Full-Time

Technical Program Manager

Updated on 9/3/2026

Black Semiconductor

Black Semiconductor

51-200 employees

Graphene photonics enable optical chip interconnects

No salary listed

Aachen, Germany

In Person

Bachelor's

Category
Project & Program Management (1)
Required Skills
Supply Chain Management
Product Management
Risk Management

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Requirements
  • A bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience.
  • At least 5 years of experience managing silicon, Application-Specific Integrated Circuit, intellectual property, or photonics development programs, with ownership of semiconductor product lifecycles from concept through implementation, validation, qualification, and release.
  • Experience managing complex semiconductor programs involving external intellectual property vendors, qualification providers, or test houses, ideally in chiplet, multi-die, or advanced packaging environments.
  • Ability to translate product requirements into executable technical plans, manage priorities and trade-offs, and drive execution through defined milestones, metrics, schedules, risks, and dependencies.
  • Experience leading cross-functional engineering teams and collaborating with Product Management, suppliers, manufacturing partners, and external stakeholders.
  • Hands-on experience with Application-Specific Integrated Circuit and silicon development flows, chiplet and multi-die integration, qualification processes, product lifecycle management systems, risk management, change control, supplier coordination, and program tracking tools.
  • Strong communication, problem-solving, and stakeholder management skills, with the ability to work independently and within multidisciplinary teams.
  • Results-oriented, proactive, and self-motivated, with analytical, creative, and critical thinking skills.
  • Fluency in English.
Responsibilities
  • Collaborate with cross-functional engineering teams and Product Management to set milestones, create integration plans, and address potential risks with mitigation strategies for next-generation chiplet products.
  • Develop schedules, identify critical paths and bottlenecks, and maintain execution throughout program durations.
  • Coordinate the conception, development, and delivery of Application-Specific electronic and photonic integrated circuit programs, including multi-die and chiplet integration and known-good-die qualification.
  • Own relationships with external third-party intellectual property and qualification providers by tracking deliverables against program milestones, running regular review cadences, and escalating risks before they reach the critical path.
  • Partner with Product Management to translate product requirements and priorities into an executable technical program plan and keep both sides aligned on scope or schedule trade-offs.
  • Build and maintain working relationships and communicate across multidisciplinary teams and leadership.
  • Manage chip delivery for development builds and ensure qualification to meet mass production schedules.
  • Serve as the primary point of accountability for program execution.
  • Ensure program documents are complete, up-to-date, and accessible.
  • Manage external suppliers by allocating resources, establishing review processes, and coordinating with supply chain and operations.
Desired Qualifications
  • German language skills.
  • Program Management certification.
  • Knowledge of semiconductor industry trends and disruptive technologies, including chiplet architectures and advanced packaging ecosystems.

Black Semiconductor develops chips that combine graphene-based photonics with traditional electronics to enable optical chip-to-chip communication. Its process embeds optical components into the outer layers of CMOS-like chips, allowing electrons to be converted to photons and back via graphene acting as a translator. This integration aims to overcome interconnect bottlenecks, enabling multiple chips to act as a single faster, more energy-efficient system for AI hardware, data centers, HPC, and autonomous driving. The company plans wafer-scale fabrication with a 300mm FabONE in Aachen, targeting pilot production by 2027 and mass production by 2031, supported by European funding and equity investors.

Company Size

51-200

Company Stage

Series A

Total Funding

$287.4M

Headquarters

Aachen, Germany

Founded

2020

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Simplify Jobs

Simplify's Take

What believers are saying

  • Critical Manufacturing started FabONE MES work in December 2025, signaling real construction progress.
  • RWTH Aachen honored Black Semiconductor on 5 September 2026, boosting local talent and partner credibility.
  • LinkedIn showed 141 employees in July 2026, indicating hiring momentum across process, packaging, and facilities.

What critics are saying

  • FabONE still lacks proven pilot production; one process failure delays 2027 output and 2031 volume.
  • €228.7 million public support ties survival to German and NRW budget discipline and IPCEI milestones.
  • Intel, Broadcom, and silicon-photonics incumbents can outspend Black Semiconductor before first revenues.

What makes Black Semiconductor unique

  • Black Semiconductor integrates graphene photonics and CMOS electronics on one wafer, not separate packages.
  • FabONE in Aachen targets the world’s first 300mm graphene photonic pilot fab.
  • Applied Nanolayers brought in-house graphene production, shortening its scaling path versus pure fabless rivals.

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Benefits

Health Insurance

Flexible Work Hours

Stock Options

Growth & Insights and Company News

Headcount

6 month growth

3%

1 year growth

-1%

2 year growth

4%
BISinfotech
Dec 2nd, 2025
Black Semiconductor Partners with Critical Manufacturing for FabONE Automation

Black Semiconductor partners with Critical Manufacturing for FabONE automation. FabONE facility leverages advanced MES and ai-enabled automation for next-generation graphene-based semiconductor production. Critical Manufacturing, a leading provider of Manufacturing Operations Platforms (MOP), has been chosen by Black Semiconductor GmbH to deliver the Manufacturing Execution System (MES) and automation backbone for the company's new 300mm semiconductor wafer facility, FabONE, in Aachen. The state-of-the-art facility will scale Black Semiconductor's graphene-based chip interconnect technology into a mass-production environment, representing one of Europe's most ambitious semiconductor innovation projects. FabONE: A next-generation greenfield semiconductor fab. FabONE is a fully automated greenfield frontend fab, designed from the ground up for high-efficiency semiconductor production. Black Semiconductor conducted a competitive Request for Proposal (RfP) to select a partner capable of managing the complexities of a next-generation fab. Critical Manufacturing's proven expertise in automated frontend semiconductor facilities was a key factor in its selection. "FabONE represents a significant step for our technology enablement and for the European semiconductor ecosystem," said Samivel Krishnamoorthy, Senior Director of Fab Automation & Integration at Black Semiconductor. "Critical Manufacturing's complete MOM capabilities give us the foundation to achieve production maturity quickly, reliably, and at scale." Comprehensive MES and automation capabilities. Critical Manufacturing will provide a full suite of MES modules for FabONE, integrated with: * Equipment Integration (EI) via Connect IoT modules * Automated Material Handling System (AMHS) connectivity * ERP system integration * AI-enabled data platform for advanced analytics and decision-making Once operational, FabONE is designed to run with minimal operator intervention, enabling Black Semiconductor to validate process stability, demonstrate manufacturability, and progress toward volume production. Advancing European semiconductor innovation. For Critical Manufacturing, the FabONE project represents a major milestone in Europe. The company has extensive experience in automation frameworks for compound semiconductors and microelectronics, and FabONE showcases its readiness to support advanced 300mm frontend semiconductor manufacturing. "Graphene-based chip interconnects are a bold step for the industry," said Tom Bednarz, Managing Director at Critical Manufacturing Germany. "Turning that vision into a production-capable reality requires an MES that can keep pace with constant innovation. We are proud to support Black Semiconductor with a highly automated and adaptable platform." Driving data-driven, industry 4.0 manufacturing. The partnership highlights the growing importance of digital infrastructure in semiconductor competitiveness. By combining Critical Manufacturing's MES expertise with Black Semiconductor's cutting-edge technology, FabONE is positioned to become a cornerstone of next-generation semiconductor manufacturing in Europe, setting new standards for automation, efficiency, and scalability.

Hot Showbiz
May 12th, 2025
Black Semiconductor raises €254.4M for chips

Black Semiconductor has raised €254 million to develop graphene-based chips, providing a significant boost to the European semiconductor sector. The funding aims to support new hardware and software innovations, potentially creating new industries and niches. The European Space Agency (ESA) is also exploring new battery technologies for space missions, seeking alternatives to Russian plutonium. This development could enhance opportunities for European startups, particularly in markets like Dubai.

Hot Showbiz
May 3rd, 2025
Black Semiconductor raises €254.4M for chips

Black Semiconductor has raised €254 million for its graphene-based chips, providing a significant boost to the European semiconductor sector. The investment aims to enhance infrastructure, particularly in low-income urban and rural areas, and improve supply chains for clean industries. The initiative aligns with broader goals of promoting economic security, clean water, and environmental justice.

Black Semiconductor
Mar 28th, 2025
Press Release: Black Semiconductor acquires Applied Nanolayers

Black Semiconductor acquires material specialist Applied Nanolayers to accelerate technology development of energy-efficient, high-performance chip technology.

Black Semiconductor
Mar 28th, 2025
[Press Release] Black Semiconductor acquires material specialist Applied Nanolayers - Black Semiconductor

Black Semiconductor, a chip connectivity pioneer integrating photonics and electronics on the same wafer, has announced the acquisition of Applied Nanolayers (ANL).