Full-Time

Hardware Verification Engineer

Baya Systems

Baya Systems

51-200 employees

Software-driven NoC fabrics for SoCs

No salary listed

Austin, TX, USA

In Person

Category
Hardware Engineering (1)
Required Skills
Verilog
Python

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Requirements
  • BS, MS in Electrical Engineering, Computer Engineering or Computer Science
  • 8+ years and current hands-on experience in block-level/IP-level/SoC-level verification
  • Proficiency in Verilog, SystemVerilog
  • Familiarity with industry-standard EDA tools for simulation and debug
  • Deep experience with UVM-based testbenches
  • Experience with modern programming languages like Python
  • Knowledge of Arm Advanced Microcontroller Bus Architecture protocols such as AXI, APB, and AHB
  • Understanding of Arm Cache Coherence and interconnect protocols is implied by IPs but not explicit; (Arm CHI protocol is a plus)
  • Experience in working with IPs for caches, cache coherency, memory subsystems, interconnects, and Networks-on-Chip
  • Experience with formal verification techniques, emulation platforms is a plus
  • Excellent problem-solving skills and attention to detail
  • Strong communication and collaboration skills
Responsibilities
  • Create test plans for highly configurable IPs meant to provide interconnectivity between components across an SoC, chiplet, or multi-chiplet systems
  • Write UVM/SystemVerilog code to implement the test plan, checkers, and scoreboards
  • Collaborate with software teams to define and implement configurable testbenches
  • Work with design teams test plans, failure debug, coverage, etc.
Desired Qualifications
  • Arm CHI protocol knowledge or experience is a plus
  • Experience with formal verification techniques, emulation platforms is a plus
  • Understanding of Arm CHI protocol is a plus

Baya Systems creates intelligent, software-driven Network on Chip designs called WeaveIP that form unified fabrics for SoCs and chiplets. These NoCs use a common transport architecture to maximize efficiency, reduce power and silicon area, while preserving performance. WeaverPro analyzes and optimizes NoC behavior, enabling custom topologies, protocols, and features for AI, QoS, and debugging. The goal is to enable scalable, high-performance computing across data centers, AI, automotive, and IoT, delivering up to 4 TB/s per cluster and scalable to multi-PB/s, with a flexible, data-driven design and support for both coherent and non-coherent protocols to reduce development risk and cost.

Company Size

51-200

Company Stage

Series B

Total Funding

$36M

Headquarters

Santa Clara, California

Founded

2023

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Simplify Jobs

Simplify's Take

What believers are saying

  • Kandou AI licensed WeaveIP and WeaverPro on July 14, 2026, to overcome the AI memory wall with 448G copper connectivity.
  • Openchip adopted WeaveIP for RISC-V multi-chiplet AI systems, accelerating pre-RTL validation and cutting time-to-market.
  • Aion Silicon partnership reduces time-to-silicon for heterogeneous CPUs, GPUs, and NPUs by integrating Baya fabric with ASIC design services.

What critics are saying

  • Arm embeds unified fabric IP into ACE and CHI-E standards within 9–15 months, reducing third-party NoC demand.
  • Synopsys and Cadence bundle in-house NoC tools with design suites in 12–18 months, displacing standalone WeaverPro optimization.
  • UALink 1.0 mandates standardized die-to-die protocols favoring simplified fabrics, forcing redesigns for AI accelerator customers in 6–12 months.

What makes Baya Systems unique

  • WeaveIP uses a unified transport architecture for protocol-neutral, customizable NoC designs optimized for power and silicon footprint.
  • WeaverPro software enables pre-RTL system modeling, workload generation, and post-silicon tuning for guaranteed performance on target workloads.
  • NeuraScale delivers non-blocking, 256-port switch fabric with 1 Tb/s per port, uniquely chiplet-ready for scale-up AI systems.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

401(k) Retirement Plan

Company Equity

Performance Bonus

Growth & Insights and Company News

Headcount

6 month growth

23%

1 year growth

23%

2 year growth

40%
Business Wire
Feb 23rd, 2026
Baya Systems partners with Aion Silicon to accelerate next-gen SoC and chiplet designs

Baya Systems, a semiconductor fabric IP company, has partnered with Aion Silicon to accelerate SoC and chiplet-based system designs. The collaboration combines Baya's WeaverPro FabricStudio platform and WeaveIP fabric technology with Aion's system architecture and silicon implementation expertise. The joint solution aims to reduce development risk and accelerate time-to-silicon for AI, high-performance computing and automotive applications. Baya's software-defined fabric provides data-movement infrastructure connecting compute, memory and accelerators, whilst Aion offers design and integration services for production-ready silicon. Early adopters are reportedly benefiting from improved performance predictability and faster production pathways. The partnership addresses critical challenges in handling heterogeneous compute elements like CPUs, GPUs and NPUs whilst maintaining deterministic performance. Both companies are expanding their teams to meet growing customer demand.

Engineering.com
Nov 13th, 2025
Baya Systems opens first European office in the U.K.

Baya Systems opens first European office in the U.K. New Cambridge site expands Baya's presence and supports collaboration on next-generation semiconductor and AI system development. Baya Systems announced the opening of its first European office in the U.K. The move represents a strategic step in Baya's global growth, expanding its reach into Europe's rapidly accelerating semiconductor ecosystem and deepening partnerships in the AI, datacenter, infrastructure and high-performance computing domains. The new Cambridge office will serve as both a regional headquarters and strategic collaboration hub, enabling closer engagement with European customers, research institutions and partners building next-generation chiplet-based, AI-optimized systems. The European semiconductor market's impact on the global compute landscape continues to grow, driven by major public investments such as the EU Chips Act, the European Processor Initiative and the U.K.'s semiconductor innovation investments. Baya's new office allows the company to directly capitalize on these investments and access a highly skilled pool of talent in the U.K. to augment the nucleus of senior staff already in the region. Baya's growing footprint. The Cambridge office joins Baya's global network of design centers in Santa Clara, Austin and Bengaluru. With senior engineering and commercial staff already in place in the U.K. and plans to hire more across Europe, the office represents a new node in a globally integrated innovation fabric connecting talent and customers from North America to Europe and Asia. Baya's international workforce now also spans Canada, Japan and Israel, reflecting the company's commitment to employing top global talent to accelerate intelligent compute everywhere. Furthermore, the U.K. office will act as a strategic center for co-development with partners such as Semidynamics focusing on open, modular and scalable system architectures. These initiatives build on Baya's leadership in software-driven high-throughput, chiplet-ready fabric for AI acceleration and scale-up networking across both Arm(R) and RISC-V-based systems. Since emerging from stealth in June 2024, Baya has achieved hypergrowth driven by customer adoption of its software-defined fabric IP and system modeling solutions. Customers across the semiconductor and AI ecosystem, including Tenstorrent, have integrated Baya technologies to unlock performance-per-watt advantages, streamline design cycles and scale compute across heterogeneous architectures.

Semiconductor Engineering
Sep 24th, 2025
Speeding Time To Market With A Future-Proof Fabric

By combining Tenstorrent's proven AI system architecture with Baya Systems' WeaveIP fabrics and WeaverPro software platform, the new AI fabric is able to deliver significant improvements across all key performance metrics while also reducing the total fabric silicon footprint and power consumption.

Semiconductor Engineering
Aug 28th, 2025
Unleashing Heterogeneous Compute: Lessons From Real-World System Design

At the Andes RISC-V CON silicon valley held in san jose, california, in april 2025, Imagination Technologies and Baya Systems delivered a compelling presentation titled "unleashing heterogeneous compute: lessons from real-world system design."

Frost & Sullivan
Jul 22nd, 2025
Baya Systems Receives Frost & Sullivan's 2025 Global Semiconductor IP Interconnect Solutions Technology Innovation Leadership Recognition for Advancing Flexible, Scalable High-Performance Architectures

- July 22, 2025 - Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact.