NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing — with the GPU acting as the brains of computers, robots, and self-driving cars that can perceive and understand the world. Today, we are increasingly known as “the AI computing company.” We’re looking to grow our company and build our teams with the smartest people in the world. Join us at the forefront of technological advancement.

What you will be doing:

• Reliability (DfR) qualification and testing for various packaging including GPU/CPU, power model, memory IC, wifi module and etc.

• Work with design and operations teams to create board and system reliability test plans for various products such as GPU, Server, Automotive, Gaming, and Embedded;

• Develop and assess reliability for electrical failures related to high-speed signal, power devices and connectors;

• Develop and assess reliability for various mechanical components and latest thermal cooling technologies;

• Coordinate and conduct packaging reliability testing in internal and external laboratories;

• Work with suppliers and partners to perform reliability qualification of third party’s key components including memory, regulator, power IC and connectors;

• Model field RMA data as compared to testing data;

• Perform FEA to assist PCBA and system mechanical structural design;

• Analyze and track failure patterns of various interfaces inside packaging.

What we need to see:

• MS/Ph.D. in related fields such as physical engineering, mechanical, materials and electrical engineering (or equivalent experience)

• Minimum of 4 years working experience in reliability engineering related to electronic packaging and modules

• Knowledge using DfR and FEA tools is desired

• Strong familiarity with statistics and reliability mathematics

• Familiar with electronic packaging, reliability testing and failure analysis

• Familiar with reliability requirements for various IC packages

• Knowledge of failure analysis for electronics products and components

• Must be able to work independently with minimal supervision and drive projects to conclusion in an efficient and effective manner

• Quick thinking, good decision making and problem-solving skills

• Self-motivated, patient, desire to take challenges with good communication skills (written and oral). Ability to provide updates to senior management clearly and concisely.

Ways to stand out from the crowd:

• Track record of successful project execution in the packaging process, reliability testing and modelling.

With competitive salaries and generous benefits packages, we are widely considered to be one of the technology world’s most desirable employers; we have some of the most thoughtful and dedicated people in the world working for us and, due to unparalleled growth, our best-in-class teams are rapidly growing. If you’re creative and autonomous with a real passion for your work, we want to hear from you!

The base salary range is 128,000 USD - 201,250 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.