Summer 2026
AI Software Engineer Intern
Posted on 6/13/2026
Intel
10,001+ employees
Pioneers microprocessors, CPUs for PCs
Compensation Overview
$48.61 - $65.77/hr
No H1B Sponsorship
Phoenix, AZ, USA
Hybrid
 AI & Machine Learning (1) |
|---|
- This position is not eligible for employment-based visa/immigration sponsorship.
- Available to work part-time for 6-12 months and to work onsite for the duration of the internship while pursuing a degree.
- Pursuing a Bachelor of Science in the field of Computer Science, Electrical Engineering, Mathematics, Computer Engineering or Data Science with 3+ months of experience in Programming languages such as Python and C++, and experience with AI frameworks and libraries like PyTorch, TensorFlow, ONNX Runtime, and OpenVINO.
- Contributes to the design, development, and optimization of AI software solutions including algorithms, frameworks, and AI software architectures across domains such as computer vision, machine learning, and deep learning.
- Assists in implementing and tuning models for performance and accuracy.
- Engages in applied research and hardware-software integration.
- May also include the creation of AI software solutions in partnership with internal product teams and external partners as well as system-level deployment to enable scalable and efficient AI solutions.
- As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands-on experience and projects that support Intel business goals in a collaborative environment.
- Graphics experience (GPU / CUDA)
Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1999
Your Connections
People at Intel who can refer or advise you
Simplify's Take
What believers are saying
- 18A-P offers 9% higher performance or 18% lower power at equivalent workload.
- Thermal resistance improves 20% to 40%, supporting denser chips and advanced packaging.
- Kontron's Panther Lake deployment and Tesla's 14A interest validate external foundry demand.
What critics are saying
- 18A-P is only in risk production, so yield issues can delay revenue.
- Foundry losses reached $2.4 billion in Q1 2026, extending cash burn.
- Intel lacks proven external 18A-P customers, leaving the foundry pivot unvalidated.
What makes Intel unique
- Intel's 18A-P is a drop-in upgrade to 18A with full design-rule compatibility.
- Intel combines RibbonFET and PowerVia with advanced packaging leadership under Seok-Hee Lee.
- Intel is pushing edge AI and foundry wins across Panther Lake, Xeon 6+, and 14A.
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Benefits
We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.
Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.
Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.
Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.
Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.
Growth & Insights and Company News
6 month growth
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↑ 1%NVIDIA/Intel partnership could see an x86 processor paired with RTX graphics released by 2028. June 16, 2026 The FPS Review may receive a commission if you purchase something after clicking a link in this article. A new rumor states that NVIDIA and Intel could be working together to develop a new type of x86 CPU with integrated RTX graphics. At one point, the thought of this would've seem far fetched given NVIDIA's oft one -sided competitive strategies when it comes to hardware, but the PC and enterprise ecosystem has changed drastically in recent years. In addition, Intel has gone through major restructuring in an effort to regain its position as a leading chip manufacturer, which has involved a partnership with NVIDIA. That being said, this latest rumor has significant potential for being based on something truly in progress. According to Turkish YouTube tech reporter Erdi Özüağ (via VideoCardz), the two chip manufacturers are collaborating to develop an x86 processor that will incorporate RTX graphics. This could be akin to a similar partnership between NVIDIA and Mediatek, which resulted in the RTX Spark, an ARM-based processor also paired with RTX graphics that was just launched this month. Another detail that lends credence to this rumor is that NVIDIA announced last year that it was investing $5 billion into Intel as part of a collaboration agreement where the two chip manufacturers will partner to develop products for personal and enterprise/data-center solutions. "Exclusive Report: According to Intel's current roadmap, the target date for the next generation of processors with NVIDIA graphics units is the first quarter of 2028, and if plans remain unchanged, the launch event could be CES 2028." - Erdi Özüağ Per this rumor, the new package would arrive sometime in the early part of 2028 with a possible reveal at CES 2028, although the latter is somewhat doubtful since NVIDIA, at least in recent years, has steered away from announcing anything that didn't involve its AI ventures at any major electronics event. However, it could change tactics since the AI train is expected to slow down slightly by 2028, so The FPS Review might perhaps see a return to consumer product announcements then. It's also been speculated that this processor could be a part of Intel's Serpent Lake family, which has been spotted on roadmaps for that year. As a child of the 70's I was part of the many who became enthralled by the video arcade invasion of the 1980's. Saving money from various odd jobs I purchased my first computer from a friend of my dad, a used Atari 400, around 1982. Eventually it would end up being a lifelong passion of upgrading and modifying equipment that, of course, led into a career in IT support.
Intel gets a packaging bump. Intel shares jumped more than 12 per cent after Chipzilla signed the company which sounds like a sneeze Hitachi for advanced packaging work aimed at AI and data centres. Intel announced a partnership with Hitachi to co-develop and produce advanced semiconductor packaging technologies. The deal focuses on high-performance kit for data centres, artificial intelligence systems and high-end computing. Chipzilla has been under pressure from investors and customers after manufacturing delays and rising competition from TSMC and Samsung Electronics. The Hitachi deal gives it another way to talk about progress without waving another delayed node roadmap around. The two companies will work on technologies that stack multiple chips together to improve speed and cut energy use. Hitachi brings materials science and precision manufacturing experience, which Chipzilla clearly thinks it could use. The collaboration will focus on hybrid bonding and other next-generation packaging methods. These techniques allow finer connections between silicon components, boosting bandwidth between processors, memory and accelerators while reducing latency and power draw. Chipzilla has pushed advanced packaging as one of its key weapons against foundry rivals. Its EMIB and Foveros technologies already appear in products including some Xeon processors and the Ponte Vecchio data centre GPU. Working with Hitachi could speed development of more sophisticated stacking methods for future products. The Japanese industrial giant has long supplied critical materials and equipment to the global semiconductor industry. The share jump reflected investor relief after Chipzilla's market value took a kicking for three years. Shares had fallen more than 60 per cent from their 2021 peak before the announcement. The Hitachi pact is part of a wider supply-chain strategy. Chipzilla has been expanding its foundry services business to attract customers that might otherwise hand everything to TSMC. The company has broken ground on new fabs in Ohio, Arizona and Germany as it tries to rebuild manufacturing capacity in the US and Europe. Support from the CHIPS and Science Act has brought billions in grants and loans to offset the eye-watering capital costs. Hitachi sees the deal as a way to expand in advanced packaging. The company already makes specialised materials used in semiconductor assembly and has invested in thermal management and high-density interconnects. Analysts reckon the collaboration could help both companies tackle technical problems slowing progress across the sector. As transistors hit atomic-scale dimensions, raw processing gains from lithography alone are getting harder to find. Chiplet architectures have already shown their worth in graphics processors and server CPUs from AMD and Nvidia. That makes packaging less of a back-room engineering detail and more of a frontline fight. Industry observers expect initial prototypes within 12 to 18 months, followed by possible commercialisation if big customers approve. The technologies could support server processors, AI accelerators, networking chips and scientific computing systems. Chipzilla has picked up design wins for its upcoming Lunar Lake and Arrow Lake consumer processors. The Hitachi partnership gives investors another reason to believe the turnaround story is not entirely held together with tape. Jun 12, 2026
Joan Tafoya, former director at Meta, Intel & Sandia: why swarming every problem slows teams. by Jamie Flinchbaugh on 06-11-26 | / | / | / | Joan Tafoya joins Jamie Flinchbaugh on People Solve Problems for a conversation built around one deceptively simple question: how do you coach problem solving when the person in front of you is difficult to coach? Joan, a former director at Meta, Intel, and Sandia National Laboratories with nearly 38 years of experience, brings a perspective shaped by leading large, globally dispersed teams and by watching problem-solving succeed and fail at scale. Joan opens by describing her own growth as a leader. In her early years as an engineer and manager, she was focused on results and often grew frustrated when people did not solve problems the way she would have. Over time, she recognized that she could not advance until she taught others to think differently, not to think like her, but to think more deliberately about problem-solving itself. She points to a turning point while running a manufacturing line at Intel, where a constant stream of people asking for the next step left her burning out. The shift she made was to narrate her own thinking out loud so others could follow it, and to ask people what they were thinking rather than supplying every answer. That experience leads to one of the central themes of the episode. Joan is honest that her move toward coaching began partly as self-preservation, but she came to see it as something larger. She realized her team did not always share the same picture of success, and that alignment on both the problem and the desired outcome mattered as much as effort. Coaching, in her telling, became the way to build a group of trusted people who could carry the work forward and free her to take on new challenges. Joan also reflects on the challenge of coaching highly credentialed experts. At Sandia National Laboratories, she built a department focused on lean and problem-solving practices in an environment where nearly everyone held a PhD. Rather than pretending to match their technical depth, she earned credibility by listening carefully, reflecting what she heard, and asking sharper questions, especially about the knowledge gaps standing between the team and its next breakthrough. Prioritization is another area Joan explores in depth. Drawing on her time at Meta, she describes a culture that was learning to balance speed with reliability. Her first prioritization question is not whether a problem is important but whether her team is the one best suited to solve it. She warns against the instinct to swarm every visible problem, comparing it to a kindergarten soccer team chasing the ball. She also looks for quick wins that build momentum and morale without draining resources from larger work. On ideation, Joan emphasizes starting with clarity. She often opens sessions with a silent exercise in which everyone writes down the problem statement and what success would look like, which surfaces a wider range of views and avoids groupthink. She values bringing contrarians into the room, while noting that a contrarian works best when given clear expectations about how to contribute rather than simply being allowed to push back. Joan closes with advice for young engineers hoping to lead in fast-paced, demanding environments. She believes people grow most while they are struggling and pushing past what feels comfortable, and she encourages giving yourself grace during those stretches while still choosing to step into the discomfort. It is a fitting end to a conversation that treats problem-solving as something every person can learn and every leader can nurture. You can connect with Joan Tafoya on LinkedIn
Intel Panther Lake R appears in Linux patch as ruggedized Panther Lake variant. Panther Lake R appears. Intel appears to be preparing a ruggedized version of Panther Lake for industrial and embedded systems. A new Linux kernel patch posted by Intel introduces Panther Lake R. Surprisingly, this does not refer to 'Refresh,' which is a common letter Intel uses for such systems. Apparently, the patch identifies it as a derivative of Panther Lake with P-cores and low-power E-cores intended for harsh environments. Phoronix reports that the new variant uses model ID 223, while existing Panther Lake SoCs use model ID 204. The separate model ID suggests this is not just a regular Panther Lake chip with a wider operating temperature rating. The patch itself does not confirm all changes, but a new ID usually means the kernel may need to handle the silicon differently in some areas. "Derivative of Panther Lake with P-cores and low power E-cores intended for use in harsh environments." Intel already offers Series 3 for edge and embedded systems. The company says these systems support extended temperature operation, deterministic performance, and 24/7 reliability. Intel's own product page also mentions industrial-grade operating conditions from -40°C to +100°C on select SKUs. So I'm curious, what's the actual difference for Panther Lake R here, even greater temperature support, special features
Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar. Bhubaneswar: Intel CEO Lip-Bu Tan Sunday said that the Rs 2000 crore 3D Glass Solution project in Bhubaneswar is a major step toward strengthing India's semiconductor ecosystem and advancing global technology collaboration. Joining the groundbreaking ceremony of the Project on virtual mode, the Intel CEO Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth. Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the government of Odisha for their proactive support and partnership in enabling the project. Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space. Highlighting Odisha's strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing. The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India's role in the semiconductor industry. Odisha CM Majhi today laid the foundation stone for project in Info Valley, Bhubaneswar, in the presence of Union Electronics & IT Minister Aswini Vaishnaw and Odisha Electronics & IT Minister Mukesh Mahalinga. Odisha Chief Secretary Ms. Anu Garg, E & IT Additional Chief Secretary Vishal Dev, Union E & IT Additional Secretary Amitesh Sinha, and 3D Glass Solution President & CEO Babu Mandaba were also present at the event. It may be mentioned here that Intel is associated with 3D Glass Solutions for long.