Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.

Minimum Qualifications

• Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
• 5+ years of hands-on experience in thermal modeling within the high-tech industry.
• Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation.
• Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak).
• Understanding of electronics cooling technologies (passive and active).
• Knowledge of packaging technologies, server design, and thermal management materials.
• Proven ability to work independently and collaboratively within a cross-functional team environment.
• Strong technical documentation skills and excellent written and verbal communication.

Preferred Qualifications

• Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
• 10+ years of hands-on experience in thermal modeling within the high-tech industry.
• Understanding of OCP product designs and industry best practices.
• Engineering design and industry experience with high-end servers.
• Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak).
• Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware.
• Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development.
• Experience with CAD tools (e.g., SolidWorks, Creo).