Full-Time

Design Infrastructure Engineer

Standard and Custom Cell Characterization, High Bandwidth Memory

Updated on 7/21/2026

Micron Technology

Micron Technology

10,001+ employees

Memory and storage semiconductor manufacturer

No salary listed

Richardson, TX, USA

In Person

Category
DevOps & Infrastructure (1)
Required Skills
Python
Perl

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Requirements
  • Bachelors or Masters Degree in Electrical Engineering or a related field, along with strong fundamentals in CMOS digital and mixed-signal circuit design, device physics, and PVT variation.
  • Hands-on experience with standard or custom cell characterization flows—including Liberty modeling (CCS/ECSM or equivalent) and SPICE-based simulation—is essential.
  • A solid understanding of STA flows and timing libraries, combined with proficiency in scripting languages such as Python, Perl, or Tcl for automation, is required.
  • Experience in SiliconSmart or PrimeLib is required
Responsibilities
  • Develop and maintain scalable infrastructure for standard cell and custom cell characterization, including timing, power, noise, and signal integrity modeling.
  • Build reusable, automated flows to support multi-corner, multi-mode (MCMM) characterization across extensive PVT spaces, and enable robust Liberty model generation, validation, and regression frameworks to ensure high-quality results for downstream design and signoff flows.
  • Enable characterization across heterogeneous process technologies, including Micron internal nodes and external foundries such as TSMC. Address technology-specific challenges such as variability, layout-dependent effects, aging, and reliability, and drive consistent methodologies that allow seamless portability and standardization across multiple process nodes.
  • Support characterization requirements across diverse HBM product verticals, including core dies, multiple custom base dies, and emerging advanced HBM architectures. Collaborate closely with design teams to define characterization requirements for specialized circuit classes such as TSV interfaces, PHY-critical paths, and high-speed datapath elements, ensuring alignment with system-level performance and power targets.
  • Integrate characterization flows into broader design and verification ecosystems by partnering with design, verification, and CAD teams. Drive improvements in model accuracy, turnaround time, and silicon correlation while establishing standard processes for corner definition, quality metrics, and data consistency across IPs and programs.
  • Lead debug, validation, and continuous improvement efforts by root-causing mismatches between SPICE, extracted views, STA, and silicon behavior. Develop metrics, dashboards, and automated checks to ensure completeness, adaptability, and quality of characterization data, enabling reliable signoff and scalable deployment across future HBM programs.
Desired Qualifications
  • Experience working across multiple semiconductor process technologies is highly desirable.
  • Experience in HBM, DRAM, or high-speed interface design is preferred, particularly in environments involving advanced foundry PDKs such as TSMC nodes.
  • Familiarity with high-speed PHY design, TSV-aware design considerations, and advanced modeling topics such as signal integrity, EMIR effects, aging, and reliability will differentiate candidates.
  • Prior exposure to infrastructure or methodology development—beyond just using characterization flows—is strongly valued, as this role requires building scalable solutions rather than implementing predefined flows.
  • Good understanding of Agentic AI or willingness to learn Agentic AI to help develop efficient workflow.

Micron Technology designs and manufactures memory and storage products, including DRAM, NAND, and NOR flash. These products power devices across computing, networking, automotive, industrial, and mobile markets. The company sells to OEMs, distributors, and end users worldwide and funds ongoing research and development to meet evolving needs. Micron aims to provide scalable memory solutions and maintain an inclusive, growth‑oriented workplace for its employees.

Company Size

10,001+

Company Stage

IPO

Headquarters

Boise, Idaho

Founded

1978

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Simplify Jobs

Simplify's Take

What believers are saying

  • AI-driven demand ensures Micron will be sold out of high-bandwidth memory through calendar year 2026.
  • Wall Street projects 81% revenue growth for fiscal 2027 with earnings per share nearly doubling to around $150.
  • Market tightness is expected to persist beyond 2027 due to structural supply constraints and no new capacity before 2028.

What critics are saying

  • SK Hynix's 2027–2028 capacity expansion threatens Micron's AI dominance, triggering ASP declines and margin compression within 12–18 months.
  • Rival capacity races by Samsung and SK Hynix will likely cause oversupply by 2027–2028, collapsing ASPs and slashing gross margins.
  • US export tightening on advanced chips to China blocks Micron's growth in a key demand market, capping revenue despite the AI supercycle.

What makes Micron Technology unique

  • Micron holds 21–22% of the high-bandwidth memory market behind SK Hynix's 56–58% share.
  • The firm secured $22 billion in binding strategic customer agreements with take-or-pay terms and pricing floors.
  • Micron achieved record fiscal Q3 2026 revenue of $41.46 billion with a GAAP gross margin of 84.6%.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Disability Insurance

Parental Leave

Unlimited Paid Time Off

Paid Holidays

Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

15%

1 year growth

15%

2 year growth

15%
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Micron Technology, a global leader in memory and storage solutions, saw its stock rise following ceasefire news, though shares remain 13% below their mid-March peak of $471. The company has surged over 230% since late 2025, significantly outperforming the S&P 500 Information Technology Index. Micron recently announced its exit from the consumer-facing Crucial brand to focus on high-growth AI infrastructure, including High Bandwidth Memory and low-power server modules for large language models. The company reported record second-quarter revenue of $23.86 billion, up 196% year-over-year, beating analyst expectations of $19.19 billion. Non-GAAP diluted earnings per share reached $12.20, surpassing the $8.79 consensus. The semiconductor company's performance is driven by rising memory prices and strong demand from the AI sector.

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SiMa.ai, a physical AI company, has secured a strategic investment from Micron Technology to scale production of high-performance, power-efficient AI solutions for edge applications. The investment strengthens collaboration between the companies on integrated compute and memory architectures for robotics, autonomous systems and industrial automation. SiMa.ai's Modalix MLSoC platform integrates Micron's LPDDR5X memory to deliver superior bandwidth efficiency and power optimisation. The company offers system-on-modules featuring Micron memory that fit into existing platforms for robotics, industrial automation and autonomous vehicles. The investment expands SiMa.ai's technology partnership ecosystem, which includes Arm, Synopsys, TSMC and Wind River. San Jose-based SiMa.ai focuses on scaling physical AI across multiple sectors including automotive, aerospace and healthcare.

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