Full-Time

Lead Verification Engineer

Deadline 5/30/27
Rambus

Rambus

1,001-5,000 employees

Licenses high-speed chip-to-chip connectivity IP

No salary listed

Bengaluru, Karnataka, India

Hybrid

Hybrid schedule averages at least three days per week on-site.

Bachelor's, Master's

Category
Hardware Engineering (1)
Required Skills
Verilog
Python
Apache Subversion (SVN)
Computer Networking
Quality Assurance (QA)
Perl
Cryptography
Linux/Unix

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Requirements
  • A Bachelor of Science or Master of Science degree in electrical or computer engineering or a closely related degree is strongly preferred, although substantial, relevant work experience may substitute in some cases.
  • Eight to ten years of experience working as a verification engineer or in a related field.
  • Strong written and verbal communication skills, including the ability to explain complex concepts to a technical audience.
  • A strong desire to take ownership of all verification aspects of a project, including team and methodology leadership.
  • Exposure to block-level or system-level verification.
  • Highly technical competence demonstrated by effective verification of complex digital designs.
  • A solid understanding of standard application-specific integrated circuit verification techniques, including test planning, testbench creation, code and functional coverage, directed and SystemVerilog-based constrained-random stimulus generation, self-checking with scoreboards, predictors, or reference models, and assertions.
  • A solid understanding of verification methodologies such as Universal Verification Methodology or Open Verification Methodology and standard testbench languages.
  • Comfort working with Unix development environments, including make, scripting, and Subversion, as well as industry-standard electronic design automation tools such as VCS and Xcelium.
  • Ability to support testbench lint and rule checking, profiling, and automation using Perl or Python scripting.
  • Familiarity with advanced verification techniques such as object-oriented testbenches, fault or stimulus injection, FPGA prototyping, or formal verification.
  • Knowledge of the APB, AXI, and AXI Stream protocols; Ethernet or MACsec and IPsec; and cryptographic algorithms such as AES and SM4.
  • Experience leading multi-site teams and projects, including task and schedule estimation.
  • Excellent written, verbal, and interpersonal communication skills.
  • Ability to communicate ideas in both technical and user-friendly language.
  • Ability and willingness to work in a team-oriented, collaborative environment.
  • Ability to coordinate with internal and external teams across time zones.
  • Demonstrated ability to prioritize and execute tasks to achieve goals in an innovative, fast-paced, and high-pressure environment.
  • Proven analytical and creative problem-solving abilities.
  • Passion for writing clean, neat code that adheres to coding standards.
Responsibilities
  • Lead the design and implementation of verification methodologies, test plans, testbenches, infrastructure, and platforms to produce thoroughly verified and robust products.
  • Partner closely with architecture and design teams in specification and customer requirement reviews.
  • Represent verification methodologies in front of key customers and executive management.
  • Architect and help implement best verification practices, intellectual property development and productization, quality assurance, release automation, and improvements to existing methodologies and flows.
  • Tackle sophisticated problems and develop scalable solutions that work across platforms.
  • Assist with all hardware project phases, including bring-up, testing, debugging, coverage analysis, and tracking.
  • Help with intellectual property integration in partner environments and provide debugging assistance to customer support teams.
Desired Qualifications
  • Experience in a customer-facing role.
  • Experience developing object-oriented testbench infrastructure in Universal Verification Methodology.
  • Familiarity with intellectual property integration, intellectual property core delivery, and handoff issues.
  • Experience with data, software, or network security and cryptography.
  • Ability to work with technical writers to produce technical documentation.

Rambus designs, develops, and licenses high-speed chip-to-chip connectivity technology. Its IP powers data center servers, AI accelerators, and automotive systems, and is licensed to other semiconductor companies rather than manufactured and sold directly. The products are high-speed interfaces and security features embedded in chips, enabling fast, reliable communication between components. Rambus differentiates itself through a licensing-based model focused on advanced IP for memory, security, and high-speed interfaces across data centers, AI, and automotive markets, rather than relying on a traditional product lineup. The company’s goal is to enable high-performance chip communication at scale by monetizing its intellectual property through licensing and expanding into growing markets like data centers, AI, and automotive.

Company Size

1,001-5,000

Company Stage

IPO

Headquarters

San Jose, California

Founded

1990

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Simplify Jobs

Simplify's Take

What believers are saying

  • Q2 2026 revenue reached $207.4 million, up 20%, and Q3 guidance rose again.
  • Rambus launched PCIe 7.0 switch IP on May 5, 2026, targeting AI infrastructure.
  • A Tier-1 hyperscaler chose Rambus next-generation HBM IP, validating its licensing model.

What critics are saying

  • Rambus shares fell 19.8% after Q2 2026, signaling fragile investor confidence.
  • MRDIMM contributes minimally in Q4 2026, delaying a meaningful ramp until 2027.
  • If memory OEMs internalize interface IP, Rambus loses its licensing core.

What makes Rambus unique

  • Rambus monetizes memory and security IP without fabs, keeping margins asset-light.
  • Its DDR5 RCD, PMIC, and HBM IP spans server, AI, and automotive designs.
  • RT-648 embeds Arm-based root-of-trust security into automotive SoCs with Telechips deployment.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

401(k) Retirement Plan

401(k) Company Match

Flexible Work Hours

Hybrid Work Options

Paid Vacation

Gym Membership

Growth & Insights and Company News

Headcount

6 month growth

2%

1 year growth

2%

2 year growth

2%
Rambus
Sep 4th, 2026
TSMC OIP Ecosystem Forum North America.

TSMC OIP Ecosystem Forum North America. Event details. Rambus is excited to be participating at TSMC OIP Ecosystem Forum North America! Stop by booth #407 to chat with its experts about its solutions. Nidish Kamath, Director of Product Management, will also be presenting on LPDDR Memory. See session information below: Title: LPDDR Memory: Enabling Power-Efficient Performance in AI, Automotive and Data Center Systems Speaker: Nidish Kamath Time: 4:10pm- 4:30pm Abstract: The rapid growth of AI, edge computing, and mobile-class compute in data center, automotive, and client platforms is fundamentally changing memory subsystem requirements. While performance demands continue to increase - driven by AI inference, real-time analytics, and always-on workloads - power efficiency and form-factor constraints are becoming equally critical. Traditional high-performance memory solutions often struggle to meet aggressive power budgets, while mobile-oriented memory technologies must now scale to support higher bandwidths and more complex system architectures. LPDDR has emerged as a key enabler for these new compute paradigms, extending beyond smartphones into AI accelerators, automotive SoCs, and power-constrained data center applications. However, adopting LPDDR at scale introduces several challenges, including higher interface speeds, tighter signal integrity margins, increased controller and PHY complexity, and the need for robust power management and reliability features. Additionally, advanced process nodes exacerbate variability and noise sensitivity, requiring closer co-optimization between memory IP, silicon technology, and system design. As LPDDR continues to evolve with higher data rates, lower operating voltages, and new architectural features, designers need proven, scalable solutions that balance performance, power, and reliability while enabling faster time-to-market.

Rambus
Sep 2nd, 2026
SEMICON(R) India 2026.

SEMICON(R) India 2026. Event details. Rambus is excited to be participating in SEMICON(R) India 2026! Stop by and meet its experts to learn more about its Silicon IP solutions. Company. Products. Markets.

Yahoo Finance
Jul 30th, 2026
Rambus posts record Q2 revenue of $207M but shares fall 20% despite AI memory wins

Rambus reported second-quarter 2026 revenue of $207.39 million and net income of $67.61 million, alongside completion of a multi-year share repurchase programme totalling 14,484,994 shares for $466.93 million. The company launched DDR5 9600 chipsets and secured a next-generation HBM IP design win with a Tier-1 US hyperscaler. It guided third-quarter revenue to $210 million to $216 million and GAAP diluted EPS of $0.59 to $0.67. Despite record results, the stock fell 19.8%. Analysts remain divided on the company's prospects, with the most optimistic projecting earnings could reach $480 million, whilst others caution that supply constraints or platform delays could limit upside. The investment case hinges on continued demand for high-speed, AI-centric memory solutions offsetting concentration risks in key product lines.

Yahoo Finance
Jul 28th, 2026
Rambus hits record $207M revenue in Q2, driven by AI workloads and DDR5 adoption

Rambus Inc. reported record quarterly revenue of $207.4 million in Q2 2026, marking the first time the company surpassed the $200 million threshold. Product revenue grew 22% year-over-year, driven by leadership in DDR5 RCDs and increasing adoption across AI and traditional server environments. The company attributed growth to the shift in AI workloads toward inference and agentic use cases requiring more memory-intensive infrastructure. Management expects double-digit product revenue growth to continue in Q3, with a sequential increase of 14% at the midpoint. Rambus announced a design win with a Tier 1 US hyperscaler for next-generation HBM in future AI chips. The Silicon IP business is projected to grow 10% to 15% annually. Strategic focus for 2027 includes Gen 5 DDR5 growth and initial contributions from MRDIMM architectures.

Yahoo Finance
Jul 27th, 2026
Rambus reports record Q2 revenue of $207M, up 20% on AI infrastructure demand

Rambus reported record second-quarter fiscal 2026 revenue of $207.4 million, up 20% year-over-year and 15% sequentially, marking the first time revenue surpassed $200 million. Non-GAAP net income reached $84.4 million, or $0.77 per diluted share, growing 24% year-over-year and 21% sequentially. Product revenue hit a record $99.2 million, driven by the company's DDR5 registered clock driver business. Royalties revenue totalled $84.2 million, whilst contract and other revenue was $24 million, primarily from silicon IP. Chief executive Luc Seraphin attributed growth to AI infrastructure demand, CPU-based servers and rising memory requirements. The company introduced DDR5 9600 chipsets during the quarter and is developing new memory-module architectures including MRDIMM and LPDDR5X SOCAMM2.