Foundry RF IC Technology Development Integration Engineer

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Job Description:

Senior RF IC technology pathfinder and applications support engineer supporting multiple RF IC technologies for cellular front-end module development. Part of a global team that develops RF semiconductor device (GaAs HBT, RF SOI, RF CMOS, GaN HEMT) and MMIC (power amplifiers, low-noise amplifiers, RF switches, antenna tuners) technology for the wireless communications industry. Collaborate with external foundry R&D teams on technology development roadmaps and new technology qualification. Collaborate with and supports internal design, modeling, and quality teams to define technology roadmaps, evaluation and qualification plans, and provide design applications support. Take a leading role in RF IC process technology development, providing design enablement for key RF product lines.

The successful candidate will have wide-ranging hands-on experience in RF semiconductor device fabrication and operation, IC foundry process control, MMIC process integration, new technology qualification, process design kit (PDK) development, RF circuit design and modeling, and RF test development and execution. Has experience with design of experiments, parametric/yield data analysis, and can drive new developments and existing technology improvements at external foundries. Is capable of independent project management from concept/planning phase through execution of transfer to high-volume manufacturing. Facilitates clear communication with external foundry collaborators and internal design and validation teams. Can perform risk assessment and manage technology risk mitigation activities for multiple projects in parallel. Typically possesses a graduate degree in electrical engineering and has multiple years of experience in the field. 

Key Qualifications

• Bachelor's degree and 12+ years of experience in semiconductor process technology and RF applications

• Broad knowledge of semiconductor technologies for RF/microwave applications

• Experience as technical lead for device and/or IC technology development

• Experience with device and circuit DC and RF electrical characterization techniques and equipment

• Experience with layout and circuit simulation tools (Cadence, Keysight ADS)

• Experience with device model development and validation, PDK integration

• Experience layout design rule development and validation, PDK integration

• Experience with parametric and yield data analysis. Proficiency with statistical data analysis tools

• Experience with yield failure mechanisms and tools for root cause finding (EFA, PFA)

• Familiarity with device reliability degradation mechanisms, test methods, and lifetime modeling

• Exceptional data analysis, problem solving, and interpersonal skills

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $141,300 - $226,000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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