SoC Thermal Engineer – Principal/Manager

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

General Summary:

Qualcomm is actively seeking a leader for the Design Technology (Dtech) SoC thermal analysis team.  The candidate would deliver critical thermal analysis results to product leadership to enable key product decisions, develop and drive implementation of new thermal analysis methodologies, and work to optimize thermally constrained SoC performance for Qualcomm’s mobile and compute products. The candidate will manage and technically lead the SoC thermal team in San Diego and work with other thermal teams globally to support product thermal optimization.

The candidate will engage in the following tasks:

• Support SoC design by providing thermal analysis throughout the product development cycle to identify and address thermal risks, including thermal analysis, post silicon validation and working with external customers.
• Conduct SoC level thermal analysis to support architecture and product specification studies and Power Performance Area Thermal Optimization.
• Model and recommend SoC-level floorplan, performance, and thermal control optimization.
• Develop new computational thermal methodologies and software tools, develop and implement new work processes to enable scalability and efficiency, work with cross-functional and cross-organizational teams to achieve goals.
• Act as key thermal technical expert and POC for SoC thermal optimization and analysis.

Preferred Qualifications

• Master's or PhD in Science, Engineering, or related field.
• Strong background in heat transfer and fluid mechanics simulation methods and fundamentals (CFD or FEM) through graduate level course work or industry experience.
• Strong background in computer programming for numerical simulation and scripting skills for automation.
• Experience with thermal simulation methodologies and simulation tools such as ANSYS ICEPAK
• Experience with measurement: IR camera, thermocouples
• Experience with thermal materials: Graphite sheet, thermal paste, TIM, heat pipe.
• Experience in thermal simulations at SoC, package and system levels in Mobile industry is highly desired 
• The candidate should be a good team builder with excellent people skills and used to operating in networked and virtual team environments. Natural self-starter, self-motivated, independent and resourceful problem solver. Outstanding oral and written communication skills capable of presenting persuasively to all levels of the organization in an articulate and succinct manner. Active listening ability. The candidate should be able to establish relationships to build credibility and influence at all levels of the organization in appropriate manners.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$197,800.00 - $296,600.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm.  We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).  In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.