Full-Time

Senior Director

Integration & Yield

Updated on 9/3/2026

GlobalFoundries

GlobalFoundries

10,001+ employees

Semiconductor foundry delivering specialized chips

Compensation Overview

$198k - $333k/yr

Company Does Not Provide H1B Sponsorship

Essex Junction, VT, USA

In Person

Bachelor's, Master's, PhD

Category
Engineering Management (1)
Required Skills
Metrology
Process Engineering
Data Analysis

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Requirements
  • A bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field is required.
  • At least 15 years of experience in semiconductor manufacturing or technology development is required.
  • At least 5 years of leadership experience in integration, yield, or process engineering organizations is required.
  • Demonstrate deep expertise in semiconductor process integration, device physics, and yield engineering.
  • Have strong experience with yield improvement methodologies, defect reduction, and statistical process control.
  • Have a proven track record of driving yield improvement and resolving complex manufacturing issues in a fab environment.
  • Have a strong understanding of characterization, failure analysis, and reliability methodologies.
  • Demonstrate the ability to lead cross-functional initiatives across process, equipment, and manufacturing teams.
  • Demonstrate a strong analytical and problem-solving mindset with data-driven decision making.
  • Operate effectively in a matrixed, global organization and influence across functions.
  • Have strong communication and stakeholder management skills, including experience interfacing with senior leaders and customers.
  • Demonstrate the ability to lead change and drive alignment across diverse teams.
Responsibilities
  • Lead the end-to-end integration, characterization, yield, contamination-free manufacturing, and metrology functions for the 200mm semiconductor manufacturing facility in Vermont.
  • Drive overall fab yield performance, process integration excellence, data-driven execution, and cross-functional alignment.
  • Ensure technology and manufacturing processes are integrated, optimized, and delivering against yield, reliability, and customer performance targets.
  • Interface with global engineering and product teams to enable technology transfer, product ramp, and continuous improvement.
  • Lead overall integration and yield strategy across the fab, aligning it with site performance goals and global technology improvement roadmaps.
  • Own yield performance across products and technologies, including systematic improvement plans and long-term yield roadmap development.
  • Drive cross-module integration to ensure robust process interactions and optimized end-to-end performance and cost.
  • Drive yield improvement through advanced data analytics, statistical methods, and structured problem solving.
  • Lead root cause analysis and resolution of yield excursions, defectivity issues, and reliability concerns.
  • Establish yield monitoring systems, key performance indicators, and governance to sustain performance improvements.
  • Partner with process and equipment engineering teams to resolve systemic manufacturing challenges impacting yield and quality.
  • Own process integration across all modules, ensuring alignment between process steps and successful device performance outcomes.
  • Lead electrical characterization and process characterization activities to support technology development and manufacturing stability.
  • Support new product introduction and technology transfers through integration and qualification processes.
  • Lead contamination-free manufacturing strategy and execution to ensure contamination control, defect reduction, and process integrity across the fab.
  • Oversee metrology and inspection capabilities for process monitoring, defect detection, and yield improvement.
  • Drive advancements in defect detection, inline monitoring, and process control methodologies.
  • Partner with global technology development teams on best practices, standards, and continuous improvement initiatives.
  • Support cross-fab technology transfer and yield learning cycles across the manufacturing network.
  • Interface with product engineering and customers to resolve complex technical and yield-related challenges.
  • Build and lead a high-performing organization across integration, characterization, contamination-free manufacturing, and metrology teams.
  • Develop technical depth and leadership capability through coaching, talent development, and succession planning.
  • Foster accountability, collaboration, and innovation across engineering functions.
  • Ensure compliance with Environmental, Health, Safety, and Security standards and quality and regulatory requirements.
  • Drive disciplined engineering practices, documentation, and process control frameworks across integration and yield functions.
  • Own key performance metrics related to yield, defectivity, and process capability.
Desired Qualifications
  • A master's degree or PhD is preferred.
  • Experience in 200mm semiconductor manufacturing is preferred.
  • A background in specialty technologies such as gallium nitride, radio frequency, analog, power, or automotive is preferred.
  • Experience supporting technology transfer across global fabs is preferred.

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify Jobs

Simplify's Take

What believers are saying

  • Q2 2026 revenue reached $1.786 billion, and management raised communications growth to 50-60%.
  • Silicon photonics revenue is set to roughly double in 2026, with 2028 run-rate above $1 billion.
  • GF won $300 million CHIPS Act funding and opened its $4 billion Singapore fab in 2026.

What critics are saying

  • Smart mobile devices were 36% of Q2 2026 revenue and face low-teens decline.
  • Tower Semiconductor litigation started March 26, 2026 and can consume management, cash, and customers.
  • High-80s utilization and oversubscribed SiGe through 2027 leave little room for demand shocks.

What makes GlobalFoundries unique

  • GF owns specialty nodes for RF-SOI, silicon photonics, and silicon-germanium.
  • GF runs fabs in the U.S., Europe, and Singapore, reducing supply-chain fragility.
  • GF stopped chasing 7nm in 2018, focusing on automotive, IoT, and communications chips.

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Benefits

Professional Development Budget

Growth & Insights and Company News

Headcount

6 month growth

-2%

1 year growth

-1%

2 year growth

-1%
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Kepler Computing has raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures, and Bill Gates to develop memory chips that bypass expensive extreme ultraviolet lithography. The San Jose startup uses ferroelectric materials and 3D stacking to increase high-bandwidth memory and SRAM density whilst working with existing semiconductor fabs. The company claims it can convert a fab to next-generation capability in eight months versus the typical 24-month timeline. However, the technology faces contamination challenges because its composite material includes iron, requiring dedicated equipment or encapsulation. Kepler has been testing at GlobalFoundries facilities in Singapore and Vermont, producing chips on approximately 2,000 wafers. The US Department of Commerce committed up to $245 million in July to support domestic development. First HBM samples are planned for late 2025, with US production targeted for 2028.

Associated Press
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GlobalFoundries and RAAAM Memory Technologies have announced a collaboration to develop Gain-Cell RAM (GCRAM) technology on GlobalFoundries' FDX platform. The partnership has achieved a significant milestone with the successful tape-out of a GCRAM test vehicle. The technology addresses growing on-chip memory demands for edge AI, automotive, and IoT devices. Using RAAAM's patented GCRAM, the companies achieved a 40% memory area reduction and up to 60% power savings compared to SRAM. The firms have jointly designed and taped out a GCRAM test chip. They plan to provide GCRAM design access to lead customers in early 2027. NXP Semiconductors is evaluating the solution. Victor Wang, vice president of front end innovation at NXP, noted the technology's potential for increasing on-chip memory capacities and improving system-level efficiency.

PR Newswire
Sep 2nd, 2026
QuickLogic launches enhanced eFPGA Hard IP for GlobalFoundries 12LP with 250K+ LUT scalability

QuickLogic has released an enhanced embedded FPGA Hard IP for GlobalFoundries' 12LP process. The new offering includes a DSP Multiply-and-Accumulate unit with enhanced preadder, cascade connections, and SIMD functionality for applications such as phased array radar, electronic warfare, and satellite communications. The eFPGA fabric can now scale beyond 250,000 LUTs for designs requiring larger embedded programmable logic. An optional Configuration Bit Health Monitor detects and corrects errors induced by Single Event Upsets whilst the design is active. The technology enables programmable logic to be embedded directly within SoCs, allowing hardware functions and interfaces to be updated post-manufacturing. QuickLogic showcased the enhanced IP at the GlobalFoundries Technology Summit North America in Santa Clara, California, on 2 September 2026.

Associated Press
Sep 1st, 2026
Navitas ships Gen 5 GaNFast semiconductors from US factory in GlobalFoundries partnership for AI infrastructure

Navitas Semiconductor has begun shipping its fifth-generation GaNFast gallium nitride power semiconductors manufactured in the United States through a partnership with GlobalFoundries. The first shipments from GlobalFoundries' Burlington, Vermont facility are scheduled for September, with strategic customer samples expected before year-end. The collaboration, announced in November 2025, combines Navitas' proprietary GaN technology with GlobalFoundries' 200mm manufacturing capabilities. The partnership aims to strengthen the domestic supply chain for AI infrastructure and critical national security applications. The initial product family includes 650V GaN FETs with various resistance specifications. Navitas has pioneered GaN power semiconductor innovation since 2014 and holds more than 300 issued and pending patents across GaN and silicon carbide technologies. The partnership marks a significant milestone in establishing trusted US-based production of advanced power semiconductors for AI infrastructure, high-performance computing, and industrial applications.

Crypto Briefing
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GlobalFoundries secures $1.5B credit facility led by JPMorgan, maturing in 2031

GlobalFoundries has secured a $1.5 billion credit facility led by JPMorgan, maturing in 2031. The semiconductor manufacturer recently prepaid approximately $664 million in outstanding term loans in early 2025. The company maintains a strong financial position with roughly $3.3 billion in cash and marketable securities against total debt of approximately $1.1 billion. Its most recent quarterly revenue exceeded $1.7 billion. The new facility expands GlobalFoundries' borrowing capacity from a previous $1 billion revolving credit arrangement. JPMorgan, which already maintains relationships with the company through equity research and structured products, now takes on a lead lending role. GlobalFoundries produces specialised semiconductors for automotive, IoT, and communications infrastructure sectors. The expanded credit line provides additional financial flexibility amid industry-wide buildout plans and shifting trade dynamics.