Baya Systems

Develops software-driven NoC designs for SoCs

Director of Field Applications Engineering

Pre-Sales Solution Engineering +1Confirmed live in the last 24 hours

Full-timeCambridge, UK

About the Job

Requirements

A bachelor's degree in Electrical Engineering, Computer Engineering, or a related STEM field.
At least 5 years of experience managing customer-facing engineering teams, such as Field Applications Engineering or Technical Support teams.
At least 10 years of experience in the semiconductor, silicon IP, or high-performance networking sectors.
Deep understanding of Network-on-Chip, AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools such as Synopsys, Cadence, or Siemens.
Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.
Exceptional English verbal and written communication skills.
Experience managing teams and clients across diverse cultures in Europe and Asia.
Self-motivation suited to a fast-paced, early-stage startup environment.

Responsibilities

Lead and grow a distributed team of senior Field Applications Engineers across Europe and APAC.
Recruit and onboard engineering talent in key regional hubs.
Provide ongoing technical mentorship and professional development.
Set regional goals aligned with corporate business objectives.
Develop collateral to improve efficiency and ease of customer adoption.
Partner with regional sales directors to secure high-value design wins.
Serve as the escalation point for critical customer technical issues.
Oversee customer proof-of-concepts, evaluations, and architectural reviews.
Deliver technical keynotes, deep dives, and product demonstrations to C-level executives.
Channel regional customer requirements to internal Research and Development and Product Management teams.
Use market insights to shape the fabric interconnect IP roadmap.
Create application notes, whitepapers, and training collateral for regional ecosystems.
Provide pre-sales and post-sales support.
Travel internationally up to 30–40%.

Desired Qualifications

A master's degree or PhD in Electrical Engineering or Computer Engineering.
Experience working at a fast-growing, venture-backed silicon IP startup.
Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
Additional language skills relevant to the covered regions, such as Mandarin, Japanese, Korean, or German.

Baya Systems is inspired by the baya bird, also known as the weaver. Baya birds weave very unique and intricate hanging nests from different materials. The nests are robust and safe while being extremely lightweight and efficient.

Baya is a fast-moving Series B startup built by serial entrepreneurs with a vision to accelerate intelligent computing in the emerging chiplet era. We focus on software-driven, unified fabric solutions for single-die and multi-die systems. We design and license disruptive intellectual property for use in semiconductor chips, with software development platforms to simplify the design process and reduce the time to market for complex System-on-Chip (SoC) and multi-chiplet systems. This enables our partners to innovate and deliver compelling solutions for data center, infrastructure, AI, Automotive, and Edge IoT markets. We are looking for energetic and dedicated individuals share our passion for enabling innovation and excellence in the semiconductor industry that empowers game-changing products and services!

Director, Field Applications Engineering (UK/EU/APAC)

Role Overview:

Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support.

Position: Director, Field Applications Engineering
Location: Remote (Based in the EU or the UK)
Region Coverage: Europe (EU) and Asia-Pacific (APAC)
Travel: Up to 30-40% international travel required

Key Responsibilities

Team Leadership & Development

Manage: Lead a distributed team of senior FAEs across EU and APAC.
Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
Coach: Provide continuous technical mentorship and professional development.
Align: Set clear regional goals aligned with corporate business objectives.
Grow collaterals , to enable improved efficiency / easy of adoption by the customer

Technical Account Management & Sales Support

Drive Strategy: Partner with regional sales directors to secure high-value design wins.
Own Delivery: Act as the escalations point for critical customer technical issues.
Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.

Product & Ecosystem Collaboration

Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

Required Qualifications

Experience & Education

Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.

Technical Expertise

IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.

Soft Skills & Logistics

Communication: Exceptional English verbal and written communication skills.
Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment. [1]

Preferred Qualifications

Master’s degree or PhD in Electrical or Computer Engineering.
Prior experience working in a fast-growing, venture-backed silicon IP startup.
Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).

Compensation:

Salary commensurate with experience
Performance incentives
Comprehensive medical, dental, and vision benefits
401(k) retirement plan
Equity

About the Company

Baya Systems

Develops software-driven NoC designs for SoCs

Baya Systems develops intelligent, software-driven Network on Chip (NoC) designs that optimize data movement across SoCs and chiplets. Its WeaveIP portfolio uses a unified transport fabric for coherent and non-coherent protocols, delivering high throughput with reduced silicon footprint. The NoC is customizable to any topology and can extend to custom protocols, supported by WeaverPro software for analysis, modeling, and optimization to guarantee target workloads. Their goal is to enable scalable, low-risk, cost-efficient AI accelerators, data centers, automotive, and IoT applications.

Company size: 51-200
Company stage: Series B
Total funding: $36M
Headquarters: Santa Clara, CA
Founded: 2023

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