Job Details:

Job Description: 

Responsibilities may be quite diverse of a nonexempt technical nature.

U.S. experience and education requirements will vary significantly depending on the unique needs of the job.

Job assignments are usually for the summer or for short periods during breaks from school.

This is an internship and compensation will be given accordingly based on the candidate’s education level and internship duration.

Components Research delivers innovative semiconductor and packaging technologies research and development.

The group focuses on unique, enabling capabilities across all aspects of Intel’s semiconductor processing and packaging roadmap.

Components Research engineers are responsible for leading programs to design, fabricate and analyze novel devices/interconnects/patterning, materials, and integration schemes across a wide variety of novel applications.

The Components Research (CR) team is looking for a passionate candidate to join us as a Circuit Design intern and work on the exploration of novel memory technology.

The final scope of the project will be determined based on intern experience and business needs.

The ideal candidate should exhibit the following behavioral traits:

• Highly motivated individual willing to deliver high-quality results on time.

• Problem-solving and analytical skills.

• Effective prioritization and time management skills.

• Stakeholder management, strong collaboration, tolerance for ambiguity, and critical thinking.

• Excellent teamwork ethics.

• Willing to work in an agile work environment with a fast-paced task flow.

• Good interpersonal skills.

This internship has a 3 month duration with the possibility to extend it as per business needs.

Qualifications:

This position is not eligible for Intel immigration sponsorship.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• Must be pursuing a Ph.D. Degree in Electrical Engineering or Physics with 1+ years of experience.

• 1+ years of experience with SRAM design and advanced VLSI systems.

• 1+ years of experience with novel memory design.

• 1+ years of experience with mixed-signal circuit design and tools like Cadence Virtuoso for schematic entry/layout and HSPICE/Spectre for simulations.

• 1+ years of experience in semiconductor physics.

• 3+ months of experience in FinFET/gate all around technology.

Preferred Qualifications:

• Knowledge of leading nonvolatile memory technologies.

• 3 months of experience with Static Timing Analysis, timing convergence.

• 3 months of experience with tape-out of high performance ICs.

• 3 months of experience with DTCO (Design Technology Co-optimization) and PPA (Power Performance Area) analysis.

• 3 months of experience with logic synthesis, place, and route tools.

• 3 months of experience with compact modeling for novel devices using Verilog-A.

• 3 months of experience with scripting languages like Python.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Intel strongly encourages employees to be vaccinated against COVID-19.  Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued.  Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Business group:

As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.